IT1114857B - Processo per il trattamento della superficie di substrati semiconduttori - Google Patents
Processo per il trattamento della superficie di substrati semiconduttoriInfo
- Publication number
- IT1114857B IT1114857B IT20894/77A IT2089477A IT1114857B IT 1114857 B IT1114857 B IT 1114857B IT 20894/77 A IT20894/77 A IT 20894/77A IT 2089477 A IT2089477 A IT 2089477A IT 1114857 B IT1114857 B IT 1114857B
- Authority
- IT
- Italy
- Prior art keywords
- surface treatment
- semiconductive substrates
- semiconductive
- substrates
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/670,508 US4050954A (en) | 1976-03-25 | 1976-03-25 | Surface treatment of semiconductor substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IT1114857B true IT1114857B (it) | 1986-01-27 |
Family
ID=24690679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT20894/77A IT1114857B (it) | 1976-03-25 | 1977-03-04 | Processo per il trattamento della superficie di substrati semiconduttori |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4050954A (it) |
| JP (1) | JPS52117060A (it) |
| CA (1) | CA1053382A (it) |
| DE (1) | DE2706519C2 (it) |
| FR (1) | FR2345532A1 (it) |
| GB (1) | GB1525675A (it) |
| IT (1) | IT1114857B (it) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4116714A (en) * | 1977-08-15 | 1978-09-26 | International Business Machines Corporation | Post-polishing semiconductor surface cleaning process |
| JPS6119133A (ja) * | 1984-07-05 | 1986-01-28 | Nec Corp | 半導体装置の製造方法 |
| DE3735158A1 (de) * | 1987-10-16 | 1989-05-03 | Wacker Chemitronic | Verfahren zum schleierfreien polieren von halbleiterscheiben |
| JPH02165641A (ja) * | 1988-12-20 | 1990-06-26 | Sanyo Electric Co Ltd | 電界効果トランジスタの製造方法 |
| US5320706A (en) * | 1991-10-15 | 1994-06-14 | Texas Instruments Incorporated | Removing slurry residue from semiconductor wafer planarization |
| JPH0779166B2 (ja) * | 1991-12-25 | 1995-08-23 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
| US5607718A (en) * | 1993-03-26 | 1997-03-04 | Kabushiki Kaisha Toshiba | Polishing method and polishing apparatus |
| KR0166404B1 (ko) * | 1993-03-26 | 1999-02-01 | 사토 후미오 | 연마방법 및 연마장치 |
| WO1995004372A1 (en) * | 1993-07-30 | 1995-02-09 | Semitool, Inc. | Methods for processing semiconductors to reduce surface particles |
| US5700180A (en) * | 1993-08-25 | 1997-12-23 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing |
| US5643060A (en) * | 1993-08-25 | 1997-07-01 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including heater |
| US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US6267122B1 (en) * | 1993-09-10 | 2001-07-31 | Texas Instruments Incorporated | Semiconductor cleaning solution and method |
| US5679059A (en) * | 1994-11-29 | 1997-10-21 | Ebara Corporation | Polishing aparatus and method |
| US5885138A (en) | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
| JP3326642B2 (ja) * | 1993-11-09 | 2002-09-24 | ソニー株式会社 | 基板の研磨後処理方法およびこれに用いる研磨装置 |
| JP2586319B2 (ja) * | 1993-12-15 | 1997-02-26 | 日本電気株式会社 | 半導体基板の研磨方法 |
| EP0718873A3 (en) * | 1994-12-21 | 1998-04-15 | MEMC Electronic Materials, Inc. | Cleaning process for hydrophobic silicon wafers |
| JP3649771B2 (ja) * | 1995-05-15 | 2005-05-18 | 栗田工業株式会社 | 洗浄方法 |
| US20070123151A1 (en) * | 1995-05-23 | 2007-05-31 | Nova Measuring Instruments Ltd | Apparatus for optical inspection of wafers during polishing |
| IL113829A (en) | 1995-05-23 | 2000-12-06 | Nova Measuring Instr Ltd | Apparatus for optical inspection of wafers during polishing |
| US7169015B2 (en) * | 1995-05-23 | 2007-01-30 | Nova Measuring Instruments Ltd. | Apparatus for optical inspection of wafers during processing |
| US5704987A (en) * | 1996-01-19 | 1998-01-06 | International Business Machines Corporation | Process for removing residue from a semiconductor wafer after chemical-mechanical polishing |
| DE19709217A1 (de) * | 1997-03-06 | 1998-09-10 | Wacker Siltronic Halbleitermat | Verfahren zur Behandlung einer polierten Halbleiterscheibe gleich nach Abschluß einer Politur der Halbleiterscheibe |
| US5896870A (en) * | 1997-03-11 | 1999-04-27 | International Business Machines Corporation | Method of removing slurry particles |
| US5922136A (en) * | 1997-03-28 | 1999-07-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Post-CMP cleaner apparatus and method |
| US6240933B1 (en) | 1997-05-09 | 2001-06-05 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
| US6152148A (en) * | 1998-09-03 | 2000-11-28 | Honeywell, Inc. | Method for cleaning semiconductor wafers containing dielectric films |
| US6230720B1 (en) | 1999-08-16 | 2001-05-15 | Memc Electronic Materials, Inc. | Single-operation method of cleaning semiconductors after final polishing |
| US6375548B1 (en) * | 1999-12-30 | 2002-04-23 | Micron Technology, Inc. | Chemical-mechanical polishing methods |
| US6416391B1 (en) * | 2000-02-28 | 2002-07-09 | Seh America, Inc. | Method of demounting silicon wafers after polishing |
| US20030104770A1 (en) | 2001-04-30 | 2003-06-05 | Arch Specialty Chemicals, Inc. | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers |
| US20040159050A1 (en) * | 2001-04-30 | 2004-08-19 | Arch Specialty Chemicals, Inc. | Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers |
| US20040029494A1 (en) * | 2002-08-09 | 2004-02-12 | Souvik Banerjee | Post-CMP cleaning of semiconductor wafer surfaces using a combination of aqueous and CO2 based cryogenic cleaning techniques |
| WO2006076005A1 (en) * | 2005-01-12 | 2006-07-20 | Boc, Inc. | System for cleaning a surface using cryogenic aerosol and fluid reactant |
| TWI324797B (en) * | 2005-04-05 | 2010-05-11 | Lam Res Corp | Method for removing particles from a surface |
| JP4817291B2 (ja) * | 2005-10-25 | 2011-11-16 | Ｏｋｉセミコンダクタ株式会社 | 半導体ウェハの製造方法 |
| JP2010518230A (ja) | 2007-02-08 | 2010-05-27 | フォンタナ・テクノロジー | パーティクル除去方法及び組成物 |
| US20080299780A1 (en) * | 2007-06-01 | 2008-12-04 | Uv Tech Systems, Inc. | Method and apparatus for laser oxidation and reduction |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2690383A (en) * | 1952-04-29 | 1954-09-28 | Gen Electric Co Ltd | Etching of crystal contact devices |
| US2930722A (en) * | 1959-02-03 | 1960-03-29 | Bell Telephone Labor Inc | Method of treating silicon |
| US3170273A (en) * | 1963-01-10 | 1965-02-23 | Monsanto Co | Process for polishing semiconductor materials |
| US3436259A (en) * | 1966-05-12 | 1969-04-01 | Ibm | Method for plating and polishing a silicon planar surface |
| JPS50147287A (it) * | 1974-05-15 | 1975-11-26 |
-
1976
- 1976-03-25 US US05/670,508 patent/US4050954A/en not_active Expired - Lifetime
-
1977
- 1977-01-28 JP JP793277A patent/JPS52117060A/ja active Granted
- 1977-02-01 FR FR7703512A patent/FR2345532A1/fr active Granted
- 1977-02-16 DE DE2706519A patent/DE2706519C2/de not_active Expired
- 1977-02-24 GB GB7820/77A patent/GB1525675A/en not_active Expired
- 1977-02-28 CA CA272,855A patent/CA1053382A/en not_active Expired
- 1977-03-04 IT IT20894/77A patent/IT1114857B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DE2706519A1 (de) | 1977-10-06 |
| US4050954A (en) | 1977-09-27 |
| GB1525675A (en) | 1978-09-20 |
| CA1053382A (en) | 1979-04-24 |
| JPS542539B2 (it) | 1979-02-08 |
| FR2345532B1 (it) | 1979-03-09 |
| JPS52117060A (en) | 1977-10-01 |
| FR2345532A1 (fr) | 1977-10-21 |
| DE2706519C2 (de) | 1985-09-26 |
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