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IT8125428A0 - HIGH DENSITY INTEGRATED CIRCUIT DEVICE. - Google Patents

HIGH DENSITY INTEGRATED CIRCUIT DEVICE.

Info

Publication number
IT8125428A0
IT8125428A0 IT8125428A IT2542881A IT8125428A0 IT 8125428 A0 IT8125428 A0 IT 8125428A0 IT 8125428 A IT8125428 A IT 8125428A IT 2542881 A IT2542881 A IT 2542881A IT 8125428 A0 IT8125428 A0 IT 8125428A0
Authority
IT
Italy
Prior art keywords
integrated circuit
high density
circuit device
density integrated
integrated
Prior art date
Application number
IT8125428A
Other languages
Italian (it)
Other versions
IT1139896B (en
Inventor
Jean-Pierre Henri Michel Leroy
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of IT8125428A0 publication Critical patent/IT8125428A0/en
Application granted granted Critical
Publication of IT1139896B publication Critical patent/IT1139896B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT25428/81A 1980-12-05 1981-12-03 HIGH DENSITY INTEGRATED CIRCUIT DEVICE IT1139896B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8025859A FR2495834A1 (en) 1980-12-05 1980-12-05 INTEGRATED CIRCUIT DEVICE OF HIGH DENSITY

Publications (2)

Publication Number Publication Date
IT8125428A0 true IT8125428A0 (en) 1981-12-03
IT1139896B IT1139896B (en) 1986-09-24

Family

ID=9248717

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25428/81A IT1139896B (en) 1980-12-05 1981-12-03 HIGH DENSITY INTEGRATED CIRCUIT DEVICE

Country Status (6)

Country Link
JP (1) JPS57112062A (en)
DE (1) DE3147932A1 (en)
FR (1) FR2495834A1 (en)
GB (1) GB2089120A (en)
IT (1) IT1139896B (en)
NL (1) NL8103882A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5832445A (en) * 1981-08-20 1983-02-25 Nec Corp Integrated circuit device and its manufacturing method
JPS58137229A (en) * 1982-02-09 1983-08-15 Nippon Telegr & Teleph Corp <Ntt> semiconductor equipment
JPS58139445A (en) * 1982-02-15 1983-08-18 Nec Corp Semiconductor integrated circuit device
JPS58142545A (en) * 1982-02-18 1983-08-24 Mitsubishi Electric Corp Master slice gate array type semiconductor integrated circuit device
JPS5954239A (en) * 1982-09-22 1984-03-29 Toshiba Corp Semiconductor integrated circuit device
JPS60142537A (en) * 1983-12-29 1985-07-27 Sharp Corp Method of manufacturing integrated circuit device
DE3584102D1 (en) * 1984-03-08 1991-10-24 Toshiba Kawasaki Kk INTEGRATED SEMICONDUCTOR CIRCUIT DEVICE.
JPH0650769B2 (en) * 1984-03-23 1994-06-29 日立コンピユ−タエンジニアリング株式会社 Semiconductor integrated circuit device
JPS6289341A (en) * 1985-10-15 1987-04-23 Mitsubishi Electric Corp Method for manufacturing master slice large-scale semiconductor integrated circuit device
JPS6288337A (en) * 1985-10-15 1987-04-22 Nec Corp Semiconductor integrated circuit device
JPS62261144A (en) * 1986-05-07 1987-11-13 Mitsubishi Electric Corp Semiconductor integrated circuit
JPH0817227B2 (en) * 1987-04-30 1996-02-21 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン Semiconductor chips that can be personalized
US5015600A (en) * 1990-01-25 1991-05-14 Northern Telecom Limited Method for making integrated circuits

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2212927A1 (en) * 1971-01-12 1972-10-19 Molekularelektronik Process for group integration of integrated circuits using connection technology
US3981070A (en) * 1973-04-05 1976-09-21 Amdahl Corporation LSI chip construction and method
CA1024661A (en) * 1974-06-26 1978-01-17 International Business Machines Corporation Wireable planar integrated circuit chip structure
US4207556A (en) * 1976-12-14 1980-06-10 Nippon Telegraph And Telephone Public Corporation Programmable logic array arrangement
GB1604550A (en) * 1977-05-31 1981-12-09 Fujitsu Ltd Method for forming an integrated circuit and an integrated circuit formed by the method

Also Published As

Publication number Publication date
DE3147932A1 (en) 1982-06-24
GB2089120A (en) 1982-06-16
NL8103882A (en) 1982-07-01
FR2495834A1 (en) 1982-06-11
JPS57112062A (en) 1982-07-12
IT1139896B (en) 1986-09-24

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