IT1235641B - Perfezionamenti in, o relativi a strutture ibride - Google Patents
Perfezionamenti in, o relativi a strutture ibrideInfo
- Publication number
- IT1235641B IT1235641B IT8720854A IT2085487A IT1235641B IT 1235641 B IT1235641 B IT 1235641B IT 8720854 A IT8720854 A IT 8720854A IT 2085487 A IT2085487 A IT 2085487A IT 1235641 B IT1235641 B IT 1235641B
- Authority
- IT
- Italy
- Prior art keywords
- hybrid structures
- hybrid
- structures
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8522066A GB2252452B (en) | 1985-09-05 | 1985-09-05 | Improvements in or relating to hybrid structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1235641B true IT1235641B (it) | 1992-09-14 |
Family
ID=10584774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8720854A IT1235641B (it) | 1985-09-05 | 1987-06-10 | Perfezionamenti in, o relativi a strutture ibride |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5185613A (it) |
| DE (1) | DE3644874A1 (it) |
| GB (1) | GB2252452B (it) |
| IT (1) | IT1235641B (it) |
| NL (1) | NL8615004A (it) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8822011D0 (en) * | 1988-09-20 | 2009-04-29 | Qinetiq Ltd | Radiation Filed Sensor |
| US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
| US5383512A (en) * | 1993-01-27 | 1995-01-24 | Midwest Research Institute | Method for fabricating a substrate having spaced apart microcapillaries thereon |
| DE4335232A1 (de) * | 1993-10-15 | 1995-04-20 | Daimler Benz Ag | Anordnung zur Abstrahlung von Millimeterwellen |
| US5436453A (en) * | 1993-10-15 | 1995-07-25 | Lockheed Sanders, Inc. | Dual mode energy detector having monolithic integrated circuit construction |
| US5455589A (en) * | 1994-01-07 | 1995-10-03 | Millitech Corporation | Compact microwave and millimeter wave radar |
| DE4409747A1 (de) * | 1994-03-22 | 1995-09-28 | Daimler Benz Ag | Antennenarray |
| JP3141692B2 (ja) * | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | ミリ波用検波器 |
| US6008771A (en) * | 1995-01-09 | 1999-12-28 | Murata Manufacturing Co., Ltd. | Antenna with nonradiative dielectric waveguide |
| DE69621081T2 (de) * | 1995-07-17 | 2002-12-12 | Dynex Semiconductor Ltd., Lincoln | Antennenanordnungen |
| US5781163A (en) * | 1995-08-28 | 1998-07-14 | Datron/Transco, Inc. | Low profile hemispherical lens antenna array on a ground plane |
| JP3257383B2 (ja) * | 1996-01-18 | 2002-02-18 | 株式会社村田製作所 | 誘電体レンズ装置 |
| JP3055456B2 (ja) * | 1996-02-21 | 2000-06-26 | 株式会社村田製作所 | アンテナ装置 |
| WO1998035403A1 (de) * | 1997-02-06 | 1998-08-13 | Robert Bosch Gmbh | Mikrowellen-antennenanordnung für ein kraftfahrzeug-radarsystem |
| JP3310617B2 (ja) * | 1998-05-29 | 2002-08-05 | シャープ株式会社 | 樹脂封止型半導体装置及びその製造方法 |
| US6232931B1 (en) | 1999-02-19 | 2001-05-15 | The United States Of America As Represented By The Secretary Of The Navy | Opto-electronically controlled frequency selective surface |
| SE514076C2 (sv) * | 1999-04-23 | 2000-12-18 | Ericsson Telefon Ab L M | Förfarande och anordning relaterade till mikrovågslins |
| US6563464B2 (en) * | 2001-03-19 | 2003-05-13 | International Business Machines Corporation | Integrated on-chip half-wave dipole antenna structure |
| US7369090B1 (en) * | 2001-05-17 | 2008-05-06 | Cypress Semiconductor Corp. | Ball Grid Array package having integrated antenna pad |
| US6914566B2 (en) * | 2001-05-17 | 2005-07-05 | Cypress Semiconductor Corp. | Ball grid array antenna |
| US7117588B2 (en) * | 2002-04-23 | 2006-10-10 | Ge Medical Systems Global Technology Company, Llc | Method for assembling tiled detectors for ionizing radiation based image detection |
| US6624792B1 (en) | 2002-05-16 | 2003-09-23 | Titan Systems, Corporation | Quad-ridged feed horn with two coplanar probes |
| US7180456B2 (en) * | 2004-01-16 | 2007-02-20 | Texas Instruments Incorporated | Antennas supporting high density of wireless users in specific directions |
| US20100101639A1 (en) * | 2008-10-24 | 2010-04-29 | Epistar Corporation | Optoelectronic device having a multi-layer solder and manufacturing method thereof |
| US8502735B1 (en) | 2009-11-18 | 2013-08-06 | Ball Aerospace & Technologies Corp. | Antenna system with integrated circuit package integrated radiators |
| RU2586023C2 (ru) * | 2011-05-23 | 2016-06-10 | Общество с ограниченной ответственностью "Радио Гигабит" | Антенное устройство с электронным сканированием луча |
| RU2585309C2 (ru) | 2011-10-20 | 2016-05-27 | Общество с ограниченной ответственностью "Радио Гигабит" | Система и способ радиорелейной связи с электронной подстройкой луча |
| RU2530330C1 (ru) | 2013-03-22 | 2014-10-10 | Общество с ограниченной ответственностью "Радио Гигабит" | Станция радиорелейной связи со сканирующей антенной |
| JP6298715B2 (ja) * | 2014-05-30 | 2018-03-20 | 日立オートモティブシステムズ株式会社 | アンテナ装置およびそれを用いた速度センサ |
| CN110121656A (zh) * | 2016-12-23 | 2019-08-13 | Iee国际电子工程股份公司 | 高分辨率3d雷达波成像设备 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1336618C (en) * | 1981-03-11 | 1995-08-08 | Huw David Rees | Electromagnetic radiation sensors |
| DE3402659A1 (de) * | 1984-01-26 | 1985-08-01 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Reflektorantenne fuer den betrieb in mehreren frequenzbereichen |
-
1985
- 1985-09-05 GB GB8522066A patent/GB2252452B/en not_active Expired - Lifetime
-
1986
- 1986-09-01 NL NL8615004A patent/NL8615004A/nl not_active Application Discontinuation
- 1986-09-01 DE DE19863644874 patent/DE3644874A1/de not_active Withdrawn
- 1986-09-08 US US06/911,017 patent/US5185613A/en not_active Expired - Fee Related
-
1987
- 1987-06-10 IT IT8720854A patent/IT1235641B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| NL8615004A (nl) | 1992-10-01 |
| GB2252452B (en) | 1992-12-16 |
| DE3644874A1 (de) | 1992-11-12 |
| GB2252452A (en) | 1992-08-05 |
| US5185613A (en) | 1993-02-09 |
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