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IT968444B - Metodo di attivazione per la plac catura non elettrica - Google Patents

Metodo di attivazione per la plac catura non elettrica

Info

Publication number
IT968444B
IT968444B IT29875/72A IT2987572A IT968444B IT 968444 B IT968444 B IT 968444B IT 29875/72 A IT29875/72 A IT 29875/72A IT 2987572 A IT2987572 A IT 2987572A IT 968444 B IT968444 B IT 968444B
Authority
IT
Italy
Prior art keywords
plac
activation method
electric catch
catch
electric
Prior art date
Application number
IT29875/72A
Other languages
English (en)
Original Assignee
Bell & Howell Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bell & Howell Co filed Critical Bell & Howell Co
Application granted granted Critical
Publication of IT968444B publication Critical patent/IT968444B/it

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT29875/72A 1971-09-30 1972-09-29 Metodo di attivazione per la plac catura non elettrica IT968444B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US185106A US3900320A (en) 1971-09-30 1971-09-30 Activation method for electroless plating

Publications (1)

Publication Number Publication Date
IT968444B true IT968444B (it) 1974-03-20

Family

ID=22679617

Family Applications (1)

Application Number Title Priority Date Filing Date
IT29875/72A IT968444B (it) 1971-09-30 1972-09-29 Metodo di attivazione per la plac catura non elettrica

Country Status (7)

Country Link
US (1) US3900320A (it)
JP (1) JPS4842928A (it)
CA (1) CA976043A (it)
DE (1) DE2245761C2 (it)
FR (1) FR2154711B1 (it)
GB (1) GB1402898A (it)
IT (1) IT968444B (it)

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DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
US4555414A (en) * 1983-04-15 1985-11-26 Polyonics Corporation Process for producing composite product having patterned metal layer
US4666735A (en) * 1983-04-15 1987-05-19 Polyonics Corporation Process for producing product having patterned metal layer
PH23907A (en) * 1983-09-28 1989-12-18 Rohm & Haas Catalytic process and systems
JPS60195077A (ja) * 1984-03-16 1985-10-03 奥野製薬工業株式会社 セラミツクスの無電解めつき用触媒組成物
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DE3760813D1 (en) * 1986-01-30 1989-11-23 Ciba Geigy Ag Polymeric compositions containing a dissolved dibenzal acetone palladium complex
US4820643A (en) * 1986-03-10 1989-04-11 International Business Machines Corporation Process for determining the activity of a palladium-tin catalyst
JPH0694592B2 (ja) * 1986-04-22 1994-11-24 日産化学工業株式会社 無電解メッキ法
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
US5075037A (en) * 1986-11-07 1991-12-24 Monsanto Company Selective catalytic activation of polymeric films
US4751276A (en) * 1986-12-24 1988-06-14 Exxon Research And Engineering Company Method for preparing functional alpha-olefin polymers and copolymers
US4734472A (en) * 1986-12-24 1988-03-29 Exxon Research And Engineering Company Method for preparing functional alpha-olefin polymers and copolymers
US5409782A (en) * 1988-05-02 1995-04-25 Orient Watch Company Composite film
BR8900933A (pt) * 1988-05-02 1990-10-09 Orient Watch Co Ltd Pelicula composta multipla,pelicula composta multipla de camadas multiplas e pelicula composta de camadas multiplas
JPH02251801A (ja) * 1989-03-24 1990-10-09 Nippon Paint Co Ltd 基板上の機能性パターンの間隙に金属メッキ層を形成する方法
US5506091A (en) * 1990-04-20 1996-04-09 Nisshinbo Industries, Inc. Photosensitive resin composition and method of forming conductive pattern
DE4015717A1 (de) * 1990-05-16 1991-11-21 Bayer Ag Formulierung zum aktivieren von substratoberflaechen fuer deren stromlose metallisierung
JP2889348B2 (ja) * 1990-06-07 1999-05-10 花王株式会社 吸収性物品
US5186984A (en) * 1990-06-28 1993-02-16 Monsanto Company Silver coatings
DE4036591A1 (de) * 1990-11-16 1992-05-21 Bayer Ag Primer zum metallisieren von substratoberflaechen
DE4107644A1 (de) * 1991-03-09 1992-09-10 Bayer Ag Hydroprimer zum metallisieren von substratoberflaechen
US5648201A (en) * 1991-04-25 1997-07-15 The United Sates Of America As Represented By The Secretary Of The Navy Efficient chemistry for selective modification and metallization of substrates
US5631753A (en) * 1991-06-28 1997-05-20 Dai Nippon Printing Co., Ltd. Black matrix base board and manufacturing method therefor, and liquid crystal display panel and manufacturing method therefor
US5458955A (en) * 1993-10-21 1995-10-17 Monsanto Company Metal/polymer laminates having an anionomeric polymer film layer
US5600692A (en) * 1993-10-29 1997-02-04 General Electric Company Method for improving tenacity and loading of palladium on palladium-doped metal surfaces
JP2731730B2 (ja) * 1993-12-22 1998-03-25 インターナショナル・ビジネス・マシーンズ・コーポレイション フォトレジストの除去方法
BE1007879A3 (fr) * 1994-01-05 1995-11-07 Blue Chips Holding Resine polymerique a viscosite ajustable pour le depot de palladium catalytique sur un substrat, son procede de preparation et son utilisation.
US5900351A (en) * 1995-01-17 1999-05-04 International Business Machines Corporation Method for stripping photoresist
US5645930A (en) * 1995-08-11 1997-07-08 The Dow Chemical Company Durable electrode coatings
TW367504B (en) * 1996-05-21 1999-08-21 Du Pont Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer
US6030708A (en) * 1996-10-28 2000-02-29 Nissha Printing Co., Ltd. Transparent shielding material for electromagnetic interference
US5895263A (en) * 1996-12-19 1999-04-20 International Business Machines Corporation Process for manufacture of integrated circuit device
US6261740B1 (en) 1997-09-02 2001-07-17 Kodak Polychrome Graphics, Llc Processless, laser imageable lithographic printing plate
US6093636A (en) * 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6333141B1 (en) 1998-07-08 2001-12-25 International Business Machines Corporation Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture
US6399666B1 (en) 1999-01-27 2002-06-04 International Business Machines Corporation Insulative matrix material
US6703186B1 (en) * 1999-08-11 2004-03-09 Mitsuboshi Belting Ltd. Method of forming a conductive pattern on a circuit board
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JP2004214657A (ja) * 2003-01-07 2004-07-29 Internatl Business Mach Corp <Ibm> プリント回路板製造用水溶性保護ペースト
GB0328221D0 (en) * 2003-12-05 2004-01-07 Conductive Inkjet Tech Ltd Formation of solid layers on substrates
US20050130397A1 (en) * 2003-10-29 2005-06-16 Bentley Philip G. Formation of layers on substrates
US8435603B2 (en) * 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
WO2006033731A2 (en) * 2004-08-16 2006-03-30 E.I. Dupont De Nemours And Company Atomic layer deposition of copper using surface-activating agents
US20060141149A1 (en) * 2004-12-29 2006-06-29 Industrial Technology Research Institute Method for forming superparamagnetic nanoparticles
WO2006132241A1 (ja) * 2005-06-09 2006-12-14 Omron Corporation 金属膜および金属配線パターンの形成方法、金属膜および金属配線パターン形成用下地組成物および金属膜
US7776394B2 (en) * 2005-08-08 2010-08-17 E.I. Du Pont De Nemours And Company Atomic layer deposition of metal-containing films using surface-activating agents
GB0619539D0 (en) * 2006-10-04 2006-11-15 Hexcel Composites Ltd Curable resin films
EP2230890A1 (en) * 2009-03-20 2010-09-22 Laird Technologies AB Method for providing a conductive material structure on a carrier
US8974869B2 (en) * 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
TWI526573B (zh) * 2011-08-17 2016-03-21 羅門哈斯電子材料有限公司 用於無電金屬化之安定催化劑
CN103031547B (zh) * 2011-08-17 2015-12-02 罗门哈斯电子材料有限公司 用于化学镀的稳定催化剂
TWI499691B (zh) * 2011-08-17 2015-09-11 羅門哈斯電子材料有限公司 用於無電金屬化之安定無錫催化劑
US20140060633A1 (en) * 2012-08-31 2014-03-06 Primestar Solar, Inc. BACK CONTACT PASTE WITH Te ENRICHMENT CONTROL IN THIN FILM PHOTOVOLTAIC DEVICES
WO2015006438A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer compressor
WO2015006403A1 (en) * 2013-07-09 2015-01-15 United Technologies Corporation Ceramic-encapsulated thermopolymer pattern or support with metallic plating
CA2917916A1 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
CA2917884A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer fan
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US3262790A (en) * 1962-08-01 1966-07-26 Engelhard Ind Inc Decorating compositions containing silver carboxylate-amine coordination compounds and method of applying same
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US3719490A (en) * 1967-07-13 1973-03-06 Eastman Kodak Co Photosensitive element containing a photoreducible palladium compound and the use thereof in physical development
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US3642476A (en) * 1970-05-21 1972-02-15 Ibm Method of preparing glass masters

Also Published As

Publication number Publication date
GB1402898A (en) 1975-08-13
DE2245761A1 (de) 1973-04-05
FR2154711A1 (it) 1973-05-11
FR2154711B1 (it) 1977-01-14
JPS4842928A (it) 1973-06-21
DE2245761C2 (de) 1982-07-29
CA976043A (en) 1975-10-14
US3900320A (en) 1975-08-19

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