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IL194505A0 - Electroplating device and method - Google Patents

Electroplating device and method

Info

Publication number
IL194505A0
IL194505A0 IL194505A IL19450508A IL194505A0 IL 194505 A0 IL194505 A0 IL 194505A0 IL 194505 A IL194505 A IL 194505A IL 19450508 A IL19450508 A IL 19450508A IL 194505 A0 IL194505 A0 IL 194505A0
Authority
IL
Israel
Prior art keywords
substrate
electrically conductive
cathode
bath
electrolytic coating
Prior art date
Application number
IL194505A
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of IL194505A0 publication Critical patent/IL194505A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C25D17/28—Apparatus for electrolytic coating of small objects in bulk with means for moving the objects individually through the apparatus during treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention relates to a device for the electrolytic coating of at least one electrically conductive substrate or a structured or full-surface electrically conductive surface on a nonconductive substrate, which comprises at least one bath, one anode and one cathode, the bath containing an electrolyte solution containing at least one metal salt, from which metal ions are deposited on electrically conductive surfaces of the substrate to form a metal layer while the cathode is brought in contact with the substrate's surface to be coated and the substrate is transported through the bath, wherein the cathode comprises at least two disks (2, 4, 10) mounted on a respective shaft (1, 5, 14) so that they can rotate, the disks (2, 4, 10) engaging in one another. The invention furthermore relates to a method for the electrolytic coating of at least one substrate, which is carried out in a device according to the invention. Lastly, the invention also relates to a use of the device according to the invention for the electrolytic coating of electrically conductive structures on an electrically nonconductive support.
IL194505A 2006-04-18 2008-10-02 Electroplating device and method IL194505A0 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112724 2006-04-18
PCT/EP2007/053401 WO2007118810A2 (en) 2006-04-18 2007-04-05 Electroplating device and method

Publications (1)

Publication Number Publication Date
IL194505A0 true IL194505A0 (en) 2009-08-03

Family

ID=38236501

Family Applications (1)

Application Number Title Priority Date Filing Date
IL194505A IL194505A0 (en) 2006-04-18 2008-10-02 Electroplating device and method

Country Status (13)

Country Link
US (1) US20090178930A1 (en)
EP (1) EP2010700B1 (en)
JP (1) JP2009534525A (en)
KR (1) KR20080110658A (en)
CN (1) CN101426962A (en)
AT (1) ATE455879T1 (en)
BR (1) BRPI0710662A2 (en)
CA (1) CA2647969A1 (en)
DE (1) DE502007002680D1 (en)
IL (1) IL194505A0 (en)
RU (1) RU2008145105A (en)
TW (1) TW200813263A (en)
WO (1) WO2007118810A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
US20110014492A1 (en) * 2008-03-13 2011-01-20 Basf Se Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound
DE102010000211A1 (en) * 2010-01-26 2011-07-28 Atotech Deutschland GmbH, 90537 Device for transporting plate-shaped substrates in a system for chemical and / or electrochemical treatment
KR101103450B1 (en) * 2010-07-27 2012-01-09 주식회사 케이씨텍 Substrate plating equipment
EP2799939A1 (en) * 2013-04-30 2014-11-05 Universo S.A. Support for the treatment of micromechanical parts
CN103343371A (en) * 2013-07-09 2013-10-09 中国铝业股份有限公司 Continuous electro-deposition method for polymer film
JP5967034B2 (en) * 2013-08-20 2016-08-10 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
US9847576B2 (en) * 2013-11-11 2017-12-19 Nxp B.V. UHF-RFID antenna for point of sales application
JP6197813B2 (en) * 2015-03-11 2017-09-20 トヨタ自動車株式会社 Metal film forming apparatus and film forming method
RU2643050C2 (en) * 2015-11-09 2018-01-30 Фарит Фазитович Мухамедьянов Acid surface-active composition for treating bottom-hole zone of oil and gas wells
CN113166967A (en) * 2018-11-22 2021-07-23 A-Plas通用汽车产品工贸股份公司 Coating racks for uniform coating
CN114790565B (en) * 2022-05-26 2024-06-18 江苏启威星装备科技有限公司 Conductive device and horizontal electroplating equipment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1437003A (en) * 1921-10-08 1922-11-28 American Nickeloid Company Electroplating apparatus and process
DE10234705B4 (en) * 2001-10-25 2008-01-17 Infineon Technologies Ag Electroplating and electroplating system for coating already conductive structures
WO2003038158A2 (en) * 2001-10-25 2003-05-08 Infineon Technologies Ag Electroplating device and electroplating system for coating already conductive structures
DE10342512B3 (en) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Device for the electrolytic treatment of electrically conducting structures on strip-like material used in chip cards, price signs or ID cards comprises an arrangement consisting of contact electrodes and an electrolysis region

Also Published As

Publication number Publication date
CA2647969A1 (en) 2007-10-25
EP2010700A2 (en) 2009-01-07
TW200813263A (en) 2008-03-16
ATE455879T1 (en) 2010-02-15
US20090178930A1 (en) 2009-07-16
BRPI0710662A2 (en) 2011-08-16
KR20080110658A (en) 2008-12-18
JP2009534525A (en) 2009-09-24
EP2010700B1 (en) 2010-01-20
WO2007118810A3 (en) 2008-05-22
WO2007118810A2 (en) 2007-10-25
CN101426962A (en) 2009-05-06
RU2008145105A (en) 2010-05-27
DE502007002680D1 (en) 2010-03-11

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