HK1255356A1 - Connection method - Google Patents

Connection method

Info

Publication number: HK1255356A1
Authority: HK; Hong Kong
Prior art keywords: connection method; connection
Prior art date: 2015-12-14

Application number

HK18114495.1A

Other languages

Chinese (zh)

Inventor

稻瀨圭亮

Original Assignee

迪睿合株式會社

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-12-14

Filing date

2018-11-14

Publication date

2019-08-16

2018-11-14 Application filed by 迪睿合株式會社 filed Critical 迪睿合株式會社

2019-08-16 Publication of HK1255356A1 publication Critical patent/HK1255356A1/en

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)
Wire Bonding (AREA)
Combinations Of Printed Boards (AREA)
Non-Insulated Conductors (AREA)

HK18114495.1A 2015-12-14 2018-11-14 Connection method HK1255356A1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2015243532A JP2017112148A (en)	2015-12-14	2015-12-14	Connection method
PCT/JP2016/085600 WO2017104417A1 (en)	2015-12-14	2016-11-30	Connection method

Publications (1)

Publication Number	Publication Date
HK1255356A1 true HK1255356A1 (en)	2019-08-16

Family

ID=59056367

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
HK18114495.1A HK1255356A1 (en)	2015-12-14	2018-11-14	Connection method

Country Status (6)

Country	Link
JP (1)	JP2017112148A (en)
KR (1)	KR20180040667A (en)
CN (1)	CN108292611A (en)
HK (1)	HK1255356A1 (en)
TW (1)	TW201724925A (en)
WO (1)	WO2017104417A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2020041032A (en) *	2018-09-07	2020-03-19	デクセリアルズ株式会社	Manufacturing method of connection structure and connection film
CN114585251A (en) *	2022-02-16	2022-06-03	深圳市华星光电半导体显示技术有限公司	Binding device and binding method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3801666B2 (en) *	1995-05-22	2006-07-26	日立化成工業株式会社	Electrode connection method and connection member used therefor
JP2003064324A (en) *	2001-06-11	2003-03-05	Hitachi Chem Co Ltd	Anisotropic electroconductive adhesive film, connection method for circuit board using the same and circuit board connected body
JP2005101125A (en) *	2003-09-24	2005-04-14	Seiko Epson Corp	Semiconductor device manufacturing method, semiconductor device, circuit board, and electronic apparatus
JP2005235530A (en) *	2004-02-18	2005-09-02	Hitachi Chem Co Ltd	Circuit connection material
JP2008282978A (en) *	2007-05-10	2008-11-20	Toshiba Matsushita Display Technology Co Ltd	Mounting method of semiconductor element, and manufacturing method of liquid crystal display panel
JP2009186707A (en) *	2008-02-06	2009-08-20	Seiko Epson Corp	Electro-optical device manufacturing method, electro-optical device
CN101724361B (en) *	2008-12-30	2011-12-07	四川虹欧显示器件有限公司	Aeolotropic conductive adhesive and conductive film and electric connection method thereof
WO2011024720A1 (en) *	2009-08-26	2011-03-03	積水化学工業株式会社	Method for manufacturing connection structure
JP5333863B2 (en) *	2009-08-26	2013-11-06	株式会社ジェイテクト	Rotation angle detector
JP6259177B2 (en) *	2012-04-16	2018-01-10	早川ゴム株式会社	Method for bonding anisotropic conductive film
JP2014096531A (en) *	2012-11-12	2014-05-22	Dexerials Corp	Method for manufacturing connection structure and connection method
JP6425899B2 (en) *	2014-03-11	2018-11-21	デクセリアルズ株式会社	ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING CONNECTION AND METHOD FOR CONNECTING ELECTRONIC COMPONENTS

2015
- 2015-12-14 JP JP2015243532A patent/JP2017112148A/en active Pending
2016
- 2016-11-30 WO PCT/JP2016/085600 patent/WO2017104417A1/en active Application Filing
- 2016-11-30 CN CN201680069948.XA patent/CN108292611A/en not_active Withdrawn
- 2016-11-30 KR KR1020187007248A patent/KR20180040667A/en not_active Ceased
- 2016-12-06 TW TW105140203A patent/TW201724925A/en unknown
2018
- 2018-11-14 HK HK18114495.1A patent/HK1255356A1/en unknown

Also Published As

Publication number	Publication date
WO2017104417A1 (en)	2017-06-22
KR20180040667A (en)	2018-04-20
TW201724925A (en)	2017-07-01
JP2017112148A (en)	2017-06-22
CN108292611A (en)	2018-07-17

Publication	Publication Date	Title
GB201516047D0 (en)	2015-10-28	Method
GB201502645D0 (en)	2015-04-01	Method
GB201502810D0 (en)	2015-04-08	Method
GB201518263D0 (en)	2015-12-02	Method
GB201517450D0 (en)	2015-11-18	Method
EP3265120C0 (en)	2023-07-05	Method
GB201516056D0 (en)	2015-10-28	Method
GB201501941D0 (en)	2015-03-25	Method
GB201506870D0 (en)	2015-06-03	Method
GB201500427D0 (en)	2015-02-25	Method
GB201506869D0 (en)	2015-06-03	Method
GB201507581D0 (en)	2015-06-17	Method
GB201501565D0 (en)	2015-03-18	Method
GB201517386D0 (en)	2015-11-18	Method
GB201510649D0 (en)	2015-07-29	Method
HK1255356A1 (en)	2019-08-16	Connection method
GB201503792D0 (en)	2015-04-22	Method
GB201509961D0 (en)	2015-07-22	Method
GB201502409D0 (en)	2015-04-01	Method
GB201506315D0 (en)	2015-05-27	Method
GB201517634D0 (en)	2015-11-18	Method
GB201517618D0 (en)	2015-11-18	Method
GB201515921D0 (en)	2015-10-21	Method
GB201515716D0 (en)	2015-10-21	Method
GB201515711D0 (en)	2015-10-21	Method