IL53957A0 - A method for establishing an electrically conductive path through an insulating - Google Patents

A method for establishing an electrically conductive path through an insulating

Info

Publication number: IL53957A0
Authority: IL; Israel
Prior art keywords: establishing; insulating; electrically conductive; conductive path; path
Prior art date: 1977-02-15

Application number

IL53957A

Original Assignee

Bogardus Lomerson R

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1977-02-15

Filing date

1978-02-02

Publication date

1978-04-30

1978-02-02 Application filed by Bogardus Lomerson R filed Critical Bogardus Lomerson R

1978-04-30 Publication of IL53957A0 publication Critical patent/IL53957A0/en

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Combinations Of Printed Boards (AREA)
Pressure Welding/Diffusion-Bonding (AREA)

IL53957A 1977-02-15 1978-02-02 A method for establishing an electrically conductive path through an insulating IL53957A0 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US76873577A	1977-02-15	1977-02-15

Publications (1)

Publication Number	Publication Date
IL53957A0 true IL53957A0 (en)	1978-04-30

Family

ID=25083343

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL53957A IL53957A0 (en)	1977-02-15	1978-02-02	A method for establishing an electrically conductive path through an insulating

Country Status (7)

Country	Link
JP (1)	JPS5416670A (en)
DE (1)	DE2805535A1 (en)
FR (1)	FR2380686A1 (en)
GB (1)	GB1584241A (en)
IL (1)	IL53957A0 (en)
IT (1)	IT1102270B (en)
NL (1)	NL7801594A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4250790A (en) *	1979-10-22	1981-02-17	Richard Shubb	Capo
FR2517165A1 (en) *	1981-11-20	1983-05-27	Radiotechnique Compelec	METHOD FOR PROVIDING A SCREEN AN ELECTRONIC CIRCUIT, AND PAYMENT CARD HAVING A SCREEN
JPS5939093A (en) *	1982-08-27	1984-03-03	大槻　眞之	Method of producing through hole circuit board
FR2562335B1 (en) *	1984-04-03	1988-11-25	Rogers Corp	FLEXIBLE MULTILAYER CIRCUIT WITH CONNECTIONS BETWEEN ULTRASONIC WELDED LAYERS
JPS62237791A (en) *	1986-04-08	1987-10-17	新藤電子工業株式会社	Manufacture of printed wiring board
US5744759A (en) *	1996-05-29	1998-04-28	International Business Machines Corporation	Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
DE102009050386B4 (en) *	2009-10-22	2013-10-31	Mühlbauer Ag	Method for producing plated-through holes
CN110636716A (en) *	2019-09-24	2019-12-31	江苏上达电子有限公司	Manufacturing method of non-electroplating blind hole

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1920061U (en) *	1963-09-27	1965-07-22	Siemens Ag	CARRIER PLATE ACCORDING TO THE PRINTED CIRCUIT WITH METAL CONDUCTOR TRACKS PROVIDED IN SEVERAL LEVELS, SOME OF WHICH ARE IN ELECTRICAL CONTACT WITH EACH OTHER.
US3346950A (en) *	1965-06-16	1967-10-17	Ibm	Method of making through-connections by controlled punctures
DE2113613B2 (en) *	1970-03-27	1972-11-23	Owens-Illinois, Inc., Toledo, Ohio (V.St.A.)	A method of simultaneously making electrical connections between a plurality of conductors on one substrate and a plurality of conductors on another substrate

1978
- 1978-02-02 FR FR7802931A patent/FR2380686A1/en active Granted
- 1978-02-02 IL IL53957A patent/IL53957A0/en not_active IP Right Cessation
- 1978-02-10 DE DE19782805535 patent/DE2805535A1/en not_active Ceased
- 1978-02-10 NL NL7801594A patent/NL7801594A/en not_active Application Discontinuation
- 1978-02-13 GB GB5630/78A patent/GB1584241A/en not_active Expired
- 1978-02-13 JP JP1419478A patent/JPS5416670A/en active Granted
- 1978-02-14 IT IT48041/78A patent/IT1102270B/en active

Also Published As

Publication number	Publication date
FR2380686B1 (en)	1984-05-25
GB1584241A (en)	1981-02-11
IT1102270B (en)	1985-10-07
NL7801594A (en)	1978-08-17
IT7848041A0 (en)	1978-02-14
DE2805535A1 (en)	1978-08-17
FR2380686A1 (en)	1978-09-08
JPS5416670A (en)	1979-02-07
JPS6252479B2 (en)	1987-11-05

Publication	Publication Date	Title
GB2010592B (en)	1982-06-23	Circuit board assembly for electrical apparatus
DE2860720D1 (en)	1981-08-27	Slotted plate electrical terminal
GB2084410B (en)	1983-01-19	An electrical contact
DE2960309D1 (en)	1981-08-06	Apparatus for inserting wires into electrical contacts
GB1545984A (en)	1979-05-16	Conductive diluent for pressed nickel electrodes
JPS55113890A (en)	1980-09-02	Electric conductor apparatus for electrode
IT1105115B (en)	1985-10-28	PROCEDURE FOR COATING AN ELECTRICALLY CONDUCTIVE OBJECT
GB2004424B (en)	1982-03-24	Electrical contacts
IL53277A0 (en)	1978-01-31	Terminal for two electrical conductors
DE2860480D1 (en)	1981-03-26	Apparatus for inserting wires into electrical terminals
JPS53145087A (en)	1978-12-16	Device for inserting electric terminal
DE3070776D1 (en)	1985-07-25	A method for manufacturing an electrically conductive copper alloy material
IL53957A0 (en)	1978-04-30	A method for establishing an electrically conductive path through an insulating
DE3062990D1 (en)	1983-06-09	Electrically conductive cyclic polyimides
GB2003791B (en)	1982-03-17	Electrically conductive web
ZA785754B (en)	1979-09-26	Electrically insulating casings for power cable junctions
NZ182774A (en)	1979-06-19	Electrically conducting cermet
ZA783033B (en)	1979-06-27	Screwless terminals for electrical conductors
GB2007038A (en)	1979-05-10	Electrical terminal
GB1546986A (en)	1979-06-06	Electrical apparatus having cooperalbe contacts
GB2059191B (en)	1983-07-20	Electrically conductive terminal
IL51470A0 (en)	1977-04-29	Housing for an electrical terminal
GB1553181A (en)	1979-09-19	Forming electrically insulating layers
JPS5453650A (en)	1979-04-27	Control circuit for electric welder
GB2002965B (en)	1982-03-03	Insulated electrical coil assemblies

Legal Events

Date	Code	Title	Description
1996-11-14	RH	Patent void