IT1228515B - AROMATIC POLYAMIDE RESINS HEAT RESISTANT AND PHOTOSENSITIVE AND METHOD FOR THEIR PREPARATION - Google Patents
AROMATIC POLYAMIDE RESINS HEAT RESISTANT AND PHOTOSENSITIVE AND METHOD FOR THEIR PREPARATIONInfo
- Publication number
- IT1228515B IT1228515B IT8919593A IT1959389A IT1228515B IT 1228515 B IT1228515 B IT 1228515B IT 8919593 A IT8919593 A IT 8919593A IT 1959389 A IT1959389 A IT 1959389A IT 1228515 B IT1228515 B IT 1228515B
- Authority
- IT
- Italy
- Prior art keywords
- photosensitive
- preparation
- heat resistant
- aromatic polyamide
- polyamide resins
- Prior art date
Links
- 239000004760 aramid Substances 0.000 title 1
- 229920003235 aromatic polyamide Polymers 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/32—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from aromatic diamines and aromatic dicarboxylic acids with both amino and carboxylic groups aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/48—Polymers modified by chemical after-treatment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polyamides (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63048726A JP2542033B2 (en) | 1988-03-03 | 1988-03-03 | Aromatic polyamide resin and heat-resistant photosensitive material using the same |
| JP63104858A JP2542041B2 (en) | 1988-04-27 | 1988-04-27 | Aromatic polyamide resin, method for producing the same, and heat-resistant photosensitive material using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8919593A0 IT8919593A0 (en) | 1989-02-28 |
| IT1228515B true IT1228515B (en) | 1991-06-20 |
Family
ID=26389033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT8919593A IT1228515B (en) | 1988-03-03 | 1989-02-28 | AROMATIC POLYAMIDE RESINS HEAT RESISTANT AND PHOTOSENSITIVE AND METHOD FOR THEIR PREPARATION |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE3906684A1 (en) |
| FR (1) | FR2628112B1 (en) |
| GB (1) | GB2216532B (en) |
| IT (1) | IT1228515B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5114826A (en) * | 1989-12-28 | 1992-05-19 | Ibm Corporation | Photosensitive polyimide compositions |
| DE59010552D1 (en) * | 1990-03-29 | 1996-12-05 | Siemens Ag | Highly heat-resistant negative resists and process for producing highly heat-resistant relief structures |
| EP0512339B1 (en) * | 1991-05-07 | 1997-10-15 | Siemens Aktiengesellschaft | High temperature stable positive resists and process for the production of high temperature stable relief structure |
| DE4206948A1 (en) * | 1992-03-05 | 1993-09-09 | Basf Ag | MOLDS BASED ON HOMO- AND COPOLYAMIDES CONTAINING OLEFINIC DOUBLE BINDINGS |
| DE4206949A1 (en) * | 1992-03-05 | 1993-09-09 | Basf Ag | MOLDING DIMENSIONS BASED ON UNSATURATED COPOLYAMIDES |
| KR100805134B1 (en) * | 2001-07-03 | 2008-02-21 | 히다찌 가세이 고오교 가부시끼가이샤 | Photosensitive resin composition, pattern manufacturing method and electronic component using same |
| CN116768750B (en) * | 2023-06-19 | 2025-05-30 | 兰州大学 | Diphenol monomer containing photo-curable cinnamate group, preparation method of diphenol monomer, photosensitive polyaryletherketone, preparation method of photosensitive polyaryletherketone and application of photosensitive polyaryletherketone |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3066117A (en) * | 1957-02-08 | 1962-11-27 | Bayer Ag | Light-sensitive water soluble compounds |
| DE2967162D1 (en) * | 1978-09-29 | 1984-09-13 | Hitachi Ltd | Light-sensitive polymer composition |
| DE2933828A1 (en) * | 1979-08-21 | 1981-03-12 | Siemens AG, 1000 Berlin und 8000 München | POLYOXAZOLE PREPARATIONS AND THEIR PRODUCTION. |
| JPS60180197A (en) * | 1984-02-27 | 1985-09-13 | 宇部興産株式会社 | Method for manufacturing multilayer printed wiring board |
| GB2188936B (en) * | 1986-03-06 | 1988-12-21 | Central Glass Co Ltd | Aromatic polyamides and polybenoxazoles having diphenylhexafluoropropane units |
-
1989
- 1989-02-28 IT IT8919593A patent/IT1228515B/en active
- 1989-03-02 GB GB8904786A patent/GB2216532B/en not_active Expired - Fee Related
- 1989-03-02 FR FR8902716A patent/FR2628112B1/en not_active Expired - Fee Related
- 1989-03-02 DE DE3906684A patent/DE3906684A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| IT8919593A0 (en) | 1989-02-28 |
| FR2628112B1 (en) | 1992-11-13 |
| GB2216532A (en) | 1989-10-11 |
| FR2628112A1 (en) | 1989-09-08 |
| DE3906684A1 (en) | 1989-09-21 |
| GB2216532B (en) | 1991-07-24 |
| GB8904786D0 (en) | 1989-04-12 |
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