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HK1257184A1 - 膜卷裝體和膜卷裝體的製造方法 - Google Patents

膜卷裝體和膜卷裝體的製造方法

Info

Publication number
HK1257184A1
HK1257184A1 HK18116121.8A HK18116121A HK1257184A1 HK 1257184 A1 HK1257184 A1 HK 1257184A1 HK 18116121 A HK18116121 A HK 18116121A HK 1257184 A1 HK1257184 A1 HK 1257184A1
Authority
HK
Hong Kong
Prior art keywords
wound body
film
producing
producing film
wound
Prior art date
Application number
HK18116121.8A
Other languages
English (en)
Inventor
Yuta Araki
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1257184A1 publication Critical patent/HK1257184A1/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/14Kinds or types of circular or polygonal cross-section with two end flanges
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/10Adhesives in the form of films or foils without carriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
HK18116121.8A 2015-11-20 2018-12-17 膜卷裝體和膜卷裝體的製造方法 HK1257184A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015228229A JP6640538B2 (ja) 2015-11-20 2015-11-20 フィルム巻装体、及びフィルム巻装体の製造方法
PCT/JP2016/084276 WO2017086441A1 (ja) 2015-11-20 2016-11-18 フィルム巻装体、及びフィルム巻装体の製造方法

Publications (1)

Publication Number Publication Date
HK1257184A1 true HK1257184A1 (zh) 2019-10-18

Family

ID=58717434

Family Applications (1)

Application Number Title Priority Date Filing Date
HK18116121.8A HK1257184A1 (zh) 2015-11-20 2018-12-17 膜卷裝體和膜卷裝體的製造方法

Country Status (6)

Country Link
JP (1) JP6640538B2 (zh)
KR (1) KR102092530B1 (zh)
CN (1) CN108350324B (zh)
HK (1) HK1257184A1 (zh)
TW (1) TWI703077B (zh)
WO (1) WO2017086441A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6223671B2 (ja) * 2012-09-25 2017-11-01 日本オクラロ株式会社 光モジュール
JP7448441B2 (ja) * 2020-08-12 2024-03-12 リンテック株式会社 保護膜形成用シートおよびその製造方法
CN115133184B (zh) * 2021-03-29 2023-10-03 宁德新能源科技有限公司 电芯、电池及用电设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3503735B2 (ja) * 1998-02-26 2004-03-08 住友ベークライト株式会社 異方導電性接着フィルム巻重体
JP4147614B2 (ja) * 1998-04-15 2008-09-10 日立化成工業株式会社 接着剤層を有する巻重体
JP2000144064A (ja) * 1998-11-12 2000-05-26 Hitachi Chem Co Ltd 架橋性接着テープ構造体
WO2010038697A1 (ja) * 2008-09-30 2010-04-08 リンテック株式会社 フィルム剥離方法、光学フィルムの製造方法、フィルム剥離機構及び光学フィルム製造装置
JP5723138B2 (ja) * 2010-11-12 2015-05-27 デクセリアルズ株式会社 リール体及びその製造方法、接着フィルムの平坦化方法
JP5759168B2 (ja) * 2010-12-24 2015-08-05 デクセリアルズ株式会社 リール体及びリール体の製造方法

Also Published As

Publication number Publication date
KR20180051595A (ko) 2018-05-16
CN108350324B (zh) 2021-03-02
TW201731746A (zh) 2017-09-16
KR102092530B1 (ko) 2020-03-24
JP2017095574A (ja) 2017-06-01
TWI703077B (zh) 2020-09-01
WO2017086441A1 (ja) 2017-05-26
JP6640538B2 (ja) 2020-02-05
CN108350324A (zh) 2018-07-31

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