[go: up one dir, main page]

IT1112073B - Apparecchio di taglio a mezzo laser in particolare per la produzione di dispositivi a semiconduttore - Google Patents

Apparecchio di taglio a mezzo laser in particolare per la produzione di dispositivi a semiconduttore

Info

Publication number
IT1112073B
IT1112073B IT51179/77A IT5117977A IT1112073B IT 1112073 B IT1112073 B IT 1112073B IT 51179/77 A IT51179/77 A IT 51179/77A IT 5117977 A IT5117977 A IT 5117977A IT 1112073 B IT1112073 B IT 1112073B
Authority
IT
Italy
Prior art keywords
production
semiconductor devices
laser cutting
cutting apparatus
half laser
Prior art date
Application number
IT51179/77A
Other languages
English (en)
Inventor
Ernst Limmer
Helmut Hofl
Original Assignee
Texas Instruments Deutschland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Deutschland filed Critical Texas Instruments Deutschland
Application granted granted Critical
Publication of IT1112073B publication Critical patent/IT1112073B/it

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1423Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B15/00Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
    • B08B15/04Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IT51179/77A 1976-09-29 1977-09-28 Apparecchio di taglio a mezzo laser in particolare per la produzione di dispositivi a semiconduttore IT1112073B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762643981 DE2643981A1 (de) 1976-09-29 1976-09-29 Vorrichtung zum absaugen des beim ritzen von halbleiterscheiben mittels laserstrahlen entstehenden staubs

Publications (1)

Publication Number Publication Date
IT1112073B true IT1112073B (it) 1986-01-13

Family

ID=5989225

Family Applications (1)

Application Number Title Priority Date Filing Date
IT51179/77A IT1112073B (it) 1976-09-29 1977-09-28 Apparecchio di taglio a mezzo laser in particolare per la produzione di dispositivi a semiconduttore

Country Status (6)

Country Link
US (1) US4149062A (it)
JP (1) JPS5387092A (it)
BR (1) BR7706469A (it)
DE (1) DE2643981A1 (it)
GB (1) GB1571039A (it)
IT (1) IT1112073B (it)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1165636B (it) * 1979-03-05 1987-04-22 Fiat Auto Spa Metodo ed apparecchio per il controllo dei gas di copertura utilizzati nelle lavorazioni a mezzo di laser di potenza su pezzi metallici
DE3008176C2 (de) * 1979-03-07 1986-02-20 Crosfield Electronics Ltd., London Gravieren von Druckzylindern
SE430390B (sv) * 1982-07-05 1983-11-14 Knutsson G Ing Ab Anleggning for skerande bearbetning av material medelst en laserstrale
US4659901A (en) * 1984-07-10 1987-04-21 Westinghouse Electric Corp. Particulate collection system for laser welding apparatus
GB8600214D0 (en) * 1986-01-07 1986-02-12 Quantum Laser Uk Ltd Gas shroud
EP0304505B1 (de) * 1987-08-27 1991-04-24 Firma Carl Zeiss Vorrichtung zum Schweissen von Werkstücken mittels eines Laserstrahles
DE19541899B4 (de) * 1995-11-10 2005-01-13 Thyssenkrupp Drauz Gmbh Vorrichtung zum Spannen und Laserstrahlschweißen von Dünnblechen
US5906760A (en) * 1997-11-04 1999-05-25 Robb; David K. Exhaust system for a laser cutting device
US6064035A (en) * 1997-12-30 2000-05-16 Lsp Technologies, Inc. Process chamber for laser peening
EP1504842A4 (en) * 2002-05-13 2006-03-29 Disco Corp LASER BEAM FINISHING APPARATUS
US7276673B2 (en) * 2003-09-26 2007-10-02 Tdk Corporation Solder bonding method and solder bonding device
EP1588864A1 (en) * 2004-04-22 2005-10-26 Kba-Giori S.A. Printing machine with laser perforating unit
CN100522442C (zh) * 2005-03-30 2009-08-05 Tdk株式会社 钎焊方法,钎焊设备,接合方法,及接合设备
GB2433459B (en) * 2005-12-22 2008-01-16 Sony Corp Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method
WO2013029038A2 (en) 2011-08-25 2013-02-28 Preco, Inc. Method and apparatus for making a clean cut with a laser
JP5663776B1 (ja) * 2014-03-27 2015-02-04 福井県 吸引方法及び吸引装置並びにレーザ加工方法及びレーザ加工装置
KR102343226B1 (ko) * 2014-09-04 2021-12-23 삼성전자주식회사 스팟 히터 및 이를 이용한 웨이퍼 클리닝 장치
JP6647829B2 (ja) * 2015-10-20 2020-02-14 株式会社ディスコ レーザ加工装置
CN105964646A (zh) * 2016-06-29 2016-09-28 嘉兴光弘科技电子有限公司 一种回流焊机的除烟尘装置
US10307803B2 (en) * 2016-07-20 2019-06-04 The United States Of America As Represented By Secretary Of The Navy Transmission window cleanliness for directed energy devices
JP6829053B2 (ja) * 2016-11-09 2021-02-10 コマツ産機株式会社 マシンルーム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626141A (en) * 1970-04-30 1971-12-07 Quantronix Corp Laser scribing apparatus
US3866398A (en) * 1973-12-20 1975-02-18 Texas Instruments Inc In-situ gas-phase reaction for removal of laser-scribe debris

Also Published As

Publication number Publication date
BR7706469A (pt) 1978-07-04
GB1571039A (en) 1980-07-09
US4149062A (en) 1979-04-10
DE2643981A1 (de) 1978-03-30
JPS5387092A (en) 1978-08-01

Similar Documents

Publication Publication Date Title
IT1112073B (it) Apparecchio di taglio a mezzo laser in particolare per la produzione di dispositivi a semiconduttore
IT1067021B (it) Apparato laser per operazioni chirurgiche
IT1131636B (it) Dispositivo laser a semiconduttore
IT1098332B (it) Derivati antrachinonici per il trattamento di artriti
NL7704226A (nl) Halfgeleider laserinrichting.
JPS5365090A (en) Semiconductor laser output controller
FR2345836A1 (fr) Laser a semi-conducteur
GB1545194A (en) Semiconductor laser device
FR2282176A1 (fr) Laser a semi-conducteurs
IT1041472B (it) Dispositivo a fascio laser per la fabbricazione di circuiti integrati a semiconduttore
IT1079640B (it) Procedimento per produrre idrossi benzaldeidi
IT1083713B (it) Procedimento per la fabbricazione di formammide
BR7702421A (pt) Transdutor semicondutor
IT1091157B (it) Procedimento e dispositivo per la produzione di imballaggi
IT1082222B (it) Apparato per segare
IT1117482B (it) Dispositivo per il taglio trasversale di una striscia
IT1143576B (it) Procedimento per la produzione di cianura benzoilico
IT1079721B (it) Procedimento per produrre metildiclorofasfano
IT1143577B (it) Procedimento per la produzione di cianura benzoilico
IT1086689B (it) Procedimento per la produzione di clorometilsilani
IT1143607B (it) Procedimento per la produzione di tiazoline-(3)
SE422901B (sv) Anordning for skerbrenning
IT1090394B (it) Utensile da taglio
IT1075814B (it) Metodo per la regolazione a reazione di laser a fascio elettronico
IT1090534B (it) Procedimento per produrre continuamente aceto-acetammidi