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ID26138A - Peralatan pengumpan jet solder dan metoda penyolderan - Google Patents

Peralatan pengumpan jet solder dan metoda penyolderan

Info

Publication number
ID26138A
ID26138A IDP20000453A ID20000453A ID26138A ID 26138 A ID26138 A ID 26138A ID P20000453 A IDP20000453 A ID P20000453A ID 20000453 A ID20000453 A ID 20000453A ID 26138 A ID26138 A ID 26138A
Authority
ID
Indonesia
Prior art keywords
adsignment
collection equipment
jet solder
solder collection
jet
Prior art date
Application number
IDP20000453A
Other languages
English (en)
Inventor
Masuo Koshi
Tadahiko Sugimoto
Hiroaki Nakayama
Kenichirou Todoroki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of ID26138A publication Critical patent/ID26138A/id

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Nozzles (AREA)
IDP20000453A 1999-05-27 2000-05-25 Peralatan pengumpan jet solder dan metoda penyolderan ID26138A (id)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14738899 1999-05-27
JP2000123391A JP2001044614A (ja) 1999-05-27 2000-04-25 はんだ噴流装置およびはんだ付け方法

Publications (1)

Publication Number Publication Date
ID26138A true ID26138A (id) 2000-11-30

Family

ID=26477947

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP20000453A ID26138A (id) 1999-05-27 2000-05-25 Peralatan pengumpan jet solder dan metoda penyolderan

Country Status (7)

Country Link
US (1) US6257482B1 (id)
JP (1) JP2001044614A (id)
KR (1) KR20010029749A (id)
CN (1) CN1112273C (id)
DE (1) DE10025899A1 (id)
ID (1) ID26138A (id)
MY (1) MY117223A (id)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3547377B2 (ja) * 1999-11-01 2004-07-28 松下電器産業株式会社 半田噴流装置および半田付け方法
US20080302861A1 (en) * 2007-06-11 2008-12-11 Szymanowski Richard A Method and apparatus for wave soldering an electronic substrate
US20100065610A1 (en) * 2008-09-15 2010-03-18 Richard Anthony Szymanowski Wide wave apparatus for soldering an electronic assembly
EP2413677B1 (en) * 2009-03-24 2013-07-31 Senju Metal Industry Co., Ltd. Localized jet soldering device and partial jet soldering method
DE202009010159U1 (de) * 2009-07-28 2010-12-30 Seho Systemtechnik Gmbh Lötdüse für eine Wellenlötvorrichtung
GB2483265B (en) * 2010-09-01 2018-03-28 Pillarhouse Int Ltd Soldering nozzle
DE102013110731B3 (de) * 2013-09-27 2014-11-06 Ersa Gmbh Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten
US9370838B2 (en) * 2014-08-21 2016-06-21 Illinois Tool Works Inc. Wave soldering nozzle system and method of wave soldering
CN104881565B (zh) * 2014-11-26 2017-12-29 武汉理工大学 考虑空间作用的线性变截面柱的稳定承载力计算方法
CN105375157B (zh) * 2015-10-16 2018-04-10 富士康(昆山)电脑接插件有限公司 电连接器及其组件

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4032328A1 (de) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern
US5779971A (en) * 1996-06-07 1998-07-14 Hewlett-Packard Company Solder jet printhead

Also Published As

Publication number Publication date
MY117223A (en) 2004-05-31
CN1112273C (zh) 2003-06-25
KR20010029749A (ko) 2001-04-16
JP2001044614A (ja) 2001-02-16
US6257482B1 (en) 2001-07-10
CN1277899A (zh) 2000-12-27
DE10025899A1 (de) 2000-12-14

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