IN2014DN09117A - - Google Patents
Info
- Publication number
- IN2014DN09117A IN2014DN09117A IN9117DEN2014A IN2014DN09117A IN 2014DN09117 A IN2014DN09117 A IN 2014DN09117A IN 9117DEN2014 A IN9117DEN2014 A IN 9117DEN2014A IN 2014DN09117 A IN2014DN09117 A IN 2014DN09117A
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012103249A JP5601342B2 (en) | 2012-04-27 | 2012-04-27 | Drift plate and jet device |
PCT/JP2013/057832 WO2013161453A1 (en) | 2012-04-27 | 2013-03-19 | Drift plate and jet device |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DN09117A true IN2014DN09117A (en) | 2015-05-22 |
Family
ID=49482790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN9117DEN2014 IN2014DN09117A (en) | 2012-04-27 | 2014-10-30 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9622395B2 (en) |
EP (1) | EP2842683B1 (en) |
JP (1) | JP5601342B2 (en) |
KR (1) | KR101524993B1 (en) |
CN (1) | CN104254423B (en) |
IN (1) | IN2014DN09117A (en) |
MY (1) | MY182200A (en) |
PH (1) | PH12014502409B1 (en) |
SG (1) | SG11201406926XA (en) |
WO (1) | WO2013161453A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105073322B (en) * | 2013-03-29 | 2016-07-13 | 千住金属工业株式会社 | Deflector and jet apparatus |
DE102013110731B3 (en) * | 2013-09-27 | 2014-11-06 | Ersa Gmbh | Separator strip arrangement for soldering nozzle, and soldering nozzle device for selective wave soldering |
CN104594990B (en) * | 2015-02-27 | 2017-06-23 | 天纳克(苏州)排放系统有限公司 | Mixing tube and its exhaust gas treatment device |
CN106975816A (en) * | 2017-03-28 | 2017-07-25 | 深圳市联合超越电子设备有限公司 | The jet apparatus of spout adjustable angle |
CN113262392B (en) * | 2021-04-25 | 2022-08-09 | 泰尔茂医疗产品(杭州)有限公司 | Connector with a locking member |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57154371A (en) * | 1981-03-19 | 1982-09-24 | Tdk Corp | Method and device for soldering |
GB2117690B (en) * | 1982-04-02 | 1986-01-08 | Zevatron Gmbh | Apparatus for soldering workpieces |
JPS63137570A (en) * | 1986-11-27 | 1988-06-09 | Tamura Seisakusho Co Ltd | Jet type soldering device |
JPH01114165A (en) | 1987-10-27 | 1989-05-02 | Mitsubishi Electric Corp | Vertical deflection circuit |
JPH01143762A (en) | 1987-11-26 | 1989-06-06 | Tamura Seisakusho Co Ltd | Jet type soldering device |
JPH0641722Y2 (en) | 1988-01-29 | 1994-11-02 | 千住金属工業株式会社 | Jet solder bath |
JPH0314059A (en) | 1989-06-13 | 1991-01-22 | Nec Corp | Bus system |
JPH0314059U (en) * | 1989-06-20 | 1991-02-13 | ||
JPH10313171A (en) * | 1997-05-12 | 1998-11-24 | Nihon Dennetsu Keiki Co Ltd | Soldering apparatus |
JPH1144409A (en) * | 1997-07-23 | 1999-02-16 | Kozo Sekimoto | Combustion furnace |
JP4136887B2 (en) | 2003-06-17 | 2008-08-20 | 千住システムテクノロジー株式会社 | Solder tank pump and solder tank using the same |
EP1676662B1 (en) * | 2003-10-10 | 2010-05-19 | Senju Metal Industry Co., Ltd. | Jet solder vessel |
PL1850646T3 (en) | 2005-02-07 | 2011-01-31 | Senju Metal Industry Co | Jet solder bath |
CN101454108B (en) * | 2006-04-05 | 2012-09-05 | 千住金属工业株式会社 | Wave soldering tank |
JP2009019781A (en) * | 2007-07-10 | 2009-01-29 | Showa Denko Kk | Heat exchanger |
CN201089051Y (en) * | 2007-08-03 | 2008-07-23 | 陈许松 | Leadless wave peak soldering machine |
JP5332654B2 (en) | 2009-01-27 | 2013-11-06 | 千住金属工業株式会社 | Jet solder bath |
CN101698259A (en) * | 2009-09-30 | 2010-04-28 | 苏州明富自动化设备有限公司 | Soldering tin jet device |
-
2012
- 2012-04-27 JP JP2012103249A patent/JP5601342B2/en active Active
-
2013
- 2013-03-19 SG SG11201406926XA patent/SG11201406926XA/en unknown
- 2013-03-19 KR KR1020147032873A patent/KR101524993B1/en active Active
- 2013-03-19 US US14/397,483 patent/US9622395B2/en active Active
- 2013-03-19 CN CN201380022382.1A patent/CN104254423B/en active Active
- 2013-03-19 WO PCT/JP2013/057832 patent/WO2013161453A1/en active Application Filing
- 2013-03-19 MY MYPI2014003017A patent/MY182200A/en unknown
- 2013-03-19 EP EP13781991.8A patent/EP2842683B1/en active Active
-
2014
- 2014-10-27 PH PH12014502409A patent/PH12014502409B1/en unknown
- 2014-10-30 IN IN9117DEN2014 patent/IN2014DN09117A/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP2842683A4 (en) | 2016-04-13 |
US20150305216A1 (en) | 2015-10-22 |
JP2013230481A (en) | 2013-11-14 |
EP2842683B1 (en) | 2017-10-18 |
SG11201406926XA (en) | 2015-02-27 |
KR101524993B1 (en) | 2015-06-01 |
PH12014502409A1 (en) | 2015-01-12 |
MY182200A (en) | 2021-01-18 |
CN104254423A (en) | 2014-12-31 |
EP2842683A1 (en) | 2015-03-04 |
PH12014502409B1 (en) | 2015-01-12 |
KR20140146219A (en) | 2014-12-24 |
CN104254423B (en) | 2015-11-25 |
US9622395B2 (en) | 2017-04-11 |
JP5601342B2 (en) | 2014-10-08 |
WO2013161453A1 (en) | 2013-10-31 |