HK49576A - Electroless deposition of copper - Google Patents

Electroless deposition of copper

Info

Publication number: HK49576A
Authority: HK; Hong Kong
Prior art keywords: copper; electroless deposition; electroless; deposition
Prior art date: 1969-10-16

Application number

HK495/76*UA

Original Assignee

Philips Electronic Associated

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-10-16

Filing date

1976-07-29

Publication date

1976-08-06

1976-07-29 Application filed by Philips Electronic Associated filed Critical Philips Electronic Associated

1976-08-06 Publication of HK49576A publication Critical patent/HK49576A/en

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde

Landscapes

Chemical & Material Sciences (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

HK495/76*UA 1969-10-16 1976-07-29 Electroless deposition of copper HK49576A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL6915718A NL6915718A (en)	1969-10-16	1969-10-16

Publications (1)

Publication Number	Publication Date
HK49576A true HK49576A (en)	1976-08-06

Family

ID=19808149

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK495/76*UA HK49576A (en)	1969-10-16	1976-07-29	Electroless deposition of copper

Country Status (11)

Country	Link
US (1)	US3804638A (en)
AT (1)	AT311145B (en)
AU (1)	AU2101370A (en)
BE (1)	BE757573A (en)
CA (1)	CA947458A (en)
CH (1)	CH550255A (en)
DE (1)	DE2049061C3 (en)
FR (1)	FR2065996A5 (en)
GB (1)	GB1330332A (en)
HK (1)	HK49576A (en)
NL (1)	NL6915718A (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5627594B2 (en) *	1975-03-14	1981-06-25
US4171225A (en)	1976-01-23	1979-10-16	U.S. Philips Corporation	Electroless copper plating solutions
US4211564A (en) *	1978-05-09	1980-07-08	Hitachi, Ltd.	Chemical copper plating solution
US4301196A (en) *	1978-09-13	1981-11-17	Kollmorgen Technologies Corp.	Electroless copper deposition process having faster plating rates
US4303443A (en) *	1979-06-15	1981-12-01	Hitachi, Ltd.	Electroless copper plating solution
JPS56156749A (en) *	1980-05-08	1981-12-03	Toshiba Corp	Chemical copper plating solution
CA1184359A (en) *	1981-10-23	1985-03-26	Donald A. Arcilesi	Metallic impurity control for electroless copper plating
IT1157006B (en) *	1982-03-09	1987-02-11	Alfachimici Spa	STABILIZING MIXTURE FOR A CHEMICAL COPPER BATH
US4548644A (en) *	1982-09-28	1985-10-22	Hitachi Chemical Company, Ltd.	Electroless copper deposition solution
DE3473890D1 (en) *	1983-07-25	1988-10-13	Hitachi Ltd	Electroless copper plating solution
US4908242A (en) *	1986-10-31	1990-03-13	Kollmorgen Corporation	Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US5925403A (en) *	1994-01-31	1999-07-20	Matsushita Electric Works, Ltd.	Method of coating a copper film on a ceramic substrate
US6852152B2 (en) *	2002-09-24	2005-02-08	International Business Machines Corporation	Colloidal seed formulation for printed circuit board metallization
US20050016416A1 (en) *	2003-07-23	2005-01-27	Jon Bengston	Stabilizer for electroless copper plating solution
TWI335632B (en) *	2003-09-19	2011-01-01	Applied Materials Inc	Apparatus and method of detecting the electroless deposition endpoint
US20050067297A1 (en) *	2003-09-26	2005-03-31	Innovative Technology Licensing, Llc	Copper bath for electroplating fine circuitry on semiconductor chips
US20060062897A1 (en) *	2004-09-17	2006-03-23	Applied Materials, Inc	Patterned wafer thickness detection system
EP1734156B1 (en) *	2005-06-10	2017-03-01	Enthone, Inc.	Process for the direct metallization of nonconductive substrates
US20160273112A1 (en) *	2013-03-27	2016-09-22	Atotech Deutschland Gmbh	Electroless copper plating solution
US10060034B2 (en)	2017-01-23	2018-08-28	Rohm And Haas Electronic Materials Llc	Electroless copper plating compositions
US10655227B2 (en)	2017-10-06	2020-05-19	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
US10294569B2 (en)	2017-10-06	2019-05-21	Rohm And Haas Electronic Materials Llc	Stable electroless copper plating compositions and methods for electroless plating copper on substrates
CN110498532A (en) *	2019-08-15	2019-11-26	深南电路股份有限公司	The processing method and processing unit of printed wiring board waste water
CN113388829A (en) *	2021-06-11	2021-09-14	惠州金晟新电子科技有限公司	Electroless copper plating solution and method for plating copper on substrate by using electroless copper plating solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3075856A (en) *	1958-03-31	1963-01-29	Gen Electric	Copper plating process and solution
US3300335A (en) *	1963-11-20	1967-01-24	Dow Chemical Co	Electroless metal plating with foam
US3485643A (en) *	1966-05-06	1969-12-23	Photocircuits Corp	Electroless copper plating
US3472664A (en) *	1966-09-15	1969-10-14	Enthone	Inhibiting stardusting in electroless copper plating
US3515563A (en) *	1967-12-28	1970-06-02	Photocircuits Corp	Autocatalytic metal plating solutions

0
- BE BE757573D patent/BE757573A/en not_active IP Right Cessation
1969
- 1969-10-16 NL NL6915718A patent/NL6915718A/xx unknown
1970
- 1970-10-06 DE DE2049061A patent/DE2049061C3/en not_active Expired
- 1970-10-13 AU AU21013/70A patent/AU2101370A/en not_active Expired
- 1970-10-13 CA CA095,339A patent/CA947458A/en not_active Expired
- 1970-10-13 CH CH1511570A patent/CH550255A/en not_active IP Right Cessation
- 1970-10-13 GB GB4859070A patent/GB1330332A/en not_active Expired
- 1970-10-13 AT AT922170A patent/AT311145B/en not_active IP Right Cessation
- 1970-10-15 FR FR7037240A patent/FR2065996A5/fr not_active Expired
1972
- 1972-04-06 US US00241806A patent/US3804638A/en not_active Expired - Lifetime
1976
- 1976-07-29 HK HK495/76*UA patent/HK49576A/en unknown

Also Published As

Publication number	Publication date
DE2049061B2 (en)	1980-07-24
AT311145B (en)	1973-10-25
US3804638A (en)	1974-04-16
DE2049061A1 (en)	1971-04-29
CH550255A (en)	1974-06-14
CA947458A (en)	1974-05-21
GB1330332A (en)	1973-09-19
NL6915718A (en)	1971-04-20
FR2065996A5 (en)	1971-08-06
DE2049061C3 (en)	1981-04-30
BE757573A (en)	1971-04-15
AU2101370A (en)	1972-04-20

Publication	Publication Date	Title
HK49576A (en)	1976-08-06	Electroless deposition of copper
CA927220A (en)	1973-05-29	Electroless metal deposition
CA923252A (en)	1973-03-27	Electroless metal deposition
IL41331A0 (en)	1973-03-30	Electroless copper plating
CA922056A (en)	1973-03-06	Electroless copper plating solution and process
CA925252A (en)	1973-05-01	Dual and multiple complexers for electroless plating baths
YU34223B (en)	1979-02-28	Process for the electroless deposition of metal
IL34975A0 (en)	1970-09-17	Metal plating of substrates
AU424078B2 (en)	1971-07-01	Electroless copper plating
AU429168B2 (en)	1971-02-04	Electroless; copper plating
AU6536869A (en)	1971-07-01	Electroless copper plating
CA829773A (en)	1969-12-16	Method of electroless plating
AU5865769A (en)	1971-02-04	Electroless; copper plating
CA807060A (en)	1969-02-25	Electroless metal plating
AU435134B2 (en)	1973-04-30	Method of electroless plating
AU422357B2 (en)	1970-12-03	Electroless copper plating solution
CA936304A (en)	1973-11-06	Electroless copper plating
CA838568A (en)	1970-04-07	Electroless copper plating
AU430890B2 (en)	1973-01-04	Electroless copper plating
CA859001A (en)	1970-12-22	Electroless copper plating
CA797118A (en)	1968-10-22	Electroless copper plating
CA779168A (en)	1968-02-27	Electroless copper plating
AU428073B2 (en)	1970-06-18	Electroless copper plating
AU444903B2 (en)	1972-04-20	Electroless copper plating solution and process
CA807575A (en)	1969-03-04	Low temperature electroless plating