IT1404289B1 - Dispositivo di raffreddamento per componenti elettronici nonche' apparato di controllo incorporante tale dispositivo - Google Patents
Dispositivo di raffreddamento per componenti elettronici nonche' apparato di controllo incorporante tale dispositivoInfo
- Publication number
- IT1404289B1 IT1404289B1 ITVI2010A000349A ITVI20100349A IT1404289B1 IT 1404289 B1 IT1404289 B1 IT 1404289B1 IT VI2010A000349 A ITVI2010A000349 A IT VI2010A000349A IT VI20100349 A ITVI20100349 A IT VI20100349A IT 1404289 B1 IT1404289 B1 IT 1404289B1
- Authority
- IT
- Italy
- Prior art keywords
- well
- electronic components
- incorporating
- control device
- cooling
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITVI2010A000349A IT1404289B1 (it) | 2010-12-27 | 2010-12-27 | Dispositivo di raffreddamento per componenti elettronici nonche' apparato di controllo incorporante tale dispositivo |
US13/990,034 US20140022727A1 (en) | 2010-12-27 | 2011-12-27 | Cooling device for electronic components and control apparatus comprising the cooling device |
CN201120580046.7U CN202663701U (zh) | 2010-12-27 | 2011-12-27 | 用于冷却电子元件的设备以及发电机所用的电子控制设备 |
PCT/IB2011/055970 WO2012090157A1 (en) | 2010-12-27 | 2011-12-27 | Cooling device for electronic components and control apparatus comprising the cooling device |
EP11815594.4A EP2659509A1 (en) | 2010-12-27 | 2011-12-27 | Cooling device for electronic components and control apparatus comprising the cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITVI2010A000349A IT1404289B1 (it) | 2010-12-27 | 2010-12-27 | Dispositivo di raffreddamento per componenti elettronici nonche' apparato di controllo incorporante tale dispositivo |
Publications (2)
Publication Number | Publication Date |
---|---|
ITVI20100349A1 ITVI20100349A1 (it) | 2012-06-28 |
IT1404289B1 true IT1404289B1 (it) | 2013-11-15 |
Family
ID=43737557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITVI2010A000349A IT1404289B1 (it) | 2010-12-27 | 2010-12-27 | Dispositivo di raffreddamento per componenti elettronici nonche' apparato di controllo incorporante tale dispositivo |
Country Status (5)
Country | Link |
---|---|
US (1) | US20140022727A1 (it) |
EP (1) | EP2659509A1 (it) |
CN (1) | CN202663701U (it) |
IT (1) | IT1404289B1 (it) |
WO (1) | WO2012090157A1 (it) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105789156A (zh) * | 2016-04-22 | 2016-07-20 | 珠海格力电器股份有限公司 | 一种igbt模块组件 |
CN108738368B (zh) * | 2017-02-13 | 2022-06-17 | 新电元工业株式会社 | 电子设备 |
CN110753474B (zh) * | 2018-07-24 | 2021-09-28 | 阿里巴巴集团控股有限公司 | 冷却装置及放置在其内的待冷却装置下架的方法 |
EP4128498A4 (en) * | 2020-04-01 | 2024-09-18 | Atlas Copco (Wuxi) Compressor Co., Ltd. | INVERTER POWER SET |
CN112078228A (zh) * | 2020-09-27 | 2020-12-15 | 宜昌南玻显示器件有限公司 | 一种膜分离装置及膜分离方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2039593A (en) * | 1935-06-20 | 1936-05-05 | Theodore N Hubbuch | Heat transfer coil |
SE8003579L (sv) | 1980-05-13 | 1981-11-14 | Ericsson Telefon Ab L M | Kylanordning for diskreta eller pa kretskort monterade elektroniska komponenter |
JPS5899205A (ja) * | 1981-12-09 | 1983-06-13 | 株式会社日立製作所 | 密閉型制御盤の冷却装置 |
US4432414A (en) * | 1982-08-23 | 1984-02-21 | The United States Of America Are Represented By The United States Department Of Energy | Dual circuit embossed sheet heat transfer panel |
US5179500A (en) * | 1990-02-27 | 1993-01-12 | Grumman Aerospace Corporation | Vapor chamber cooled electronic circuit card |
US5079619A (en) * | 1990-07-13 | 1992-01-07 | Sun Microsystems, Inc. | Apparatus for cooling compact arrays of electronic circuitry |
US5894649A (en) * | 1997-08-28 | 1999-04-20 | Transpro, Inc. | Heat exchanger assembly utilizing grommets and integral cast tanks |
DE10125636B4 (de) * | 2001-05-25 | 2004-03-25 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Kühler für elektrische und/oder elektronische Bauteile |
US7408775B2 (en) * | 2004-10-19 | 2008-08-05 | Honeywell International Inc. | Electrical module and support therefor with integrated cooling |
US20060129798A1 (en) * | 2004-11-30 | 2006-06-15 | Allied Generators, Inc. | Stand-by power generator monitoring system |
JP2007294891A (ja) * | 2006-03-30 | 2007-11-08 | Dowa Metaltech Kk | 放熱器 |
US20090122637A1 (en) * | 2007-11-14 | 2009-05-14 | Jan Kruyer | Sinusoidal mixing and shearing apparatus and associated methods |
-
2010
- 2010-12-27 IT ITVI2010A000349A patent/IT1404289B1/it active
-
2011
- 2011-12-27 EP EP11815594.4A patent/EP2659509A1/en not_active Withdrawn
- 2011-12-27 US US13/990,034 patent/US20140022727A1/en not_active Abandoned
- 2011-12-27 WO PCT/IB2011/055970 patent/WO2012090157A1/en active Application Filing
- 2011-12-27 CN CN201120580046.7U patent/CN202663701U/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN202663701U (zh) | 2013-01-09 |
WO2012090157A1 (en) | 2012-07-05 |
EP2659509A1 (en) | 2013-11-06 |
ITVI20100349A1 (it) | 2012-06-28 |
US20140022727A1 (en) | 2014-01-23 |
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