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IT7925034A0 - ELECTROPLATING BATH AND RELATED ELECTROPLATING PROCEDURE. - Google Patents

ELECTROPLATING BATH AND RELATED ELECTROPLATING PROCEDURE.

Info

Publication number
IT7925034A0
IT7925034A0 IT7925034A IT2503479A IT7925034A0 IT 7925034 A0 IT7925034 A0 IT 7925034A0 IT 7925034 A IT7925034 A IT 7925034A IT 2503479 A IT2503479 A IT 2503479A IT 7925034 A0 IT7925034 A0 IT 7925034A0
Authority
IT
Italy
Prior art keywords
electroplating
procedure
bath
electroplating bath
electroplating procedure
Prior art date
Application number
IT7925034A
Other languages
Italian (it)
Other versions
IT1195735B (en
Inventor
Whitlaw Keith John
Hill Ronald Thomas
Original Assignee
Lea Ronal Uk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Ronal Uk Ltd filed Critical Lea Ronal Uk Ltd
Publication of IT7925034A0 publication Critical patent/IT7925034A0/en
Application granted granted Critical
Publication of IT1195735B publication Critical patent/IT1195735B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Contacts (AREA)
IT25034/79A 1978-08-31 1979-08-09 ELECTROPLATING BATH AND RELATED ELECTROPLATING PROCEDURE IT1195735B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7835086 1978-08-31

Publications (2)

Publication Number Publication Date
IT7925034A0 true IT7925034A0 (en) 1979-08-09
IT1195735B IT1195735B (en) 1988-10-27

Family

ID=10499359

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25034/79A IT1195735B (en) 1978-08-31 1979-08-09 ELECTROPLATING BATH AND RELATED ELECTROPLATING PROCEDURE

Country Status (7)

Country Link
JP (1) JPS5937354B2 (en)
BE (1) BE878515A (en)
CH (1) CH645927A5 (en)
DE (1) DE2930035C2 (en)
FR (1) FR2434873A1 (en)
IT (1) IT1195735B (en)
NL (1) NL7906568A (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032469A1 (en) * 1980-08-28 1982-04-01 Siemens AG, 1000 Berlin und 8000 München CYANIDIC GOLD BATHS AND GALVANIC DEPOSITION OF SOLID LUBRICANT-CONTAINING GOLD DISPERSION SURFACES AND ITS APPLICATION
JPS58199791A (en) * 1982-05-18 1983-11-21 大塚化学株式会社 Refractory heat insulating sheet
JPS60238496A (en) * 1984-05-12 1985-11-27 Shinko Electric Ind Co Ltd Gold plating solution
JPS6239235A (en) * 1985-08-14 1987-02-20 松下電工株式会社 Manufacture of sound-absorbing board
JPS6239234A (en) * 1985-08-14 1987-02-20 松下電工株式会社 Sound-absorbing board and manufacture thereof
JPS6239233A (en) * 1985-08-14 1987-02-20 松下電工株式会社 Manufacture of rock wool sound-absorbing board
JP2008133533A (en) * 2006-11-01 2008-06-12 Ne Chemcat Corp Gold-silver alloy plating liquid
JP5731802B2 (en) * 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 Gold plating solution
DE102011114931B4 (en) * 2011-10-06 2013-09-05 Umicore Galvanotechnik Gmbh Process for more selective electrolytic deposition of gold or a gold alloy

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642589A (en) * 1969-09-29 1972-02-15 Fred I Nobel Gold alloy electroplating baths

Also Published As

Publication number Publication date
IT1195735B (en) 1988-10-27
BE878515A (en) 1979-12-17
JPS5534697A (en) 1980-03-11
DE2930035A1 (en) 1980-03-20
NL7906568A (en) 1980-03-04
CH645927A5 (en) 1984-10-31
FR2434873A1 (en) 1980-03-28
FR2434873B1 (en) 1984-07-27
JPS5937354B2 (en) 1984-09-08
DE2930035C2 (en) 1983-09-08

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