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IN2014DN09117A - - Google Patents

Info

Publication number
IN2014DN09117A
IN2014DN09117A IN9117DEN2014A IN2014DN09117A IN 2014DN09117 A IN2014DN09117 A IN 2014DN09117A IN 9117DEN2014 A IN9117DEN2014 A IN 9117DEN2014A IN 2014DN09117 A IN2014DN09117 A IN 2014DN09117A
Authority
IN
India
Application number
Inventor
Shingo Nishida
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of IN2014DN09117A publication Critical patent/IN2014DN09117A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/046Surface mounting
    • H05K13/0465Surface mounting by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IN9117DEN2014 2012-04-27 2014-10-30 IN2014DN09117A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012103249A JP5601342B2 (en) 2012-04-27 2012-04-27 Drift plate and jet device
PCT/JP2013/057832 WO2013161453A1 (en) 2012-04-27 2013-03-19 Drift plate and jet device

Publications (1)

Publication Number Publication Date
IN2014DN09117A true IN2014DN09117A (en) 2015-05-22

Family

ID=49482790

Family Applications (1)

Application Number Title Priority Date Filing Date
IN9117DEN2014 IN2014DN09117A (en) 2012-04-27 2014-10-30

Country Status (10)

Country Link
US (1) US9622395B2 (en)
EP (1) EP2842683B1 (en)
JP (1) JP5601342B2 (en)
KR (1) KR101524993B1 (en)
CN (1) CN104254423B (en)
IN (1) IN2014DN09117A (en)
MY (1) MY182200A (en)
PH (1) PH12014502409B1 (en)
SG (1) SG11201406926XA (en)
WO (1) WO2013161453A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105073322B (en) * 2013-03-29 2016-07-13 千住金属工业株式会社 Deflector and jet apparatus
DE102013110731B3 (en) * 2013-09-27 2014-11-06 Ersa Gmbh Separator strip arrangement for soldering nozzle, and soldering nozzle device for selective wave soldering
CN104594990B (en) * 2015-02-27 2017-06-23 天纳克(苏州)排放系统有限公司 Mixing tube and its exhaust gas treatment device
CN106975816A (en) * 2017-03-28 2017-07-25 深圳市联合超越电子设备有限公司 The jet apparatus of spout adjustable angle
CN113262392B (en) * 2021-04-25 2022-08-09 泰尔茂医疗产品(杭州)有限公司 Connector with a locking member

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154371A (en) * 1981-03-19 1982-09-24 Tdk Corp Method and device for soldering
GB2117690B (en) * 1982-04-02 1986-01-08 Zevatron Gmbh Apparatus for soldering workpieces
JPS63137570A (en) * 1986-11-27 1988-06-09 Tamura Seisakusho Co Ltd Jet type soldering device
JPH01114165A (en) 1987-10-27 1989-05-02 Mitsubishi Electric Corp Vertical deflection circuit
JPH01143762A (en) 1987-11-26 1989-06-06 Tamura Seisakusho Co Ltd Jet type soldering device
JPH0641722Y2 (en) 1988-01-29 1994-11-02 千住金属工業株式会社 Jet solder bath
JPH0314059A (en) 1989-06-13 1991-01-22 Nec Corp Bus system
JPH0314059U (en) * 1989-06-20 1991-02-13
JPH10313171A (en) * 1997-05-12 1998-11-24 Nihon Dennetsu Keiki Co Ltd Soldering apparatus
JPH1144409A (en) * 1997-07-23 1999-02-16 Kozo Sekimoto Combustion furnace
JP4136887B2 (en) 2003-06-17 2008-08-20 千住システムテクノロジー株式会社 Solder tank pump and solder tank using the same
EP1676662B1 (en) * 2003-10-10 2010-05-19 Senju Metal Industry Co., Ltd. Jet solder vessel
PL1850646T3 (en) 2005-02-07 2011-01-31 Senju Metal Industry Co Jet solder bath
CN101454108B (en) * 2006-04-05 2012-09-05 千住金属工业株式会社 Wave soldering tank
JP2009019781A (en) * 2007-07-10 2009-01-29 Showa Denko Kk Heat exchanger
CN201089051Y (en) * 2007-08-03 2008-07-23 陈许松 Leadless wave peak soldering machine
JP5332654B2 (en) 2009-01-27 2013-11-06 千住金属工業株式会社 Jet solder bath
CN101698259A (en) * 2009-09-30 2010-04-28 苏州明富自动化设备有限公司 Soldering tin jet device

Also Published As

Publication number Publication date
EP2842683A4 (en) 2016-04-13
US20150305216A1 (en) 2015-10-22
JP2013230481A (en) 2013-11-14
EP2842683B1 (en) 2017-10-18
SG11201406926XA (en) 2015-02-27
KR101524993B1 (en) 2015-06-01
PH12014502409A1 (en) 2015-01-12
MY182200A (en) 2021-01-18
CN104254423A (en) 2014-12-31
EP2842683A1 (en) 2015-03-04
PH12014502409B1 (en) 2015-01-12
KR20140146219A (en) 2014-12-24
CN104254423B (en) 2015-11-25
US9622395B2 (en) 2017-04-11
JP5601342B2 (en) 2014-10-08
WO2013161453A1 (en) 2013-10-31

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