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IT1137472B - Dispositivo di raffreddamento per componenti elettronici e/o per pannelli di circuiti sui quali i componenti sono motati - Google Patents

Dispositivo di raffreddamento per componenti elettronici e/o per pannelli di circuiti sui quali i componenti sono motati

Info

Publication number
IT1137472B
IT1137472B IT21675/81A IT2167581A IT1137472B IT 1137472 B IT1137472 B IT 1137472B IT 21675/81 A IT21675/81 A IT 21675/81A IT 2167581 A IT2167581 A IT 2167581A IT 1137472 B IT1137472 B IT 1137472B
Authority
IT
Italy
Prior art keywords
components
motorized
panels
circuits
cooling device
Prior art date
Application number
IT21675/81A
Other languages
English (en)
Other versions
IT8121675A0 (it
Inventor
Andersson Folke
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of IT8121675A0 publication Critical patent/IT8121675A0/it
Application granted granted Critical
Publication of IT1137472B publication Critical patent/IT1137472B/it

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT21675/81A 1980-05-13 1981-05-13 Dispositivo di raffreddamento per componenti elettronici e/o per pannelli di circuiti sui quali i componenti sono motati IT1137472B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE8003579A SE8003579L (sv) 1980-05-13 1980-05-13 Kylanordning for diskreta eller pa kretskort monterade elektroniska komponenter

Publications (2)

Publication Number Publication Date
IT8121675A0 IT8121675A0 (it) 1981-05-13
IT1137472B true IT1137472B (it) 1986-09-10

Family

ID=20340958

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21675/81A IT1137472B (it) 1980-05-13 1981-05-13 Dispositivo di raffreddamento per componenti elettronici e/o per pannelli di circuiti sui quali i componenti sono motati

Country Status (4)

Country Link
DE (1) DE3117758A1 (it)
GB (1) GB2076141B (it)
IT (1) IT1137472B (it)
SE (1) SE8003579L (it)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012090157A1 (en) 2010-12-27 2012-07-05 Reel S.R.L. Cooling device for electronic components and control apparatus comprising the cooling device

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2151769B (en) * 1983-12-21 1987-11-04 Marconi Electronic Devices Heat sink arrangement
WO1989002569A1 (en) * 1987-09-09 1989-03-23 Hasler Ag Thermosiphon
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
DE4121534C2 (de) * 1990-06-30 1998-10-08 Toshiba Kawasaki Kk Kühlvorrichtung
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
FI110030B (fi) * 1998-02-19 2002-11-15 Nokia Corp Työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuva lämmönsiirrin ja menetelmä työaineeseen olomuodon muutoksessa sitoutuvaan lämpöenergiaan perustuvan lämmönsiirtimen valmistamiseksi
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US7147045B2 (en) 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US7305843B2 (en) 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
FR2796518B1 (fr) * 1999-07-15 2001-11-23 Henri Maurice Benmussa Ensemble electronique autonome comprenant des cartes electroniques assujetties a un cadre
DE19960840A1 (de) * 1999-12-16 2001-07-05 Siemens Ag Elektronische Schaltung mit Kühlvorrichtung
GB0014809D0 (en) * 2000-06-19 2000-08-09 Black & Decker Inc Belt sander
FR2827115B1 (fr) * 2001-07-06 2003-09-05 Alstom Coffre pour convertisseur de puissance
US7198096B2 (en) 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
JP4371210B2 (ja) 2003-12-05 2009-11-25 日本電気株式会社 電子ユニットおよびその放熱構造
CN102984922B (zh) * 2012-11-12 2016-01-20 中国航空工业集团公司第六三一研究所 模块散热结构
CN104334005B (zh) * 2014-11-28 2017-01-25 成都泰格微波技术股份有限公司 一种全密封式散热腔体

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012090157A1 (en) 2010-12-27 2012-07-05 Reel S.R.L. Cooling device for electronic components and control apparatus comprising the cooling device

Also Published As

Publication number Publication date
GB2076141B (en) 1984-03-07
SE8003579L (sv) 1981-11-14
DE3117758A1 (de) 1982-01-21
GB2076141A (en) 1981-11-25
IT8121675A0 (it) 1981-05-13

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970516