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IT1302781B1 - INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND - Google Patents

INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND

Info

Publication number
IT1302781B1
IT1302781B1 IT1998UD000173A ITUD980173A IT1302781B1 IT 1302781 B1 IT1302781 B1 IT 1302781B1 IT 1998UD000173 A IT1998UD000173 A IT 1998UD000173A IT UD980173 A ITUD980173 A IT UD980173A IT 1302781 B1 IT1302781 B1 IT 1302781B1
Authority
IT
Italy
Prior art keywords
refrigeration
heating
integrated circuits
electronic measurement
control instruments
Prior art date
Application number
IT1998UD000173A
Other languages
Italian (it)
Inventor
Frank Monaco
Original Assignee
Eliwell Spa Ora Invensys Clima
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eliwell Spa Ora Invensys Clima filed Critical Eliwell Spa Ora Invensys Clima
Priority to IT1998UD000173A priority Critical patent/IT1302781B1/en
Priority to PCT/IB1999/001636 priority patent/WO2000021136A1/en
Priority to AU58795/99A priority patent/AU5879599A/en
Publication of ITUD980173A1 publication Critical patent/ITUD980173A1/en
Application granted granted Critical
Publication of IT1302781B1 publication Critical patent/IT1302781B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air Conditioning Control Device (AREA)
  • Compression-Type Refrigeration Machines With Reversible Cycles (AREA)
  • Led Device Packages (AREA)
IT1998UD000173A 1998-10-08 1998-10-08 INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND IT1302781B1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT1998UD000173A IT1302781B1 (en) 1998-10-08 1998-10-08 INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND
PCT/IB1999/001636 WO2000021136A1 (en) 1998-10-08 1999-10-06 Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies
AU58795/99A AU5879599A (en) 1998-10-08 1999-10-06 Electronic measuring and/or control instruments for refrigeration, heating and air conditioning comprising semi-conductor components achieved with high integration technologies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT1998UD000173A IT1302781B1 (en) 1998-10-08 1998-10-08 INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND

Publications (2)

Publication Number Publication Date
ITUD980173A1 ITUD980173A1 (en) 2000-04-08
IT1302781B1 true IT1302781B1 (en) 2000-09-29

Family

ID=11422758

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1998UD000173A IT1302781B1 (en) 1998-10-08 1998-10-08 INTEGRATED CIRCUITS FOR ELECTRONIC MEASUREMENT AND / OR CONTROL INSTRUMENTS FOR REFRIGERATION, HEATING AND

Country Status (3)

Country Link
AU (1) AU5879599A (en)
IT (1) IT1302781B1 (en)
WO (1) WO2000021136A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012221499A1 (en) * 2012-11-23 2014-05-28 BSH Bosch und Siemens Hausgeräte GmbH Domestic refrigerating appliance with a display means for a container lid
CN108182906B (en) * 2018-01-11 2020-03-03 青岛海信日立空调系统有限公司 Control method and device for segment code display screen on household appliance

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4000437A (en) * 1975-12-17 1976-12-28 Integrated Display Systems Incorporated Electric display device
JPS61229374A (en) * 1985-04-03 1986-10-13 Toshiba Corp Semiconductor light emitting display device
DE3941679A1 (en) * 1989-12-18 1991-06-27 Telefunken Electronic Gmbh PHOTO MODULE
US5007190A (en) * 1990-05-11 1991-04-16 Shyu Chih Yes Solar house-number indicating device
DE19625756A1 (en) * 1996-06-27 1998-01-02 Bosch Gmbh Robert Module for an electrical device
US5673850A (en) * 1996-07-22 1997-10-07 Lux Products Corporation Programmable thermostat with rotary dial program setting

Also Published As

Publication number Publication date
AU5879599A (en) 2000-04-26
ITUD980173A1 (en) 2000-04-08
WO2000021136A1 (en) 2000-04-13

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Legal Events

Date Code Title Description
0001 Granted