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IL138530A0 - Method for the formation of a pattern on an insulating substrate - Google Patents

Method for the formation of a pattern on an insulating substrate

Info

Publication number
IL138530A0
IL138530A0 IL13853000A IL13853000A IL138530A0 IL 138530 A0 IL138530 A0 IL 138530A0 IL 13853000 A IL13853000 A IL 13853000A IL 13853000 A IL13853000 A IL 13853000A IL 138530 A0 IL138530 A0 IL 138530A0
Authority
IL
Israel
Prior art keywords
pattern
formation
insulating substrate
insulating
substrate
Prior art date
Application number
IL13853000A
Original Assignee
T L M Advanced Laser Technolog
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by T L M Advanced Laser Technolog filed Critical T L M Advanced Laser Technolog
Priority to IL13853000A priority Critical patent/IL138530A0/en
Priority to PCT/IL2001/000869 priority patent/WO2002023962A2/en
Priority to AU2001292199A priority patent/AU2001292199A1/en
Publication of IL138530A0 publication Critical patent/IL138530A0/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
IL13853000A 2000-09-18 2000-09-18 Method for the formation of a pattern on an insulating substrate IL138530A0 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IL13853000A IL138530A0 (en) 2000-09-18 2000-09-18 Method for the formation of a pattern on an insulating substrate
PCT/IL2001/000869 WO2002023962A2 (en) 2000-09-18 2001-09-13 Method for the formation of a pattern on an insulating substrate
AU2001292199A AU2001292199A1 (en) 2000-09-18 2001-09-13 Method for the formation of a pattern on an insulating substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL13853000A IL138530A0 (en) 2000-09-18 2000-09-18 Method for the formation of a pattern on an insulating substrate

Publications (1)

Publication Number Publication Date
IL138530A0 true IL138530A0 (en) 2003-02-12

Family

ID=11074650

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13853000A IL138530A0 (en) 2000-09-18 2000-09-18 Method for the formation of a pattern on an insulating substrate

Country Status (3)

Country Link
AU (1) AU2001292199A1 (en)
IL (1) IL138530A0 (en)
WO (1) WO2002023962A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10329143B4 (en) 2003-06-27 2005-09-01 Infineon Technologies Ag Electronic module and method of making the same
US8084138B2 (en) 2004-04-13 2011-12-27 Coloplast A/S Polyethylene product and a method of providing a product, such as a laser welded polyethylene product
US7791561B2 (en) 2005-04-01 2010-09-07 Prysm, Inc. Display systems having screens with optical fluorescent materials
US9525850B2 (en) 2007-03-20 2016-12-20 Prysm, Inc. Delivering and displaying advertisement or other application data to display systems
US8556430B2 (en) 2007-06-27 2013-10-15 Prysm, Inc. Servo feedback control based on designated scanning servo beam in scanning beam display systems with light-emitting screens
EP2448383B1 (en) 2010-10-26 2013-09-11 C.R.F. Società Consortile Per Azioni Process for producing conductive and/or piezoresistive traces on a polymeric substrate
KR101823660B1 (en) 2013-08-09 2018-01-30 주식회사 엘지화학 Method for forming conductive pattern by direct radiation of electromagnetic wave, and resin structure having conductive pattern thereon
LT6518B (en) 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Method for formation of electro-conductive traces on polymeric article surface
WO2018190787A1 (en) * 2017-04-10 2018-10-18 Hewlett-Packard Development Company, L.P. Reducing stresses in metal layers
US10440830B2 (en) * 2017-09-08 2019-10-08 Robert Bosch Gmbh Laser carbonization of polymer coatings in an open-air environment
CN111246684A (en) * 2018-11-28 2020-06-05 庆鼎精密电子（淮安）有限公司 Circuit board and manufacturing method thereof
US12006411B1 (en) * 2020-08-19 2024-06-11 Systima Technologies, Inc. Method of making carbonized composites
CN112795206A (en) * 2021-03-08 2021-05-14 昆山睿翔讯通通信技术有限公司 Laser direct forming part and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1262395B (en) * 1966-03-30 1968-03-07 Siemens Ag Process for producing metallized holes in printed circuits
FR1583800A (en) * 1967-05-29 1969-10-27
US4691091A (en) * 1985-12-31 1987-09-01 At&T Technologies Direct writing of conductive patterns
DE3826046A1 (en) * 1987-08-17 1989-03-02 Asea Brown Boveri METHOD FOR PRODUCING METAL LAYERS
AU7446491A (en) * 1990-05-16 1991-12-10 Olin Corporation Gtab manufacturing process and the product produced thereby

Also Published As

Publication number Publication date
AU2001292199A1 (en) 2002-03-26
WO2002023962A2 (en) 2002-03-21
WO2002023962A3 (en) 2002-06-13

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