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IT1156238B - Perfezionamento nelle confezioni per dispositivi a semiconduttore ad alta corrente - Google Patents

Perfezionamento nelle confezioni per dispositivi a semiconduttore ad alta corrente

Info

Publication number
IT1156238B
IT1156238B IT47859/82A IT4785982A IT1156238B IT 1156238 B IT1156238 B IT 1156238B IT 47859/82 A IT47859/82 A IT 47859/82A IT 4785982 A IT4785982 A IT 4785982A IT 1156238 B IT1156238 B IT 1156238B
Authority
IT
Italy
Prior art keywords
packages
improvement
semiconductor devices
high current
current semiconductor
Prior art date
Application number
IT47859/82A
Other languages
English (en)
Italian (it)
Other versions
IT8247859A0 (it
Inventor
Jerry M Dubois
Keith G Spanjer
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of IT8247859A0 publication Critical patent/IT8247859A0/it
Application granted granted Critical
Publication of IT1156238B publication Critical patent/IT1156238B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for individual devices of subclass H10D
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT47859/82A 1981-02-27 1982-02-24 Perfezionamento nelle confezioni per dispositivi a semiconduttore ad alta corrente IT1156238B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23879981A 1981-02-27 1981-02-27

Publications (2)

Publication Number Publication Date
IT8247859A0 IT8247859A0 (it) 1982-02-24
IT1156238B true IT1156238B (it) 1987-01-28

Family

ID=22899344

Family Applications (1)

Application Number Title Priority Date Filing Date
IT47859/82A IT1156238B (it) 1981-02-27 1982-02-24 Perfezionamento nelle confezioni per dispositivi a semiconduttore ad alta corrente

Country Status (5)

Country Link
EP (1) EP0076802A4 (es)
JP (1) JPS58500187A (es)
IT (1) IT1156238B (es)
MX (1) MX150708A (es)
WO (1) WO1982002980A1 (es)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8400122A (pt) * 1983-01-12 1984-08-21 Allen Bradley Co Modulo semicondutor e embalagem de semicondutor aperfeicoada
JPS59172759A (ja) * 1983-03-22 1984-09-29 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタモジユ−ル
FR2553231B1 (fr) * 1983-10-10 1988-07-08 Thomson Csf Commutateur double pour onduleurs, encapsule en boitier a broches exterieures planes
IT1222152B (it) * 1987-07-28 1990-09-05 Sgs Microelettronica Spa Dispositivo a piu' piastrine di materiale in contenitore di metallo e resina
WO1994005040A1 (en) * 1992-08-24 1994-03-03 Iversen Arthur H Power semiconductor packaging
DE4446566A1 (de) * 1994-12-24 1996-06-27 Telefunken Microelectron Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
JPS5271625A (en) * 1975-12-10 1977-06-15 Semikron Gleichrichterbau Semiconductor rectifier device
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
US4394530A (en) * 1977-09-19 1983-07-19 Kaufman Lance R Power switching device having improved heat dissipation means
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
DE2819327C2 (de) * 1978-05-03 1984-10-31 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterbaueinheit
JPS5550650A (en) * 1978-10-06 1980-04-12 Mitsubishi Electric Corp Semiconductor device
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package

Also Published As

Publication number Publication date
WO1982002980A1 (en) 1982-09-02
IT8247859A0 (it) 1982-02-24
MX150708A (es) 1984-06-29
JPS58500187A (ja) 1983-02-03
EP0076802A4 (en) 1984-12-11
EP0076802A1 (en) 1983-04-20

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