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IL123469A0 - Circuit board testing method and device - Google Patents

Circuit board testing method and device

Info

Publication number
IL123469A0
IL123469A0 IL12346998A IL12346998A IL123469A0 IL 123469 A0 IL123469 A0 IL 123469A0 IL 12346998 A IL12346998 A IL 12346998A IL 12346998 A IL12346998 A IL 12346998A IL 123469 A0 IL123469 A0 IL 123469A0
Authority
IL
Israel
Prior art keywords
circuit board
testing method
board testing
circuit
testing
Prior art date
Application number
IL12346998A
Other languages
English (en)
Original Assignee
Atg Test Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atg Test Systems Gmbh filed Critical Atg Test Systems Gmbh
Publication of IL123469A0 publication Critical patent/IL123469A0/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Tests Of Electronic Circuits (AREA)
IL12346998A 1997-03-11 1998-02-26 Circuit board testing method and device IL123469A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19709939A DE19709939A1 (de) 1997-03-11 1997-03-11 Verfahren und Vorrichtung zum Prüfen von Leiterplatten

Publications (1)

Publication Number Publication Date
IL123469A0 true IL123469A0 (en) 1998-09-24

Family

ID=7822937

Family Applications (1)

Application Number Title Priority Date Filing Date
IL12346998A IL123469A0 (en) 1997-03-11 1998-02-26 Circuit board testing method and device

Country Status (3)

Country Link
EP (1) EP0864874A3 (xx)
DE (1) DE19709939A1 (xx)
IL (1) IL123469A0 (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10025751A1 (de) 2000-05-24 2001-12-06 Atg Test Systems Gmbh Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens
DE10043728C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
DE10043726C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens
DE102016111200A1 (de) 2016-06-20 2017-12-21 Noris Automation Gmbh Verfahren und Vorrichtung zur berührungslosen funktionalen Überprüfung elektronischer Bauelemente in Schaltungsanordnungen mit örtlicher Fehlerlokalisierung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929846A1 (de) * 1979-07-23 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Opto-elektronisches pruefsystem zur automatischen beschaffenheitspruefung von leiterplatten, deren zwischenprodukte und druckwerkzeuge
DE3267548D1 (en) * 1982-05-28 1986-01-02 Ibm Deutschland Process and device for an automatic optical inspection
IT1199601B (it) * 1984-07-30 1988-12-30 Circuit Line Srl Apparecchiatura per la rappresentazione a stampa e/o visiva delle poligonali guaste di circuiti stampati mono o multistrato
JPS6261390A (ja) * 1985-09-11 1987-03-18 興和株式会社 プリント基板検査方法およびその装置
IL78943A (en) * 1986-05-27 1990-09-17 Ibm Israel Method and apparatus for automated optical inspection of printed circuits
JPS62285072A (ja) * 1986-06-04 1987-12-10 Hitachi Ltd プリント基板の配線パタ−ン検査装置
DE3737869A1 (de) * 1987-11-09 1989-05-24 Wagner Hans Juergen Dipl Ing Verfahren und einrichtung zum optischen pruefen von gegenstaenden
US5245671A (en) * 1988-05-09 1993-09-14 Omron Corporation Apparatus for inspecting printed circuit boards and the like, and method of operating same
JPH02231510A (ja) * 1989-03-02 1990-09-13 Omron Tateisi Electron Co 基板検査装置
DE4019226A1 (de) * 1990-06-15 1991-12-19 Grundig Emv Vorrichtung zur beleuchtung von leiterplatten in leiterplattenpruefeinrichtungen
WO1992011541A1 (en) * 1990-12-21 1992-07-09 Huntron Instruments, Inc. Image acquisition system for use with a printed circuit board test apparatus
JP2600594B2 (ja) * 1993-12-01 1997-04-16 日本電気株式会社 半導体集積回路の検査方法及び外形検査装置
US5543726A (en) * 1994-01-03 1996-08-06 International Business Machines Corporation Open frame gantry probing system
US5506793A (en) * 1994-01-14 1996-04-09 Gerber Systems Corporation Method and apparatus for distortion compensation in an automatic optical inspection system
DE4410603C1 (de) * 1994-03-26 1995-06-14 Jenoptik Technologie Gmbh Verfahren zur Erkennung von Fehlern bei der Inspektion von strukturierten Oberflächen
DE4417811A1 (de) * 1994-05-20 1995-11-23 Luther & Maelzer Gmbh Verfahren und Vorrichtung zum Prüfen von elektrischen Leiterplatten unter Verwendung eines Prüfadapters mit Prüfstiften
DE19503329C2 (de) * 1995-02-02 2000-05-18 Ita Ingb Testaufgaben Gmbh Testvorrichtung für elektronische Flachbaugruppen
JP3617547B2 (ja) * 1995-02-14 2005-02-09 富士通株式会社 配線パターンを観察する方法および加工装置
JPH09203765A (ja) * 1996-01-25 1997-08-05 Hioki Ee Corp ビジュアル併用型基板検査装置

Also Published As

Publication number Publication date
EP0864874A2 (de) 1998-09-16
EP0864874A3 (de) 1999-06-02
DE19709939A1 (de) 1998-09-17

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