[go: up one dir, main page]

JP1654099S - Heat dissipation structure - Google Patents

Heat dissipation structure

Info

Publication number
JP1654099S
JP1654099S JP2019008057F JP2019008057F JP1654099S JP 1654099 S JP1654099 S JP 1654099S JP 2019008057 F JP2019008057 F JP 2019008057F JP 2019008057 F JP2019008057 F JP 2019008057F JP 1654099 S JP1654099 S JP 1654099S
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation structure
heating element
heat
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019008057F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2019008057F priority Critical patent/JP1654099S/en
Priority to US35/355,090 priority patent/USD927435S1/en
Application granted granted Critical
Publication of JP1654099S publication Critical patent/JP1654099S/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

この物品は、発熱体と冷却体との間に挟んで、発熱体の熱を冷却体に伝えて発熱体の放熱を促すための放熱構造体である。This article is a heat dissipating structure sandwiched between a heating element and a cooling element to transmit the heat of the heating element to the cooling element to promote heat dissipation from the heating element.

JP2019008057F 2019-04-12 2019-04-12 Heat dissipation structure Active JP1654099S (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019008057F JP1654099S (en) 2019-04-12 2019-04-12 Heat dissipation structure
US35/355,090 USD927435S1 (en) 2019-04-12 2019-10-10 Heat dissipating device for batteries or electric devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019008057F JP1654099S (en) 2019-04-12 2019-04-12 Heat dissipation structure

Publications (1)

Publication Number Publication Date
JP1654099S true JP1654099S (en) 2020-03-02

Family

ID=69646360

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019008057F Active JP1654099S (en) 2019-04-12 2019-04-12 Heat dissipation structure

Country Status (2)

Country Link
US (1) USD927435S1 (en)
JP (1) JP1654099S (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1021032S1 (en) * 2021-12-28 2024-04-02 Shin-Etsu Polymer Co., Ltd. Heat conducting unit

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2344280A (en) * 1942-04-11 1944-03-14 Gen Electric Lead-in arrangement
NL121811C (en) * 1961-06-26
US3163207A (en) * 1961-07-26 1964-12-29 Robert T Schultz Heat dissipating mount for electric components
NL292162A (en) * 1962-09-12
US3394387A (en) * 1966-03-08 1968-07-23 Theodore M. Williams Spark plug heat dissipator
USD260636S (en) * 1978-08-03 1981-09-08 Chrysler Corporation Housing for an electronic ignition control unit
US4246494A (en) * 1978-12-12 1981-01-20 National Electric Corporation Digital touch controlled dimmer switch
US4389469A (en) * 1980-10-10 1983-06-21 The Mettoy Company Limited Electrical power packs and charging devices
US5057648A (en) * 1989-11-20 1991-10-15 Westinghouse Electric Corp. High voltage hybrid package
USD336748S (en) * 1990-08-23 1993-06-22 John Luhrs Heat dissipating and surge protection housing for stereo equipment
US5185691A (en) * 1991-03-15 1993-02-09 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
USD341820S (en) * 1992-03-04 1993-11-30 Itoh Research & Development Laboratory Co., Ltd. Heat dissipating device for a semiconductor package
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5352958A (en) * 1992-11-19 1994-10-04 Cunningham David W Lighting control system dimmer module with plug-in electrical contacts
US5492779A (en) * 1994-10-24 1996-02-20 General Motors Corporation Heat dissipating battery
USD398295S (en) * 1996-10-08 1998-09-15 Chih Pin Chang Heat dissipating plate for computer parts
USD465462S1 (en) * 2001-07-24 2002-11-12 Hsieh Hsin-Mao Base for a heat dissipating assembly
USD471168S1 (en) * 2002-01-07 2003-03-04 Teletronics International Heat dissipating RF electronics housing
USD478055S1 (en) * 2002-08-08 2003-08-05 Hon Hai Precision Ind. Co., Ltd. Heat dissipating fin
US6870735B2 (en) * 2003-03-25 2005-03-22 Jds Uniphase Corporation Heat sink with visible logo
TWD113473S1 (en) * 2004-06-24 2006-10-21 西鐵城電子股份有限公司 Light emitting diode
US8020608B2 (en) * 2004-08-31 2011-09-20 Hewlett-Packard Development Company, L.P. Heat sink fin with stator blade
TWM312020U (en) * 2006-12-04 2007-05-11 Lighthouse Technology Co Ltd Light emitting diode package structure
TWD125792S1 (en) * 2007-10-26 2008-11-01 台達電子工業股份有限公司 Heat dissipating module
USD632266S1 (en) * 2009-09-18 2011-02-08 Delta Electronics, Inc. Heat dissipating module
USD626521S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD626520S1 (en) * 2010-03-23 2010-11-02 Comptake Technology Inc. Heat-dissipating device for memory
USD638376S1 (en) * 2010-08-06 2011-05-24 Cisco Technology, Inc. Passive cooling element
TWM421524U (en) * 2011-05-25 2012-01-21 Chyng Hong Electronic Co Ltd Panel vent mesh mounting structure for power supply
USD677636S1 (en) * 2011-11-23 2013-03-12 Zaonzi Co., Ltd. Heat-dissipating radiators for electronic apparatus
DE102011120511A1 (en) * 2011-12-07 2013-06-13 Daimler Ag Battery and cell block for a battery
USD694199S1 (en) * 2012-11-30 2013-11-26 Foxconn Technology Co., Ltd. Heat dissipating device
USD689829S1 (en) * 2013-01-02 2013-09-17 Comptake Technology Inc. Heat dissipating module of memory
USD819578S1 (en) * 2016-07-14 2018-06-05 Enermax Technology Corporation Heat dissipating fin
JP2019109968A (en) * 2017-12-15 2019-07-04 信越ポリマー株式会社 Heat dissipation structure and battery provided with the same
JP6894933B2 (en) * 2019-02-07 2021-06-30 信越ポリマー株式会社 Heat dissipation structure and battery with it

Also Published As

Publication number Publication date
USD927435S1 (en) 2021-08-10

Similar Documents

Publication Publication Date Title
EP3660101A4 (en) THERMAL CONDUCTIVE SILICONE GEL COMPOSITION, THERMAL CONDUCTIVE ELEMENT, AND HEAT DISSIPATION STRUCTURE
EP3660099A4 (en) THERMAL CONDUCTIVE SILICONE GEL COMPOSITION, THERMAL CONDUCTIVE ELEMENT, AND HEAT DISSIPATION STRUCTURE
MX2018000332A (en) Heatsink.
JP1654099S (en) Heat dissipation structure
JP1702681S (en) Heat Conduction Unit
JP1702926S (en) Heat Conduction Unit
JP1715556S (en) Water dispenser
JP1731705S (en) Neck cooling/heating device
JP1777599S (en) Neck-hanging heater
JP1731955S (en) neck-mounted cooler
IT201700023496A1 (en) Heat transfer fluids with high thermal conductivity.
JP1633467S (en) Television receiver
JP1763680S (en) Electric motor
JP1705786S (en) Semiconductor module
JP1774199S (en) Neck cooling device
JP1720049S (en) Fan
JP1750348S (en) Neck-mounted cooler/heater
JP1778673S (en) Neck Cooler
JP1753819S (en) hat with fan
CN302552884S (en) Fan (829)
TWD198117S (en) Thermal insulation cover
EP4411810A4 (en) HEAT DISSIPATION ELEMENT
EP4411809A4 (en) HEAT DISSIPATION ELEMENT
JP1715153S (en) Electric warmer
TH167308A (en) Target applied to indirect cooling devices with heat sinks.