IE882554L - Apparatus for delivery of substances - Google Patents

Abstract

phe invention concerns a device for the release of substances made of hot-melt adhesives, with uniform or non-uniform distribution of the substances. The hot-melt adhesive has a processing temperature between 40 and 80 degrees Celsius, preferably between 40 and 60 degrees Celsius, and ideally between 40 and 55 degrees Celsius. Also described is a process for manufacturing the device in which the melted hot melt-adhesive containing the substances to be released is applied continuously or intermittently to a support at a hot-melt adhesive temperature between 40 and 80 degrees Celsius, preferably 40 and 60 degrees Celsius, and ideally 45 and 55 degrees Celsius, and in which, if necessary, a protective coating material is applied.

Description

/" r-j r A -7 Dm -- « mt The invention relates to a device for the release of substances from hot melt pressure sensitive adhesives having a non-uniform or uniform distribution of the substances in the hot melt pressure sensitive adhesives, as well as relating to 5 a method for its manufacture and use thereof.

Typical examples of such devices are active substance containing plasters, indicator systems, devices releasing perfumes and the like, such being frequently used more especially in the medical field for the controlled or 10 uncontrolled release of substances. In such cases, the controlled devices in the form of transdermally controlled systems have acquired special significance. It has also already been disclosed for such systems to apply an active substance containing layer from the melt. A non-adhesive 15 cellulose ether gel, which is applied from the melt and in which active substances may be distributed, has been disclosed in EP-A-0177893. This gel is processed hot and is non-adhesive. A transdermal system is disclosed in DE-OS 32 22 800, wherein active substance, which is packed in 20 microcapsules, is present in a thermally mouldable, adhesive matrix material which is applied from the hot melt.

Articles have been disclosed in US-A-4,515,909, wherein polymers are impregnated with perfume at a high temperature in a solid state. The plastics material there is not molten, but 25 a somewhat softer polymer is impregnated with the perfume at high temperatures.

This method is not suitable for the exact introduction of defined quantities into a polymer.

An attempt has also been made to produce non-adhesive, active substance containing matrices at ambient temperature for temperature-sensitive active substances with a low boiling point or even easy miscibility. For example, it is stated in 5 US-PS 4,379,454 (Campbell et al.) to use an active substance solution for the active substance layer, such solution being brought to a desired viscosity value by means of gelling agents at ambient temperature. From US-PS 4,559,222 (Enscore et al.) it is known to use a mixture, produced at ambient 10 temperature, of mineral oil/polyisobutylene and colloidal silicon dioxide as the viscose layer of active substances for oil-soluble active substances, these layers also being adapted to be adhesive. DE-OS-32 22 800 (Alza) describes a layer of active substance formed from a solution of active substance 15 thickened by means of a rheological agent, such as cellulose, a polysaccharide or a silicon compound, such solution being non-adhesive and being suitable for the rapid release of active substance.

It has been disclosed, from US-PS 3,923,939, to form active 20 substances, such as tetracycline, in a layer of ethylene-vinyl acetate copolymer by hot melt pressing. In EP-A 86 468, an oral antidiabetes sulphonyl urea derivative in a non-adhesive hot melt mass having a melting point of 30 to 90°C is decanted into capsules in predetermined doses from the melt. In US-A-25 3,957,966, it is stated that active substances may be processed in non-adhesive hot melt masses.

It is disclosed, in DE-A-30 07 363, to use an adhesive mixture of a thermoplastic elastomer, here preferably a block polymer of the general formula ABA, an adhesive-rendering resin with 30 oil or higher fatty acids and active substances to produce a simple, transdermal system. The mixture of hot melt pressure sensitive adhesives described there is only suitable for relatively temperature-resistant active substances which tolerate temperatures of 120°C or more.

In US-PS 3,699,963, it is stated that oxytocine may be mixed with adhesives to produce a transdermal therapeutic system and 5 may be deformed at a temperature above 90°C. The transdermal systems thus produced are economical to produce and ensure a constant transfer of active substance by the whole-surface adhesion of the system to the skin.

The prior art methods for producing such systems are not 10 suitable for transdermal systems, which contain temperature-sensitive substances such as scopolamine. In consequence, adhesive layers of active substance were hitherto formed with temperature-sensitive active substances preferably from the solution, and the solvent was evaporated.

The use of solvents in the production of adhesive layers containing active substances is disadvantageous for several reasons. The production of the solutions requires at least one additional, complex method step. It requires high technical outlay and costs for handling the solvents -20 furthermore, for medical reasons, highly pure and hence expensive solvents have to be used in order to ensure a corresponding freedom of residue in the device for the dissolution of the adhesives or their starting materials. An additional problem resides in achieving a freedom from 25 solvents in the device, and expensive drying paths and suction systems are required therefor. Costs additionally occur by recovering or separating the solvents in order to avoid environmental pollution. Besides, an additional risk arises due to the combustibility of most solvents. Furthermore, most 30 organic solvents are harmful for the human organism, so that complex protective measures for the persons engaged in the operation have to be taken. In consequence, an object of the invention is to overcome the above-mentioned disadvantages of such prior art devices and methods.

According to the invention, the object is achieved by a device for the release of substances from hot melt pressure sensitive 5 adhesives having a non-uniform or uniform distribution of the substances in the hot melt pressure sensitive adhesives, wherein a mixture of hot melt pressure sensitive adhesive and substance or a solution of the substance in the hot melt pressure sensitive adhesive is present, the hot melt pressure 10 sensitive adhesive having a processing temperature of between 40 and 80°C, preferably between 40 and 60°C and quite especially preferably between 40 and 55°C.

The operation may thus be carried out at low temperatures without solvents, whereby it is possible to achieve a 15 considerable saving of materials, an accelerated production of the device without the time-consuming drying steps and a production of devices according to the invention which are less harmful to the environment, thereby producing, inter alia, a considerably more economical and also solvent-free 20 product. The device is such that the hot melt pressure sensitive adhesive, having the substance(s) to be released, may be present as one or more layers. The hot melt pressure sensitive adhesive is preferably provided with a carrier, which is permeable or impermeable to the substance(s) to be 25 released.

The hot melt pressure sensitive adhesive may be one, for example, which is produced on the basis of styrene-isoprene-styrene block polymers, polycaprolactones, ethylene-vinylacetate copolymers, polyurethane, polyepoxides, 30 polyisobutene, polyvinyl ethers, optionally with the addition of plasticizers, tackifiers, filler materials, anti-agers and/or thixotropic agents.

A method, according to the invention, of producing a device of the invention comprises continuously or discontinuously applying molten hot melt pressure sensitive adhesive which contains the substance to be released at a temperature of the 5 hot melt pressure sensitive adhesive of between 40 and 80°C, preferably 40 to 60°C and especially preferably 40 to 55°C, to a carrier and optionally applying the protective layer material.

An additional method of the invention comprises continuously 10 or discontinuously applying molten hot melt pressure sensitive adhesive which contains the substance to be released at a temperature of the hot melt pressure sensitive adhesive of between 40 and 80°C, preferably 40 to 60°C and especially preferably 40 and 55°C, to a protective layer material and 15 optionally applying the carrier.

For the use of highly volatile and/or thermally unstable substances to be released, the particular processing measures mentioned hereinafter may be indicated: A. working at as low temperatures as possible; 20 B. increasing the external pressure in order to reduce the evaporation; C. saturating the steam chamber over the hot melt with the vapour-like substance; and D. working with as small a quantity of volatile substance in 25 the melt as possible according to the rules.

These measures, such as, for example, working in an enclosed system, are limited of course by the legal procedures known i to the person skilled in the art because of the intended purpose of the device to be produced and also because of the 30 facts governing the substances.

The devices according to the invention, more especially the transdermal systems, may be used, for example, for the local or systematic processing of active substances in human or animal medicine or in cosmetics, preferably for the release 5 of temperature-sensitive and/or highly volatile substances.

What is understood here by the term hot melt pressure sensitive adhesive is any pressure sensitive adhesive which is sufficiently fluid when hot in order to be applied easily at a temperature above substantially 40°C.

The hot melt pressure sensitive adhesives which are utilisable according to the invention may include, inter alia, those which are commonly known to the person skilled in the art and are derivable from, inter alia, DE-A-15 94 268 (Sun Oil Co.), DE-A-24 13 979 (E.I. Du Pont De Nemours), DE-A-24 35 863 (Dynamit Nobel AG); DE-A-28 00 302 (Ciba-Geigy); EP-A-104 005 (Personal Products Co), JP 61 042 583 and JP 61 281 810, EP-A-131 460 (Exxon) and EP-A-234 856 (Exxon), EP-A-185 992 (Eastman Kodak) as well as from US-PS 3,699,963 and US-PS 4,358,557 (Eastman Kodak), reference being expressly made to this prior art in order to avoid repetition.

In such cases, examples of basic polymers which may be used are polyamides, polyesters, polycaprolactames, polycaprolactones, ethylene-vinyl acetate copolymers (EVA), ethylene-ethyl acrylate copolymers (EEA), polyvinyl ethers, 25 polyacrylate esters, polyvinyl acetals, polyvinylacetates, styrene-butadiene block polymers, isoprene block polymers, polyurethanes, ethyl cellulose, cellulose acetate butyrate, synthesis rubbers (e.g. neoprene rubber), polyisobutylene, butyl rubber, acrylonitrile butadiene mixed polymers, epoxy 30 resins, melamine resins, phenol formaldehyde resins and resorcin formaldehyde resins, and the following modifying resins may also be used, inter alia: hydrated colophonium, polymerised colophonium, dimerised resin acids, disproportionated colophonium, methyl esters of colophonium, glycerine esters of hydrated colophonium, methyl esters of hydrated colophonium, pental esters, triethylene glycol esters of hydrated colophonium, hydroabiethyl alcohol and its 5 derivatives, glycerine esters, di-triol esters and pentaesters of resin acids, pental esters of polymerised colophonium, # pental esters of dimerised colophonium, glycerine esters of dimerised colophonium, esters of maleic acid or phenol-modified colophonium, aromatic and aliphatic hydrocarbon 10 resins, hydrated resins, polyterpene resins, modified terpene resins, waxes, low-molecular polyethylene and polypropylene, or alkyl-styrene copolymers. To these resins may optionally be added plasticizers, such as, for example, adipic acid esters, phosphoric acid esters, phthalic acid esters, 15 polyesters, fatty acid esters, citric acid esters or epoxy plasticizers. Furthermore, stabilizers, such as tocopherol, substituted phenols, hydroquinones, pyrocatechines, aromatic amines and optionally also filler materials, such as, for example, titanium dioxide, magnesium oxide, zinc oxide and 20 silicon dioxide, may also be admixed.

The formation of the components of the device, which have hot melt pressure sensitive adhesives with a processing temperature of between 40 and 80°C, may be effected by extrusion, moulding, roller application, knife application, 25 spraying or by a printing process.

A limit value for the processability of the hot melt pressure sensitive adhesives in many of these methods is given with a viscosity in the region of substantially 80000 Pa s.

If the base which is to be treated with the adhesive - such 30 base being a component of the device - might be damaged by the temperature of the adhesive which is applied hot - either by decomposition, reaction or partial melting - a cooled base may be used. The cooling may be effected by methods known per se, such as by introducing cold, inert gases or bringing into contact with a cooling surface.

The hot melt pressure sensitive adhesive may be applied to the protective layer or the cover material in layer form, for 5 example, or in individual regions according to a predetermined pattern.

Depending on the intended use - if, for example, the substance to be released is to be released through the rear layer, as may be in the case, for example, of essential oils, such as 10 perfumes - the hot melt pressure sensitive adhesive may be provided with a carrier which is permeable to the substance(s) to be released, while a rear layer, which is impermeable to the substance to be released, is preferred for the embodiment of the device as a transdermal system, wherein the substance 15 is only to be released to the skin.

Because of the method according to the invention, the use of adhesive materials containing solvents may now be avoided when processing temperature-sensitive and highly volatile substances, and such results in a considerable increase in the 20 reliability of the production, since no toxic solvent residues remain in fact in the medical form, a considerably simplified method of application produced and a considerable saving in manufacturing costs. In such case, the method may also of course be used advantageously for substances which are 25 scarcely temperature-sensitive, since considerable costs can also be saved thereby.

What is understood by the term "substances" in connection with the present invention are chemical elements, organic and inorganic compounds, which may migrate from the components 30 containing them of such a device and thereby cause a sought-after effect. Among the fields of application of the device according to the invention, human and animal medicine is of particular significance, whereby one embodiment of the invention is particularly preferred here in plaster form.

Typical substances which can be processed by devices manufactured according to the invention are: aceclidine, 5 amphetaminile, amphetamine, amyl nitrite, apophedrine, atebrine, alprostadile, azulene, arecoline, anethol, amylene hydrate, acetyl choline, acridine, adenosine triphosphoric acid, L-malic acid, alimemazine, allithiamine, allyl isothiocyanate, aminoethanol, apyzine, apiole, azatadine, 10 alprenolol, ethinazone, benzoyl peroxide, benzyl alcohol, bisabolol, bisnorephedrine, butacetoluide, benactyzine, campher, colecalciferol, chloroalhydrate, clemastine, chlorobutanol, capsaicine, cyclopentamide, clotubinol, chamazulene, dimethocaine, codeine, chloropromazine, quinine, 15 chlorothymol, cyclophosphamide, cinchocaine, chloroambuzile, chlorophenesine, diethyl ethane, divinyl ethane, dexchloropheniramine, dioprostone, dixyrazine, ephedrine, ethosuximide, enallyl propylmal, emyl camate, erytrol tetranitrate, emetine, enflurane, eucalypotol, etofenamate, 20 ethylmorphine, fentanyl, fluanison, guaiazulene, halothane, hyoscyamine, histamine, fencarbamide, hydroxycaine, hexyl resorcin, isoaminile citrate, isosorbide dinitrate, ibuprofene, iodine, iodoform, isoaminile, lidocaine, lopirine, levamisol, methadone, methyprylone, methyl phenidate, 25 mephenesine, methylephedrine, meclastine, methopromazine, mesuximide, nicethamide, norpseudoephedrine, menthol, methoxy flurane, methyl pentynol, metixene, misoprostol, oxytetracaine, oxyprenolol, oxyphene butazone, oxychinoline, pinene, prolintane, procyclidine, piperazine, pivazide, 30 phensuximide, procaine, phenindaraine, promethazine, pentetrazol, profene amine, perazine, resochine, scopolamine, salicylic acid ester, sparteine, trichloroethylene, timolol, trifluoperazine, tetracaine, trimipramine, tranyl cypromine, trimethadione, tybamate, thymol, thioridazine, valproic acid, 35 verapamile, as well as additional active substances, which are familiar to the person skilled in the art and are absorbable via the skin, including mucous membranes. This list of course is not conclusive.

Typical compositions for hot melt pressure sensitive adhesives 5 to be used are those which are produced from between 10 and 80% by wt., preferably 20 to 80% by wt. and especially preferably 20 to 50% by wt., polymer, between 10 and 80% by wt., preferably between 15 to 60% by wt., plasticizer, between 1 and 80% by wt., preferably 15 to 60% by wt. tackifier, 10 optionally 0.1 to 5% by wt. anti-ager and optionally 0 to 70% by wt. filler materials, the sum of the percentages of the components always being 100.

It is preferred that the hot melt pressure sensitive adhesive has 10 to 50% by wt. styrene-isoprene-styrene synthesis 15 rubber, as is commercially obtainable, for example, under the name CARIFLEX TR 1107 belonging to SHELL; between 10 and 80% by wt. of a hydrated alcohol, such as is obtainable, for example, under the name ABITOL belonging to HERCULES; between 10 and 80% by wt. of a hydrocarbon resin, e.g. the HERCURES C 20 resin belonging to HERCULES; between 1 and 40% by wt. of esters of vegetable fatty acids, e.g. MIGLYOL 812 belonging to DYNAMIT NOBEL; and optionally up to 5% by wt. anti-ager, such as hydroquinone, etc., as well as up to 70% by wt. filler materials.

In an alternative, preferred embodiment of the invention, the hot melt pressure sensitive adhesive has 10 to 50% by wt. of a polycaprolactone, e.g. CAPA 650 belonging to INTEROX; between 10 and 80% by wt. of a hydrated alcohol, e.g. ABITOL belonging to HERCULES; between 10 and 80% by wt. of a 30 hydrocarbon resin, e.g. HERCURES C belonging to HERCULES; between 1 and 40% by wt. of esters of vegetable fatty acids, e.g. MIGLYOL 812 belonging to DYNAMIT NOBEL; and optionally up to 5% by wt. anti-ager, as well as up to 70% by wt. filler materials.

It may also be preferred that the hot melt pressure sensitive adhesive has 10 to 50% by wt. polyethylene vinylacetate, such 5 as EVATANE 28-25 belonging to ATOCHEM, between 10 and 80% by wt. of a hydrated alcohol, e.g. ABITOL belonging to HERCULES, between 10 and 80% by wt. of, a hydrocarbon resin, e.g. the HERCURES C resin belonging to HERCULES, between 1 and 40% by wt. of esters of vegetable fatty acids, e.g. MIGLYOL 812 10 belonging to DYNAMIT NOBEL, and optionally up to 5% by wt. anti-ager, such as hydroquinone, etc., as well as up to 70% by wt. filler materials.

A suitable hot melt pressure sensitive adhesive may have 10 to 50% by wt. polyurethane, such as, e.g. LUPHEN P 1110 belonging 15 to BASF, between 10 and 80% by wt. of a hydrated alcohol, e.g. ABITOL belonging to HERCULES, between 10 and 80% by wt. of a hydrocarbon resin, e.g. the HERCURES C resin belonging to HERCULES; between 1 and 40% by wt. of esters of vegetable fatty acids, e.g. MIGLYOL 812 belonging to DYNAMIT NOBEL, and 20 optionally up to 5% by wt. anti-ager, as well as up to 70% by wt. filler materials.

It is also possible for the hot melt pressure sensitive adhesive to have 10 to 50% by wt. polyamide, such as, for example, EURELON 930 belonging to SCHERING, between 10 and 80% 25 by wt. of a hydrated alcohol, for example, ABITOL belonging to HERCULES, between 10 and 80% by wt. of a hydrocarbon resin, for example, the HERCURES C resin belonging to HERCULES; between 1 and 40% by wt. of esters of vegetable fatty acids, for example, MIGLYOL 812 belonging to DYNAMIT NOBEL, and 30 optionally up to 5% by wt. anti-ager, as well as up to 70% by wt. filler materials.

A hot melt pressure sensitive adhesive may also be used with 10 to 50% by wt. epoxide, such as, for example, EUREPOX 7001 belonging to SCHERING, between 10 and 80% by wt. of a hydrated alcohol, for example, ABITOL belonging to HERCULES, between 5 10 and 80% by wt. of a hydrocarbon resin, for example, the HERCURES C resin belonging to HERCULES, between 1 and 40% by wt. of esters of vegetable fatty acids, for example, MIGLYOL 812 belonging to DYNAMIT NOBEL, and optionally up to 5% by wt. anti-ager, such as hydroquinone, etc., as well as up to 70% by 10 wt. filler materials.

An additional hot melt pressure sensitive adhesive, which can be used for producing transdermal systems of the invention, has 10 to 50% by wt. polyisobutene with a viscous-adhesive, rubber-like consistency, such as, for example, OPPANOL B 50 15 belonging to BASF, between 10 and 80% by wt. of a hydrated alcohol, e.g. ABITOL belonging to HERCULES, between 10 and 80% by wt. of a hydrocarbon resin, for example the HERCURES C resin belonging to HERCULES; between 1 and 40% by wt. of esters of vegetable fatty acids, e.g. MIGLYOL 812 belonging to 20 DYNAMIT NOBEL, and optionally up to 5% by wt. anti-ager, as well as up to 70% by wt. filler materials.

Finally, it is preferred to use hot melt pressure sensitive adhesives, which are based on polyester and have, for example, between 10 to 80% by wt. of a hydrated alcohol, for example 25 ABITOL belonging to HERCULES, between 10 and 80% by wt. of a hydrocarbon resin, e.g. the HERCURES C resin belonging to HERCULES; between 1 and 40% by wt. of esters of vegetable fatty acids, for example, MIGLYOL 812 belonging to DYNAMIT NOBEL, and optionally up to 5% by wt. anti-ager, as well as 30 up to 70% by wt. filler materials.

Furthermore, devices according to the invention may also have one or more substance deposits, in which the substance is present with a concentration higher than the active substance containing layer of hot melt pressure sensitive adhesive, whereby higher doses of the substance may be processed and, in consequence, the device may remain longer in operation before it has to be changed. Typical embodiments are found, for 5 example, in DE-OS 36 29 304.0. Preferred embodiments of the invention are mentioned in the sub-claims, to which reference is expressly made hereby.

Additional features and advantages of the invention are explained hereinafter with reference to the accompanying 10 drawing. In the drawings Fig. 1 is a schematically illustrated cross-sectional view through the layers of a device according to the invention with a substance deposit; Fig. 2 is a schematically illustrated cross-sectional 15 view through an alternative device according to the invention with an active substance deposit; and Fig. 3 is a schematically illustrated cross-sectional view through an alternative embodiment of a device according to the invention without a substance deposit.

Fig. 1 illustrates a device according to the invention, which is here in the form of a plaster-like, active substance containing, transdermal, therapeutic system. It has a layer 12 of hot melt pressure sensitive adhesive, a deposit 14 of active substance, in which the active substance has at least a higher concentration than in the layer 12 of hot melt pressure sensitive adhesive, as well as an active substance impermeable carrier 10, on which the deposit 14 of active substance rests, and is adhered to the skin 18. Active substance now travels continuously at a predetermined rate through the skin 18, whereby the active substance content in the layer 12 decreases. The reduction in active substance is compensated for by active substance flowing subsequently from the deposit 14 of active substance, so that an equilibrium concentration of the active substance in the layer 12 of hot melt pressure sensitive adhesive prevails over a 5 predeterminable period of time, such concentration ensuring the release of a constant quantity of active substance to the skin 18.

Fig. 2 illustrates an alternative embodiment of a device according to the invention, wherein a deposit 14 of active 10 substance is surrounded on all sides by the layer 12 of hot melt pressure sensitive adhesive. This embodiment is especially suitable when a large area of contact between the deposit of active substance and the layer of hot melt pressure sensitive adhesive is desired for a rapid release of active 15 substance to the layer of hot melt pressure sensitive adhesive.

Fig. 3 illustrates an alternative, simple embodiment of a device according to the invention, wherein an active substance containing layer 12 of hot melt pressure sensitive adhesive is 20 applied to an impermeable carrier material 10 in such a manner that the carrier material 10 covers the layer 12 on three sides. It is adhered to the skin by the free surface of hot melt pressure sensitive adhesive, so that a whole-surface contact is ensured over the application period, and the 25 transition of the active substance to the skin is always effected over a constant area at a constant rate.

The production, which has been improved by the invention, of a device according to the invention is described hereinafter.

A mixture of the components of the hot melt pressure sensitive 30 adhesive and the substance to be processed is initially produced. This mixture is brought to processing temperature and then applied to a carrier material from the melt. Further processing, such as applying an adhesive protective layer material, is effected in the usual manner.

List of reference numerals. carrier 12 layer of hot melt pressure sensitive adhesive 14 deposit for the substance to be released 18 skin *

Claims (13)

1. Device for the release of substances from hot melt pressure sensitive adhesives having a non-uniform or uniform distribution of the substances in the hot melt 5 pressure sensitive adhesives, characterised in that a mixture of hot melt pressure sensitive adhesive and substance or a solution of the substance in the hot melt pressure sensitive adhesive is present, the hot melt pressure sensitive adhesive having a processing 10 temperature of between 40 and 80°C, preferably between 40 and 60°C and especially preferably between 40 and 55°C.

2. Devices according to claim 1, characterised in that the hot melt pressure sensitive adhesive, having the substance(s) to be released, is present as one or more 15 layers.

3. Device according to one of claims 1 or 2, characterised in that the hot melt pressure sensitive adhesive is provided with a carrier, which is permeable or impermeable to the substance(s) to be released. 20

4. Device according to one of the preceding claims, characterised in that the hot melt pressure sensitive adhesive is produced on the basis of styrene-isoprene-styrene block polymers, polycaprolactones, ethylene-vinylacetate copolymers, polyurethane, polyepoxides, 25 polyisobutene, polyvinyl ethers, optionally with the addition of plasticizers, tackifiers, filler materials, anti-agers, and/or thixotropic agents.

5. Device according to claim 4, characterised in that the hot melt pressure sensitive adhesive is produced from 30 between 10 and 80% by wt., preferably 20 to 80% by wt. and especially preferably 20 to 50% by wt., polymer, - 18 - between 1 and 80% by wt., preferably 1 to 60% by wt., plasticizer, between 10 and 80% by wt., preferably 15 to 60% by wt., tackifier, optionally 0.1 to 5% by wt. anti-agers and optionally 0 to 70% by wt. filler materials, the sum of the percentages of the components always being 100.

6. Device according to one of the preceding claims characterised in that it has a removable protective layer.

7. Method of producing a device according to one of the preceding claims, characterised by continuously or discontinuously applying a molten mixture of hot melt pressure sensitive adhesive and substance to be released at a temperature of the mixture of between 40 and 80°C, preferably 40 to 60°C and especially preferably 45 and 55°C, to a carrier and optionally applying a protective layer material.

8. Method of producing a device according to one of claims 1 to 6, characterised by continuously or discontinuously applying a molten mixture of hot melt pressure sensitive adhesive and substance to be released at a temperature of the mixture of between 40 and 80°C, preferably 40 to 60°C and especially preferably 45 and 55°C, to a protective layer material and optionally applying the carrier.

9. Method of producing a device according to one of claims 7 or 8, characterised in that the formation of the components of the device, which have hot melt pressure sensitive adhesives with a processing temperature of between 40 and 80°C, is effected by extrusion, moulding, roller application, knife application, spraying or by a printing process. - 19 -

10. Use of the device according one of claims 1 to 6 in the field of human and veterinary medicine, diagnostics or cosmetics.

11. Use of the device according to claim 10 for the release 5 of temperature-sensitive and/or highly volatile substance.

12. A device substantially as hereinbefore described with reference to the drawings.

13. A method of producing a device substantially as 10 hereinbefore described with reference to the drawings. Dated this 22nd day of August 1988 CRUICKSHANK & CO. Agents for the Applicants 1 Holies Street 15 Dublin 2