HK1250118A1 - Method for manufacturing shield printed wiring board - Google Patents
Method for manufacturing shield printed wiring boardInfo
- Publication number
- HK1250118A1 HK1250118A1 HK18109513.9A HK18109513A HK1250118A1 HK 1250118 A1 HK1250118 A1 HK 1250118A1 HK 18109513 A HK18109513 A HK 18109513A HK 1250118 A1 HK1250118 A1 HK 1250118A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- wiring board
- printed wiring
- shield printed
- manufacturing shield
- manufacturing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015180656 | 2015-09-14 | ||
| PCT/JP2016/004154 WO2017047072A1 (en) | 2015-09-14 | 2016-09-13 | Method for manufacturing shield printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1250118A1 true HK1250118A1 (en) | 2018-11-23 |
Family
ID=58288552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK18109513.9A HK1250118A1 (en) | 2015-09-14 | 2018-07-23 | Method for manufacturing shield printed wiring board |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPWO2017047072A1 (en) |
| KR (1) | KR20180053677A (en) |
| CN (1) | CN108029195A (en) |
| HK (1) | HK1250118A1 (en) |
| TW (1) | TW201722227A (en) |
| WO (1) | WO2017047072A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018199128A1 (en) * | 2017-04-28 | 2018-11-01 | 日東電工株式会社 | Flexible wiring circuit board and imaging device |
| JP7390779B2 (en) | 2017-04-28 | 2023-12-04 | 日東電工株式会社 | Flexible wiring circuit board and imaging device |
| CN107272260B (en) * | 2017-07-19 | 2020-04-21 | 京东方科技集团股份有限公司 | Backlight lamp strip, backlight module and display device |
| CN118612940A (en) * | 2018-12-11 | 2024-09-06 | 拓自达电线株式会社 | Manufacturing method of shielded printed circuit board and shielded printed circuit board |
| KR20210149689A (en) * | 2019-03-29 | 2021-12-09 | 도레이 케이피 필름 가부시키가이샤 | Metallized film and method for manufacturing the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002079771A (en) * | 2000-09-07 | 2002-03-19 | Shinwa Kogyo Kk | Master plate for intaglio offset printing, manufacturing method of the master plate and forming method of film circuit using the master plate |
| JP2006024824A (en) * | 2004-07-09 | 2006-01-26 | Tatsuta System Electronics Kk | Impedance control film, impedance control shield film, and wiring board using them |
| JP2009016545A (en) * | 2007-07-04 | 2009-01-22 | Dainippon Printing Co Ltd | Electromagnetic wave shielding material, its manufacturing method, filter for display device, and its manufacturing method |
| JP4399019B1 (en) * | 2008-07-31 | 2010-01-13 | 株式会社東芝 | Electronic device, flexible printed wiring board, and method for manufacturing flexible printed wiring board |
| CN102693962A (en) * | 2011-03-22 | 2012-09-26 | 精材科技股份有限公司 | Integrated circuit wafer with electromagnetic shielding effect and manufacturing method thereof |
-
2016
- 2016-09-13 JP JP2017540503A patent/JPWO2017047072A1/en active Pending
- 2016-09-13 WO PCT/JP2016/004154 patent/WO2017047072A1/en active Application Filing
- 2016-09-13 CN CN201680053123.9A patent/CN108029195A/en active Pending
- 2016-09-13 KR KR1020187009181A patent/KR20180053677A/en not_active Ceased
- 2016-09-14 TW TW105130002A patent/TW201722227A/en unknown
-
2018
- 2018-07-23 HK HK18109513.9A patent/HK1250118A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180053677A (en) | 2018-05-23 |
| WO2017047072A1 (en) | 2017-03-23 |
| JPWO2017047072A1 (en) | 2018-07-05 |
| CN108029195A (en) | 2018-05-11 |
| TW201722227A (en) | 2017-06-16 |
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