IE34642B1 - Improvements in or relating to the fabrication of electrical circuit devices - Google Patents
Improvements in or relating to the fabrication of electrical circuit devicesInfo
- Publication number
- IE34642B1 IE34642B1 IE1205/70A IE120570A IE34642B1 IE 34642 B1 IE34642 B1 IE 34642B1 IE 1205/70 A IE1205/70 A IE 1205/70A IE 120570 A IE120570 A IE 120570A IE 34642 B1 IE34642 B1 IE 34642B1
- Authority
- IE
- Ireland
- Prior art keywords
- conductive
- substrate
- conductive member
- carrier
- bonded
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 7
- 239000004411 aluminium Substances 0.000 abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 3
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- 239000003990 capacitor Substances 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 abstract 2
- 229920001721 polyimide Polymers 0.000 abstract 2
- 239000011343 solid material Substances 0.000 abstract 2
- 238000003466 welding Methods 0.000 abstract 2
- 101100188555 Arabidopsis thaliana OCT6 gene Proteins 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004642 Polyimide Substances 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5381—Crossover interconnections, e.g. bridge stepovers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Combinations Of Printed Boards (AREA)
- Multi-Conductor Connections (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
1315510 Welding by pressure WESTERN ELECTRIC CO Inc 6 Oct 1970 [8 Oct 1969] 47394/70 Heading B3R [Also in Division Hl] An assembly of a substrate carrying a plurality of conductive areas and a conductive member connected to one of the areas and overlying but insulated from another of the areas is made by forming the conductive member on a carrier, registering the carrier with the substrate and pressing the carrier against the substrate to bond ultrasonically or by thermo compression welding the conductive member to the conductive area the conductive member being deformed prior to or during the bonding. Cross-overs.-An aluminium plate 10 is coated with adhesive 12 and a gold layer which is photoetched to leave conductive members 16, 18. Members 16, 18 are punched to recess them into the aluminium which is then registered with the conductive tracks 22 on a substrate 20, Fig. 1D. The members 16, 18 are bonded to the tracks 22 by heat and pressure applied to the substrate 20 and/or plate 10. In a modification, Figs. 2A-2E (not shown), the aluminium plate is replaced by a steel plate apertured or recessed to receive the conductive member and also an integrated circuit. The adhesive layer is replaced by a polyimide film. The film may be copper coated, in which case the conductive member may be produced using a gold etch resist position using a negatively exposed photoresist. The conductive member may comprise several layers of conductor and polyimide to provide power planes, ground planes, &c. In another embodiment, Figs. 4A-4C (not shown) a solid material is applied over the conductive track to be crossed before the crossover is bonded in place. The solid material may then be etched away or if a dielectric left in place. Capacitors.-A thin film capacitor, Fig. 5C produced by forming a bottom electrode 66 and a conductive portion 64 on a substrate 62. The top electrode 72 is formed on a carrier, which after the dielectric 70 has been applied to top or bottom electrode is registered with the substrate and the top electrode is bonded to the conductive portion 64.
[GB1315510A]
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US86485669A | 1969-10-08 | 1969-10-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE34642L IE34642L (en) | 1971-04-08 |
| IE34642B1 true IE34642B1 (en) | 1975-07-09 |
Family
ID=25344227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE1205/70A IE34642B1 (en) | 1969-10-08 | 1970-09-16 | Improvements in or relating to the fabrication of electrical circuit devices |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS509342B1 (en) |
| BE (1) | BE757162A (en) |
| CH (1) | CH528148A (en) |
| DE (1) | DE2049163C3 (en) |
| ES (1) | ES384535A1 (en) |
| FR (1) | FR2065090A5 (en) |
| GB (1) | GB1315510A (en) |
| IE (1) | IE34642B1 (en) |
| NL (1) | NL145718B (en) |
| SE (1) | SE365068B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5377737U (en) * | 1976-11-26 | 1978-06-28 | ||
| DE2823881C3 (en) * | 1978-05-31 | 1982-03-18 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of electrical thin-film circuits for the production of integrated conductor track crossings |
| EP0015100B1 (en) * | 1979-02-26 | 1983-08-17 | National Research Development Corporation | Method of incorporating a distributed microwave circuit element in a microwave integrated circuit |
| US5699224A (en) * | 1995-10-25 | 1997-12-16 | Rohm Co., Ltd. | Thick-film capacitor and chip-type composite electronic component utilizing the same |
| CN107086095B (en) * | 2017-06-22 | 2023-05-16 | 中国船舶重工集团公司第七0三研究所 | Resistance load kuppe |
-
0
- BE BE757162D patent/BE757162A/en unknown
-
1970
- 1970-09-16 IE IE1205/70A patent/IE34642B1/en unknown
- 1970-09-29 SE SE13180/70A patent/SE365068B/xx unknown
- 1970-10-03 ES ES384535A patent/ES384535A1/en not_active Expired
- 1970-10-05 NL NL707014581A patent/NL145718B/en not_active IP Right Cessation
- 1970-10-06 CH CH1480070A patent/CH528148A/en not_active IP Right Cessation
- 1970-10-06 FR FR7036094A patent/FR2065090A5/fr not_active Expired
- 1970-10-06 GB GB4739470A patent/GB1315510A/en not_active Expired
- 1970-10-07 DE DE2049163A patent/DE2049163C3/en not_active Expired
- 1970-10-08 JP JP45087957A patent/JPS509342B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| SE365068B (en) | 1974-03-11 |
| JPS509342B1 (en) | 1975-04-11 |
| DE2049163C3 (en) | 1978-07-06 |
| BE757162A (en) | 1971-03-16 |
| GB1315510A (en) | 1973-05-02 |
| FR2065090A5 (en) | 1971-07-23 |
| CH528148A (en) | 1972-09-15 |
| NL7014581A (en) | 1971-04-14 |
| DE2049163A1 (en) | 1971-04-22 |
| DE2049163B2 (en) | 1977-11-10 |
| IE34642L (en) | 1971-04-08 |
| ES384535A1 (en) | 1974-06-01 |
| NL145718B (en) | 1975-04-15 |
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