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HK49482A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
HK49482A
HK49482A HK494/82A HK49482A HK49482A HK 49482 A HK49482 A HK 49482A HK 494/82 A HK494/82 A HK 494/82A HK 49482 A HK49482 A HK 49482A HK 49482 A HK49482 A HK 49482A
Authority
HK
Hong Kong
Prior art keywords
semi
conductor device
conductor
Prior art date
Application number
HK494/82A
Original Assignee
Seiko Instr & Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instr & Electronics filed Critical Seiko Instr & Electronics
Publication of HK49482A publication Critical patent/HK49482A/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
HK494/82A 1975-05-23 1982-11-25 Semi-conductor device HK49482A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062193A JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device

Publications (1)

Publication Number Publication Date
HK49482A true HK49482A (en) 1982-12-03

Family

ID=13193055

Family Applications (1)

Application Number Title Priority Date Filing Date
HK494/82A HK49482A (en) 1975-05-23 1982-11-25 Semi-conductor device

Country Status (3)

Country Link
JP (1) JPS51138179A (en)
GB (1) GB1552144A (en)
HK (1) HK49482A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2046024B (en) * 1979-03-30 1983-01-26 Ferranti Ltd Circuit assembly
US4484213A (en) * 1982-02-19 1984-11-20 Solitron Devices, Inc. Binary weighted resistor and package
FR2524707B1 (en) * 1982-04-01 1985-05-31 Cit Alcatel METHOD OF ENCAPSULATION OF SEMICONDUCTOR COMPONENTS, AND ENCAPSULATED COMPONENTS OBTAINED
JPS59171152A (en) * 1983-03-17 1984-09-27 Nec Corp Semiconductor device
FR2818404B1 (en) * 2000-12-19 2003-03-21 Valeo Climatisation METHOD FOR PROGRAMMING THE ADDRESS OF A DEVICE AND DEVICE FOR ITS IMPLEMENTATION

Also Published As

Publication number Publication date
JPS5619101B2 (en) 1981-05-06
GB1552144A (en) 1979-09-12
JPS51138179A (en) 1976-11-29

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