ITUB20153500A1 - Procedimento per trasmettere potenza e dati attraverso una barriera di isolamento galvanico, sistema ed apparecchiatura corrispondenti - Google Patents
Procedimento per trasmettere potenza e dati attraverso una barriera di isolamento galvanico, sistema ed apparecchiatura corrispondentiInfo
- Publication number
- ITUB20153500A1 ITUB20153500A1 ITUB2015A003500A ITUB20153500A ITUB20153500A1 IT UB20153500 A1 ITUB20153500 A1 IT UB20153500A1 IT UB2015A003500 A ITUB2015A003500 A IT UB2015A003500A IT UB20153500 A ITUB20153500 A IT UB20153500A IT UB20153500 A1 ITUB20153500 A1 IT UB20153500A1
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- equipment
- data
- transmitting power
- insulation barrier
- Prior art date
Links
- 230000004888 barrier function Effects 0.000 title 1
- 238000009413 insulation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/02—Details
- H04L12/10—Current supply arrangements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/08—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance
- H03B5/12—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device
- H03B5/1228—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device the amplifier comprising one or more field effect transistors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/08—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance
- H03B5/12—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device
- H03B5/1206—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device using multiple transistors for amplification
- H03B5/1212—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device using multiple transistors for amplification the amplifier comprising a pair of transistors, wherein an output terminal of each being connected to an input terminal of the other, e.g. a cross coupled pair
- H03B5/1215—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device using multiple transistors for amplification the amplifier comprising a pair of transistors, wherein an output terminal of each being connected to an input terminal of the other, e.g. a cross coupled pair the current source or degeneration circuit being in common to both transistors of the pair, e.g. a cross-coupled long-tailed pair
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/08—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance
- H03B5/12—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device
- H03B5/1234—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device and comprising means for varying the output amplitude of the generator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03C—MODULATION
- H03C1/00—Amplitude modulation
- H03C1/36—Amplitude modulation by means of semiconductor device having at least three electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
- H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
- H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
- H03K17/689—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors with galvanic isolation between the control circuit and the output circuit
- H03K17/691—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors with galvanic isolation between the control circuit and the output circuit using transformer coupling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/54—Systems for transmission via power distribution lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/006—Functional aspects of oscillators
- H03B2200/0076—Power combination of several oscillators oscillating at the same frequency
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Signal Processing (AREA)
- Near-Field Transmission Systems (AREA)
- Dc Digital Transmission (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUB2015A003500A ITUB20153500A1 (it) | 2015-09-09 | 2015-09-09 | Procedimento per trasmettere potenza e dati attraverso una barriera di isolamento galvanico, sistema ed apparecchiatura corrispondenti |
US15/138,702 US10298408B2 (en) | 2015-09-09 | 2016-04-26 | Method of transmitting power and data across a galvanic isolation barrier, corresponding system and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUB2015A003500A ITUB20153500A1 (it) | 2015-09-09 | 2015-09-09 | Procedimento per trasmettere potenza e dati attraverso una barriera di isolamento galvanico, sistema ed apparecchiatura corrispondenti |
Publications (1)
Publication Number | Publication Date |
---|---|
ITUB20153500A1 true ITUB20153500A1 (it) | 2017-03-09 |
Family
ID=54542475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUB2015A003500A ITUB20153500A1 (it) | 2015-09-09 | 2015-09-09 | Procedimento per trasmettere potenza e dati attraverso una barriera di isolamento galvanico, sistema ed apparecchiatura corrispondenti |
Country Status (2)
Country | Link |
---|---|
US (1) | US10298408B2 (it) |
IT (1) | ITUB20153500A1 (it) |
Families Citing this family (11)
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US9966837B1 (en) | 2016-07-08 | 2018-05-08 | Vpt, Inc. | Power converter with circuits for providing gate driving |
JP6665825B2 (ja) * | 2017-04-13 | 2020-03-13 | 株式会社豊田中央研究所 | 送信器及びマイクロ波電力伝送システム |
CN108199821A (zh) * | 2017-09-27 | 2018-06-22 | 青岛鼎信通讯股份有限公司 | 一种带隔离供电的磁耦半双工通讯集成电路 |
EP3512087B1 (en) | 2018-01-12 | 2023-01-25 | STMicroelectronics S.r.l. | A galvanically isolated dc-dc converter circuit with data communication, corresponding system and corresponding method |
EP3514928B1 (en) | 2018-01-19 | 2021-03-03 | Hamilton Sundstrand Corporation | Gate driver |
IT201800004174A1 (it) * | 2018-04-03 | 2019-10-03 | Circuito e sistema ad isolamento galvanico, procedimento corrispondente | |
US11296552B2 (en) * | 2018-06-12 | 2022-04-05 | Nanyang Technological University | Transmitter device, wireless power transfer system, and methods of forming the same |
US11443889B2 (en) | 2019-06-24 | 2022-09-13 | Texas Instruments Incorporated | Data and power isolation barrier |
US11507042B2 (en) * | 2019-08-26 | 2022-11-22 | Rockwell Automation Asia Pacific Business Centre Pte. Ltd. | High current and power limiting circuit for I/O modules with internal output power support |
US11515839B2 (en) * | 2020-11-02 | 2022-11-29 | Texas Instruments Incorporated | Isolated power transfer via coupled oscillators |
US11670967B1 (en) * | 2022-05-09 | 2023-06-06 | Hamilton Sundstrand Corporation | Multi-environmental circuit devices |
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Also Published As
Publication number | Publication date |
---|---|
US10298408B2 (en) | 2019-05-21 |
US20170070354A1 (en) | 2017-03-09 |
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