HK1227602B

HK1227602B - Z-directed delay line components for printed circuit boards

Info

Publication number: HK1227602B
Application number: HK16114667.5A
Authority: HK
Inventors: 凯斯．布莱恩．哈丁; 约翰．托马斯．费斯勒; 保罗．凯文．霍尔; 布莱恩．李．娜莉; 罗伯特．亚伦．奥莱斯比
Original assignee: 利盟国际有限公司
Priority date: 2014-02-19
Filing date: 2014-02-19
Publication date: 2017-10-20

Description

Z-direction delay line component for printed circuit board

The present application is a divisional application having an application date of 2011, 21/01, an application number of 201180065356.8, and an invention name of "Z-direction delay line component for printed circuit board".

CROSS-REFERENCE TO RELATED APPLICATIONS

The present patent application relates to U.S. patent application No. 12508131 (attorney docket No. 2008-0295.01) entitled "Z-directed Components for Printed Circuits Boards", U.S. patent application No. 12508145 (attorney docket No. 2009-0117.00) entitled "Z-directed Pass-Through Components for Printed Circuits Boards", U.S. patent application No. 12508158 (attorney docket No. 2009-0118.00) entitled "Z-directed catalyst Components for Printed Circuits Boards", U.S. patent application No. 12508199 (attorney docket No. 2009-0120.00) entitled "Z-directed Components for Printed Circuits Boards", U.S. docket No. 9-12508204 (attorney docket No. 19-12508204) entitled "Z-directed Components for Printed Circuits Boards", and U.S. docket No. 2-12508204 (attorney docket No. 1-12508204) entitled "Z-directed Components for Printed Circuits Boards",no. 2-upright kits for Printed Circuits ", and No. 11 (attorney docket No. 2009-12508204) for Z-0123.00 5), no. 12508248 entitled "Z-directed Variable values for Printed Circuits Boards" (attorney docket No. 2009-0124.00), each of the above U.S. patent applications filed on 23/7 of 2009 and assigned in its entirety to the assignee of the present application.

Statement regarding federally sponsored research or development

None.

Reference to sequence listing or the like

None.

Technical Field

The present invention relates to electronic assemblies, and more particularly to electronic assemblies for insertion into printed circuit boards and methods of assembly.

Background

Printed circuit board ("PCB") manufacturing uses mainly two types of components. The first type is a pin-through-hole feature that uses metal leads soldered to plated through-holes in the PCB. The second type of component is a surface mount component that is located on the surface of the printed circuit board and attached by soldering to pads on the surface. As the density of components has increased and higher operating frequencies have been used, the design of certain circuits has become very difficult to achieve.

Currently, resistors can be embedded between layers of a PCB by applying a resistive material between two copper traces after an etching process in the manufacturing process. A typical 4-layer PCB board consists of two assemblies, each assembly being a two-layer PCB. These are glued together using a material to make a complete assembly. The resistive area may be applied to any layer, making it possible to have a resistive element in an inner layer. However, this takes more time and makes the change difficult to implement.

Disclosure of Invention

The present invention increases the assembly density and the operating frequency, and eliminates the above-described difficulties by allowing the occurrence of insertion of components after the assembly of the multi-layer PCB.

A Z-directed component signal delay line for mounting into a PCB having a mounting hole therein having a depth D, the Z-directed component signal delay line comprising: an insulative body having top, bottom and side surfaces, a cross-sectional shape insertable into the mounting hole of the PCB, and a length L; a signal conductor contained within the body between the top surface and the bottom surface for passing a signal therethrough, and having a length equal to or greater than a length L; and a pair of conductive traces disposed on one of the surfaces of the body, the conductive traces being electrically connected to each end of the signal conductors. The signal conductor is made of one of a dielectric material and a magnetic material. The signal conductor has a length greater than the length L. A pair of conductive traces is disposed on one of the top surface of the body and the bottom surface of the body. Alternatively, one of a pair of conductive traces is disposed on a top surface of the body and the other of the pair of conductive traces is disposed on a bottom surface of the body. In another form at least one of the pair of conductive traces includes a channel in a side surface of the body. The signal conductors may have a plurality of legs connected in a zigzag pattern. In yet another form there is provided a shorting bar positioned across at least two adjacent legs of the signal conductor.

In another form, the signal conductor includes: a plurality of C-shaped conductors arranged generally parallel to one of the top and bottom surfaces of the body and spaced apart from one another; and a plurality of leg segments arranged substantially parallel to the side surfaces of the body, the plurality of C-shaped conductors connected in series by the plurality of vertical leg segments, ends of the leg segments near the top and bottom surfaces of the body connected to respective traces on the top and bottom surfaces on the body. Here, a shielding material arranged within the body between adjacent C-shaped conductors may be provided. Further, a shorting mechanism is provided for electrically shorting together at least two adjacent C-shaped conductors. In yet another form a programmable signal delay line circuit includes a PCB having a plurality of mounting holes, each mounting hole having a depth D therein, and a plurality of conductive traces interconnecting the mounting holes in series; and a plurality of Z-direction signal delay line components, each of which is insertable into one of the mounting holes and interconnected in series. Each signal delay line includes: an insulative body having top, bottom and side surfaces, a cross-sectional shape insertable into the mounting hole of the PCB, and a length L; a signal conductor contained within the body between the top surface and the bottom surface for passing a signal therethrough, and having a length equal to or greater than a length L; and a pair of conductive traces disposed on one of the surfaces of the body, a conductive trace electrically connected to each end of the signal conductor, each of the pair of conductive traces electrically interconnected to a respective one of a plurality of conductive traces of a printed circuit board. Adjusting a signal delay by replacing at least one of the plurality of Z-directed signal delay lines with a signal passing device comprising an insulative body having a top surface, a bottom surface, and side surfaces, a cross-sectional shape insertable into the mounting hole of the PCB, and a length L; a conductor extending through a length of the body between the top and bottom surfaces for passing a signal therethrough; and a pair of conductive traces, one on each of the top and bottom surfaces, electrically connected to an end of the conductor adjacent thereto and extending therefrom toward the edge of the body.

A Z-directed component signal delay line for mounting in a PCB having a mounting hole therein having a depth D, the Z-directed component signal delay line comprising:

an insulative body having top, bottom and side surfaces, a cross-sectional shape insertable into the mounting hole of the PCB, and a length L;

a signal conductor contained within the body between the top surface and the bottom surface for passing a signal therethrough, the signal conductor having a length greater than a length L, the signal conductor comprising:

a plurality of C-shaped conductors arranged generally parallel to one of the top and bottom surfaces of the body and spaced apart from one another; and

a plurality of leg segments arranged substantially parallel to the side surface of the body, the plurality of C-shaped conductors connected in series by the plurality of vertical leg segments, ends of the leg segments near the top and bottom surfaces of the body connected to respective traces on the top and bottom surfaces of the body;

a pair of conductive traces disposed on one of the surfaces of the body, a conductive trace electrically connected to each end of the signal conductor; and

a shorting mechanism for electrically shorting together at least two adjacent C-shaped conductors.

In another form, the shorting mechanism may include one of: at least one shorting bar extending along a length of the body and tangentially contacting each of the plurality of C-shaped conductors; and at least one plating channel extending along a length of a side surface of the body and contacting each of the plurality of C-shaped conductors.

In yet another form the at least one shorting bar may include two shorting bars diametrically opposed to each other.

In yet another form the at least one plating channel may include two plating channels diametrically opposed to each other.

Drawings

The above-mentioned and other features and advantages of various embodiments of the present invention, and the manner of attaining them, will become more apparent and will be better understood by reference to the accompanying drawings, wherein:

FIG. 1 is a diagrammatic representation of one embodiment of a Z-directed component;

FIG. 2 is a block diagram illustrating the internal structure of elements comprising one embodiment of the Z-directed component of FIG. 1;

3A-3F illustrate various shapes of bodies for Z-directed components;

4A-4C illustrate various channel configurations for Z-directed components;

FIGS. 5A-5H illustrate various channel and conductor configurations for the body of the Z-directed component;

6A-6D illustrate various orientation positioning or attachment features of a Z-directed component;

FIGS. 7A and 7B illustrate a Z-directed component having a body with an O-ring for connection to an inner layer of a PCB and having regions constructed of similar or different materials;

FIG. 8 shows various elements or electronic components, such as resistors, diodes, capacitors, which may be disposed within the body of the Z-directed component and in series with the conductors;

FIG. 9 shows a Z-directed component with a 3-terminal transistor connected to two conductors;

FIG. 10 illustrates another embodiment of a Z-directed component having a 3-terminal transistor connected to a conductor and plated via;

FIG. 11 illustrates a cross-sectional view of an embodiment of a Z-directed component flush mounted within the PCB shown in FIG. 12;

FIG. 12 illustrates a top view of the PCB and Z-directed components of FIG. 11 showing conductive traces and connections to the Z-directed components;

FIG. 13 shows a ground return path for the Z-directed component of FIGS. 11 and 12, the Z-directed component further including a decoupling capacitor within the body of the Z-directed assembly;

FIG. 14 is an illustration of a Z-directed component for transferring signal traces from one internal layer of a PCB to another internal layer of the PCB;

FIG. 15 is an illustration of one embodiment of a Z-directed capacitor including semi-cylindrical sheets;

FIG. 16 is an exploded view illustration of another embodiment of a Z-directed capacitor including stacked disks;

17A-17C illustrate alternative embodiments of Z-directed delay lines with transparent surfaces showing connections;

FIG. 18 illustrates a programmable Z-directed delay line circuit having a plurality of Z-directed delay lines showing connected transparent surfaces;

FIGS. 19A-19C illustrate cross-sectional views of a single conductor differential Z-directed ferrite bead, two conductor differential mode Z-directed ferrite beads, and two conductor common mode Z-directed ferrite beads;

FIGS. 20A and 20B illustrate a Z-directed switch assembly that can be rotated to connect predetermined circuit paths in a PCB;

FIG. 20B is a cross-sectional view of the PCB along line 20B-20B of FIG. 19A with the Z-directed switch assembly removed to show internal connection points of the PCB;

FIG. 20C is a diagram showing the Z-directed switch assembly of FIG. 20A with internal electronic components;

FIG. 20D is a top view of the Z-directed switch assembly of FIG. 20C showing an alternative configuration of the channel shape and conductive members and radial projections;

21A-21D illustrate additional features of a Z-directed component for establishing internal connections between traces of different internal layers of a PCB or between traces of a given internal layer, and a test path for inspecting the connections;

FIGS. 22A and 22B illustrate the use of plated side bars and partial insertion of a Z-directed component to change the value or function of the Z-directed component;

FIG. 23 is an illustration of a system for inserting a Z-directed component into a PCB;

FIG. 24 is an illustration of a Z-directed component with glue strips and glue sites for mounting the Z-directed component to a PCB;

fig. 25 is a diagram of a Z-directed component showing a copper seed material and a resist material used in electroplating the Z-directed component.

Detailed Description

The present inventions now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the invention are shown. It is to be understood that the invention is not limited in its application to the details of construction and the arrangements of components set forth in the following description or illustrated in the drawings. This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as being provided such that this disclosure will satisfy applicable legal requirements.

The phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of "including," "comprising," or "having" and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms "connected," "coupled," and "mounted," and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Furthermore, the terms "connected" and "coupled," and variations thereof, are not restricted to physical or mechanical connections or couplings.

As described in subsequent paragraphs, the specific mechanical configurations illustrated in the drawings are intended to exemplify embodiments of the invention and that other alternative mechanical configurations are possible.

This specification describes a family of components intended to be embedded or inserted into a PCB. These components are referred to as Z-directed parts and have been modeled, and basic prototypes (but lacking surface channels) of many of the components described herein are fabricated to establish proof of concept. Not all embodiments described herein are constructed. An overview of how Z-directed components are intended to be formed is provided first, followed by configurations for Z-directed component design, including but not limited to capacitors, delay lines, transistors, switches, and connectors. What follows is a technique that is believed to be useful for assembling PCBs having Z-directed components. The Z-directed components occupy less space on the surface of the PCB and allow higher operating frequencies for high frequency circuits (e.g., clock rates greater than 1000 MHz).

SUMMARY

As used herein, a frame of reference at XYZ is used. The X and Y axes describe the plane of the printed circuit board. The Z-axis describes the direction perpendicular to the plane of the circuit board. The top surface of the PCB has a Z value of zero. A component having a value in the negative Z-direction indicates that the component is inserted into the top surface of the PCB. Such components may be above (extending past), flush, or recessed below the top and/or bottom surfaces of the PCB. A component having positive and negative Z-direction values indicates that the component is partially inserted into the PCB surface. The Z-directed component is intended to be inserted into a hole or recess in a printed circuit board. Depending on its shape and length, more than one Z-component may be inserted into a single mounting hole of the PCB, such as stacked together or placed side-by-side. The hole may be a through hole (a hole from the top surface to the bottom surface), or a well (an opening or recess into the interior or inner layer of the PCB through the top or bottom surface).

As described herein, the Z-directed component is shown inserted into the top surface of the PCB. For a PCB with conductive traces on two outer layers, one outer layer is referred to as the top surface and the other outer layer is referred to as the bottom surface. Further, when only one outer layer has conductive traces, the outer surface is referred to as the top surface. A Z-directed component refers to an assembly having a top surface, a bottom surface, and side surfaces. References to the top and bottom surfaces of the Z-directed component conform to conventions for the top and bottom surfaces of the PCB. The side surface of the Z-directed component is in the Z-direction and will be adjacent to the wall of the mounting hole in the PCB that is also in the Z-direction. This use of top, bottom and sides should not be considered as limiting the manner in which Z-directed components may be mounted into a PCB. Although the components are described herein as being mounted in the Z-direction, this does not mean that such components are limited to insertion into the PCB only along the Z-axis. The Z-directed component may be mounted perpendicular to the plane of the PCB, or at an angle thereto, from the top or bottom surface or both, depending on the thickness of the PCB and the dimensions of the Z-directed component, and even the edge of the PCB interposed between the top and bottom surfaces of the PCB.

The Z-directed component can be made from various combinations of materials commonly used in electronic assemblies. The signal connection path is made from a conductor which is a material having high conductivity. Conductive materials include, but are not limited to, copper, gold, aluminum, silver, tin, lead, and many other metals. By using materials with low electrical conductivity, such as plastic, glass, FR4 (epoxy and fiberglass), air, mica, ceramic, and other materials, the Z-directed component will have areas that need to be insulated from other areas. A Z-directed component constructed as a resistor requires a material with properties between the conductor and the insulator that has a finite resistivity that is the inverse of the electrical conductivity. Materials such as carbon, doped semiconductors, nichrome, tin oxide, and other materials are used for their resistive properties. Capacitors are typically made of two conductive plates separated by an insulating material having a high permittivity (dielectric constant). Permittivity is a parameter that represents the ability to store an electric field in materials such as ceramics, mica, tantalum, and other materials. Inductors are typically made by winding a coil of wire or conductor around a material having a high magnetic permeability. Magnetic permeability is a parameter that represents the ability to store a magnetic field in materials such as iron and alloys of nickel-zinc, manganese-zinc, nickel-iron, and other metals. Both transistors and FETs are electronic devices made of semiconductors that behave in a nonlinear manner and are made of silicon, germanium, gallium arsenide, and other materials. Throughout this application, references are made to discussion of the interchangeability of various materials, properties of materials, or terms used today in the field of material science and electrical component design. Due to the flexibility in how the Z-directed components are constructed and the amount of material that can be used, it is also contemplated that the Z-directed components may be constructed of materials that have not been discovered or created so far. The body of the Z-directed component is generally constructed of a non-conductive material unless otherwise stated in the description with respect to the particular design of the Z-directed component, such as a capacitor.

PCBs using Z-directed components may be constructed with a single conductive layer or multiple conductive layers, as is known. The PCB may have conductive traces on only the top surface, only the bottom surface, and both the top and bottom surfaces. In addition, one or more intermediate inner conductive trace layers may also be present in the PCB.

Connections between the Z-directed components or traces in or on the PCB may be made by soldering techniques, screen printing techniques, extrusion techniques, or electroplating techniques known in the art. Solder paste and component adhesive may also be used depending on the application. In some configurations, a compressible conductive member may be used to interconnect the Z-directed component with conductive traces present on the PCB.

Z-direction component

The most general form of the Z-directed component includes a body having a top surface, a bottom surface, and side surfaces, and a cross-sectional shape of a mounting hole of a given depth D insertable into the PCB, with a portion of the body including an insulator. All embodiments described herein for the Z-directed component are based on this general form.

Fig. 1 and 2 show an embodiment of a Z-directed component. The Z-directed component 10 here includes a generally cylindrical body 12 having a top surface 12t, a bottom surface 12b, a side surface 12s, and a length L generally corresponding to the depth D of the mounting hole. The length L may be less than, equal to, or greater than the depth D. In the first two cases, the Z-directed component 10 will be lower in one case than at least one of the top and bottom surfaces of the PCB and will be flush with both surfaces of the PCB in the other case. If the length L is greater than the depth D, the Z-directed component 10 will not be flush mounted. However, for such a non-flush mounting, the Z-directed component 10 would be able to be used for interconnection to another component or another PCB located nearby. The mounting hole is typically a through hole extending between the top and bottom surfaces of the PCB, but it may also be a blind hole. When recessed below the surface of the PCB, additional resist areas may be required in the holes of the PCB to prevent plating of the entire circumferential area around the holes.

One form of the Z-directed component 10 may have at least one conductor 14 extending through the length of the body 12. At the top and bottom ends 14t, 14b of the conductor 14, top and bottom conductive traces 16t, 16b are disposed in the top and bottom end surfaces 12t, 12b of the body 12 and extend from respective ends of the conductor 14 to the edges of the Z-directed component 10. In the present embodiment, the body 12 comprises a non-conductive material. The body 12 of the Z-directed component 10 may be made of a variety of materials having different properties depending on its function. These properties include conductivity, resistivity, magnetism, dielectricity, semiconductivity, or a combination of the various properties described herein. Examples of materials with the described properties may be copper, carbon, iron, ceramic or silicon, respectively. The body 12 of the Z-directed component 10 may also include some of the different networks needed to operate the circuitry, which will be discussed later.

One or more longitudinally extending channels or wells may also be provided on the side surface of the body of the Z-directed assembly 10. The channel may extend from one of the top and bottom surfaces of the body 12 toward the opposite surface. As shown, two wells or channels 18 and 20 may be provided in the outer surface of the Z-directed component 10, extending along the length of the body 12. When plated or soldered, these vias allow for electrical connection through the PCB to the Z-directed component 10, as well as electrical connection to internal conductive layers within the PCB. The length of the channel 18 or 20 may extend less than the entire length of the body 12.

Fig. 2 shows the same components as in fig. 1, but with all surfaces transparent. The conductor 14 is shown as a cylinder extending through the center of the Z-directed component 10. Other shapes may be used for the conductor 14. It can be seen that traces 16t and 16b extend from the conductor ends 14t and 14b, respectively, to the edge of the body 12, and that connecting the top trace 16t and the bottom trace 16b is a conductor. Although traces 16t and 16b are shown as being aligned with each other (separated by zero degrees), this is not required and they may be positioned as desired for a particular design. For example, traces 16t and 16b may be separated by 180 degrees or 90 degrees and any increment therein.

The body shape may be any shape that can fit into a mounting hole of a PCB. Figures 3A-3F illustrate possible body shapes for the Z-directed component. Fig. 3A shows a body 40 of triangular cross-section, fig. 3B shows a body 42 of rectangular cross-section, fig. 3C shows a frustoconical body 44, fig. 3D illustrates a cylinder 46 of oval cross-section, and fig. 3E shows a cylinder 48. FIG. 3F is a stepped cylinder 50 with one section 52 having a larger diameter than the other section 54. With such an arrangement, the Z-directed component can be mounted on the surface of the PCB while having a portion inserted into a mounting hole provided in the PCB. The edges of the Z-directed components may be chamfered to help align the Z-directed components for insertion into the through holes in the PCB. Other shapes and combinations of those shown can also be used for the Z-directed component.

For Z-directed components, the channels for electroplating can have various cross-sectional shapes and lengths. The only requirement is that the plating or solder material make the correct connections to the Z-directed components and the corresponding conductive traces in or on the PCB. The channels 18 or 20 may have, for example, a V-shaped, C-shaped or U-shaped cross-section, a semi-circular or elliptical cross-section. When more than one channel is provided, each channel may have a different cross-sectional shape. Fig. 4A-4C illustrate three channel shapes. The V-shaped channel 60 is shown in fig. 4A. A U-shaped or C-shaped channel 62 is shown in fig. 4B. In fig. 4C, a channel shape 65 of wavy or irregular cross-section is shown.

The number of layers of the PCB may vary from a single side to over 22 layers and may have different total thicknesses ranging from less than 0.051 inches to 0.093 inches or more. When flush mounting is required, the length of the Z-directed component will depend on the thickness of the PCB that is desired to be inserted. The length of the Z-directed component may also vary with the intended function and process tolerances. The preferred length would be that the Z-directed component is flush with the surface or extends slightly beyond the surface of the PCB. This will prevent the plating solution from plating completely around the inside of the PCB hole, which in some cases can cause a short circuit. A resist material may be added around the inside of the PCB hole to allow plating only in the desired areas. However, there are also cases where it is necessary to fully plate around the inside of the PCB hole above and below the Z-directed component. For example, if the top layer of the PCB is the Vcc plane and the bottom layer is the GND plane, the decoupling capacitors will have a lower impedance if a greater amount of copper is used for the connection.

There are many features that can be added to the Z-directed component to create different mechanical and electrical characteristics. The number of vias or conductors may vary from zero to any number that allows sufficient strength to be maintained to withstand the stresses of insertion, plating, the manufacturing process, and the PCB's operation in its intended environment. The outer surface of the Z-directed component may have a coating to glue it in place. Flanges or radial projections may also be used to prevent over-insertion or under-insertion of the Z-component into the mounting hole, particularly if the mounting hole is a through-hole. Surface coating materials may also be used to promote or retard migration of the plating or soldering material.

The Z-directed component may serve several roles depending on the number of ports or terminals that need to be connected to the PCB. Some possible scenarios are shown in fig. 5A-5H. Fig. 5A is a Z-directed component configured as a 0-port device 70A that acts as an insert, such that if the filter or assembly is optional, the insert prevents the aperture from being plated. After the PCB is manufactured, the 0-port device 70A may be removed and another Z-directed component may be inserted, plated and connected to the circuitry. Fig. 5B-5H illustrate various configurations that may be used for multi-terminal devices such as resistors, diodes, transistors, clock circuits. Fig. 5B shows a 1-port or single signal Z-directed component 70B having conductors 71 connected to top and bottom conductive traces 72t, 72B. Fig. 5C shows a 1-port 1-via Z-directed component 70C in which a plated well or via 73 is provided in addition to conductors 71 and top and bottom conductive traces 72t and 72 b. Fig. 5D shows a Z-directed component 70D having two wells 73 and 75 in addition to a conductor 71 and top and bottom traces 72t, 72 b. The Z-directed component 70E of fig. 5E has three wells 73, 75 and 76 in addition to the conductor 71 and top and bottom traces 72t, 72 b. Fig. 5F shows a Z-directed component 70F having two conductors 71 and 77, each having respective top and bottom traces 72t, 72b and 78t, 78b, and no channels or wells. The Z-direction component 70F is a device for mainly two signals of a differential signal. Fig. 5G shows a Z-directed component 70G having one well 73 and two conductors 71 and 77, each having respective top and bottom traces 72t, 72b and 78t, 78 b. Fig. 5H shows a Z-directed component 70H having one conductor 71 with top and bottom traces 72t, 72b and a blind or partial well 78 extending from the top surface along a portion of the side surface such that the plating material or solder will be allowed to stop at a given depth. To those skilled in the art, the number of wells and signals is limited only by space, required well size, and conductor size.

In most cases, the Z-directed component will need to be oriented correctly when inserted into the PCB. Thus, positioning or orientation features and connection features may be provided. Fig. 6A-6C illustrate examples of such locating features, while fig. 6D illustrates a connecting feature. In fig. 6A, the Z-directed component 80A has a V-shaped notch 81 extending radially outward on the end face. In fig. 6B, the Z-component 80B has a recess 83 with an orientation surface 84 on an end surface of the Z-member 80B. Fig. 6C shows a Z-directed component 80C having an axial projection, peg 85, extending axially outward from the end surface and having an orientation surface 86. Ink markings or other visual or magnetic indicators on the end surface or side of the Z-directed component may also be used to orient the Z-directed component, such as when using a camera.

As shown in fig. 6D, the Z-directed component 80D may be equipped with connection features such as conductive pads, spring-loaded pogo pins, or even simple springs 88 that may be used to add additional electrical connection points (e.g., chassis ground) to the printed circuit board. The spring 88 is shown connected to a conductor 89 of the Z-directed component 80D.

Fig. 7A and 7B illustrate another configuration of a Z-directed component for a PCB having top and bottom conductive layers and at least one inner conductor layer using O-rings. Z-directed component 150 is shown having locating features 152 on its top surface 150t and a conductive top trace 154t extending between conductor 156 and the edge of body 150d of its top surface 150 t. (a conductive bottom trace, not shown, is disposed on the bottom surface). As previously described, the conductor 156 extends through a portion of the body 150 d. Located on side surface 150S of body 150D is at least one semi-circular channel or passage. As shown, a pair of axially spaced circumferential channels 158a, 158b are provided with O-rings 160a and 160b, which are disposed within the channels 158a, 158b, respectively. A portion of the O-ring extends outwardly beyond the side surface 150s of the body 150 d. The O-rings 160a, 160b will be positioned adjacent to one or more inner layers of the PCB to make electrical contact with one or more traces disposed in the mounting holes of the Z-directed component at that point. Depending on the design, O-rings need not be provided adjacent to each inner layer.

The O-rings 160a, 160b may be conductive or non-conductive depending on the design of the circuit in which they are used. O-rings 160A, 160B are preferably compressible to help secure Z-component 150 within the mounting hole. The region 162 of the body 150d intermediate the O-rings 160a, 160b and the regions 164 and 166 of the body 150d outside the O-rings may be composed of different materials. For example, if the material of region 162 is a resistive material and O-rings 160a, 160b are conductive, then the inner circuit board traces in contact with the O-rings see a resistive load.

Regions 164 and 166 may also be constructed of materials having different properties from each other and from region 162. For example, region 164 may be resistive, region 162 capacitive, and region 166 inductive. Each of these regions may be electrically connected to an adjacent layer of the PCB. Furthermore, the conductor 156 and the traces 154t, 154b need not be provided. Thus, for the structure shown, a resistive element may be present in region 164 between the top layer of the PCB and the first inner layer from the top, a capacitive element between the first inner layer and the second inner layer of region 162, and an inductive element between the second inner layer and the bottom layer of region 166. Thus, an inductive load is seen for a signal transmitted from the inner trace contacting the conductive O-ring 160a to the second inner trace contacting the conductive O-ring 160 b. The material of the regions 162, 164, 166 may have a property selected from the group consisting of conductive, resistive, magnetic, dielectric, capacitive or semiconductive and combinations thereof. The design may be extended to circuit boards having fewer or more internal layers than described without departing from the spirit of the invention.

Additionally, the regions 162, 164, 166 may have electronic components 167, 169, 171 embedded therein and connected as described herein with reference to fig. 7-9. Additionally, as shown with respect to component 171, a component may be present in one or more regions within the body of the Z-directed component. Internal connections may be provided from the embedded components to the O-rings 160a, 160 b. Alternatively, interconnections may also be provided from the embedded component to the platable pads disposed on side surfaces 150 s.

The discussion of the various embodiments with respect to the Z-directed components is intended to be illustrative and not limiting. The Z-directed component may be made of a bulk material that performs the network function or may have other portions embedded into its body.

Examples of Z-directed Components

Given that the Z-directed component can be a multi-terminal device, it is clear that it can be used to perform, but is not limited to, the following functions: transmission lines, delay lines, T-filters, decoupling capacitors, inductors, common mode chokes, resistors, differential pair pass devices, differential ferrite beads, diodes, ESD protection devices (piezoresistors). Further note that the combinations may be put together within one component.

Design of general Z-direction component

Fig. 8 illustrates various configurations of conductors in a Z-directed component. As shown, conductor 90 has a region 92 in the middle of the end that includes a material having a property selected from the group consisting of: conductive, resistive, magnetic, dielectric, capacitive or semiconductive and combinations thereof. These materials form a variety of components. In addition, a component may be inserted or embedded into region 92 with portions of the conductors extending from the terminals of the component. A capacitor 92a may be provided in the region 92. Similarly, diode 92b, transistor 92c, fet 92d, zener diode 92e, inductor 92f, surge suppressor 92g, resistor 92h, diac 92i, and varactor 92j, as well as combinations of these items, are other examples of materials provided in region 92 of conductor 90. Although region 92 is shown in the center of conductor 90, it is not limited to this location.

For multi-terminal devices such as three terminal device transistor 92c or field effect transistor 92d or integrated circuit 92k or transformer 92l, one portion of the conductor may be between the top surface trace and the first terminal of the device and another portion of the conductor may be between the bottom surface trace and the second terminal of the device. For additional device terminals, additional conductors may be provided within the body of the Z-directed component to allow electrical connection to the remaining terminals, or additional conductive traces may be provided within the body of the Z-directed component between the additional terminals and the channels of the side surfaces of the body of the Z-directed component to allow electrical connection to external conductive traces. Various connection configurations to the multi-terminal device may also be used within the Z-directed component.

Fig. 9 and 10 show two exemplary connection configurations of the transistor. In fig. 9, similar to that shown in fig. 5F, Z-directed component 100 has two conductors 102 and 104 in body 105. Conductor 102 includes a top 102t, a bottom 102b, and an intermediate region 102i, where transistor 108 is provided. Base 108b of transistor 108 is electrically connected to top 102t of conductor 102 and emitter 108e is connected to bottom 102b of conductor 102. Collector 108c is connected to conductor 104 by conductive trace 109. In fig. 10, similar to that shown in fig. 5C, Z-directed component 110 has a body 115 that includes a conductor 112 and a channel 114. The conductor 112 includes a top 112t, a bottom 112b, and an intermediate region 112i, with a transistor 118 provided in the intermediate region 112 i. Base 118b of transistor 118 is electrically connected to top 112t of conductor 112 and emitter 118e is connected to bottom 112b of conductor 112. Collector electrode 118c is connected to plated via 114 by conductive trace 119. The examples shown in fig. 8 and 9 can be extended to additional channels and conductors to allow the use of multi-terminal circuits. The connections are intended only to illustrate how connections to a multi-terminal assembly may be made and are not intended to limit how transistors may be connected within a Z-component.

Z-direction signal passing assembly

Reference is now made to fig. 11 and 12, which illustrate Z-directed components, referred to as signal vias, for passing signal traces from the top surface to the bottom surface of the PCB. Fig. 11 shows a cross-sectional view taken along line 11-11 of fig. 12, in fig. 12, a PCB 200 having 4 conductive planes or layers, in order from top to bottom, a Ground (GND) plane or trace 202, a power plane Vcc 204, a second ground GND plane 206, and a third ground GND plane or trace 208, separated by a widely used non-conductive material known in the art, such as a phenolic plastic (e.g., FR 4). The PCB 200 may be used for high frequency signals. Respective top and bottom ground planes or traces 202 and 208 on respective top and bottom surfaces 212 and 214 of PCB 200 are connected to conductive traces leading to Z-directed components 220. Mounting holes 216 having a depth D in the negative Z-direction are provided in the PCB 200 for flush mounting Z-directed components 220. Here, the depth D corresponds to the thickness of the PCB 200, but the depth D may be less than the thickness of the PCB 200, creating a blind hole therein. As shown, the mounting hole 216 is a through hole of circular cross-section to accommodate the Z-component 220, but may have a cross-section to accommodate insertion of Z-components having other body configurations. In other words, the mounting hole is sized such that the Z-directed component can be inserted therein. For example, a Z-directed component having a cylindrical shape may be inserted into a square mounting hole, or vice versa. In the event that the Z-directed component fails to mate, resist material will have to be added to the component and areas of the PCB where plating is not desired.

The Z-directed component 220 is shown as a three-lead component that is flush mounted with respect to the top surface 212 and the bottom surface 214 of the PCB 200. The Z-directed component 220 is shown as a generally cylindrical body 222 having a length L. As shown, the center conductor or lead 224 is cylindrical and is shown extending along the length of the body 222. Two wells or channels 226 and 228 defining the other two leads are provided on the side surface of the Z-directed component 220, extending along the length of the body 222. Vias 226 and 228 are plated to electrically connect to Z-directed component 220 from different layers of PCB 200. As shown, ground plane traces on layers 202, 206, and 208 of PCB 100 are electrically connected to vias 226 and 228. Vcc plane 204 is not connected to Z-directed component 220 and a gap 219 exists between Vcc plane 204 and wall 217 of mounting hole 216 as shown.

Fig. 12 shows a top view of Z-directed components 220 in PCB 200. Three conductive traces 250, 252 and 254 open to the edge of the wall 217 of the mounting hole 216. As shown, trace 252 serves as a high frequency signal trace that passes from top surface 212 to bottom surface 214 of PCB 200 via Z-directed component 220. The conductive traces 250 and 254 function as a ground net. The center lead or conductor 224 is electrically connected to trace 252 on the top surface 212 of PCB 200 through top trace 245 and plating bridge 230. A top trace 245 on the top surface of the Z-directed component 220 extends from the top end 224t of the conductor 224 to the edge of the Z-directed component 220. Although not shown, the bottom side of the Z-directed component 220 and the bottom surface 214 of the PCB 200 are similarly configured in the arrangement of traces shown on the top surface 212 of the PCB 200 shown in fig. 12. The bottom trace on the bottom surface of the Z-directed component 220 extends from the bottom of the conductor 224 to the edge of the Z-directed component 220. The plated bridge is used to establish an electrical connection between the bottom trace and another high frequency signal trace disposed on the bottom surface of the PCB 200. The transmission line impedance of the Z-directed component can be adjusted by controlling the conductor size and the distance between the conductors to match the impedance of the PCB traces, thereby improving the high speed performance of the PCB.

During the plating process, the wells 256 and 258 formed between the walls 217 and the vias 226 and 228 of the mounting hole 216 allow the plating material or solder to pass from the top surface 212 to the bottom surface 214, thereby electrically interconnecting the traces 250 and 254 to the respective vias 226 and 228 of the Z-directed component 220, respectively, and also to the similarly positioned trace interconnect ground planes or traces 202, 206 and 208 disposed on the bottom surface 214 of the PCB 200. The plating is not shown for the purpose of illustrating the structure. In this embodiment, Vcc plane 204 is not connected to Z-directed component 220.

One of the challenges with high frequency signal speed is reflections and discontinuities due to signal trace transmission line impedance variations. Because of these discontinuities caused by routing signal traces through the PCB, many PCB layouts try to keep the high frequency signals on one layer. The standard vias through the PCB must be spaced apart a distance that creates a high impedance between the signal via and the return signal via or ground via. As shown in fig. 11 and 12, the Z-directed component and the return ground or signal have very close and controllable proximity, which allows for a substantially constant impedance from the top surface 212 to the bottom surface 214 of the PCB 200.

The Z-directed signal pass-through component may also include a decoupling capacitor that will allow the reference plane of the signal to be switched from the ground plane, designated GND, to the power plane, designated Vcc, without high frequency discontinuities. Fig. 13 shows a cross-sectional view of a typical 4-layer PCB300 with signal traces 302 routed between a top layer 304 and a bottom layer 306. The Z-directed component 310 having a body 312 is similar to that shown in fig. 5D, with the signal traces 302 connected by a center conductor 314. The Z-directed component 310 also includes plating channels 316 and 318 that extend along the side surface 312s of the body 312. The top 314t and bottom 314b of the conductor 314 are connected to conductive traces 318t and 318b on the top 312t and bottom 312b of the body 312. These conductive traces are connected to the signal traces 302 in sequence through top and bottom plated bridges 330t and 330 b. Vias 316 and 318 will be plated to GND plane 332 and Vcc plane 334, respectively. Connection points 336 and 338 illustrate the electrical connections, respectively. A decoupling capacitor 350 is schematically shown inside the body 312 and connected between the channels 316 and 318. The decoupling capacitor 350 may be a separate capacitor integrated into the body 312 of the Z-directed component 310 or it may be formed by fabricating a portion of the body 312 of the Z-directed component 310 from a desired material having dielectric properties between conductive surfaces.

The path of the signal trace 302 is shown as being diagonally shaded and can be seen traveling from the top layer 304 to the bottom layer 306. The GND plane 332 and the vias 316 are electrically connected at 336 with the signal path return represented by the dark dotted line 362. Vcc plane 334 and channel 318 are electrically connected at 338 with the signal path return represented by the dashed dotted line 364. As is known in the art, where signal planes or traces are not connected to the interposer portions, those portions are spaced from the component, as shown at 370. Where the signal planes or traces are connected to the interposer, the signal planes or traces are provided at the walls or edges of the openings to allow the plating material or solder to bridge between them, as shown at points 330t, 330b, 336, and 338.

The vertical shaded portion 380 shows the high speed loop area between the signal trace and the return current path described by the signal trace 302 and either the GND plane 332 or the Vcc plane 334. Signal traces 302 on bottom surface 306 are referenced to power plane Vcc 334, which is coupled to GND plane 332 through decoupling capacitors 350. The coupling between these two planes will keep the high frequency impedance close to constant for the transition from one return plane to the other plane of different DC voltage.

Internally mounting the Z-directed components within the PCB greatly facilitates PCB technology using an external ground plane for EMI reduction. With this technique, signals are routed on the inner layer as much as possible. Fig. 14 illustrates one embodiment of this technique. PCB400 is made up (from top to bottom) of top ground plane 402, internal signal layer 404, internal signal layer 406, and bottom ground plane 408. Ground planes 402 and 408 are on top and bottom surfaces 400t and 400b of PCB 400. Mounting holes 410, shown as through holes, extend between the top and bottom surfaces 400t and 400 b. Z-directed component 420 is shown flush mounted within PCB 400. The Z-directed component 420 includes a body 422 having a central region 424 intermediate a top 422t and a bottom 422b of the body 422 and two channels 425 and 427 on side surfaces 422 s.

The channels 425 and 427 and the walls 411 of the holes 410 form plated wells 413 and 415, respectively. The central region 424 is positioned within the body 422 and extends a distance approximately equal to the distance separating the two internal signal layers 404 and 406. The channel 425 extends from the bottom surface 422b of the body 422 to the internal signal level 406, while the channel 427 extends from the top surface 422t of the body 422 to the internal signal level 404. Here, the channels 425 and 427 extend along only a portion of the side surface 422s of the body 422. The conductors 426 extend through the central region 424, but do not extend to the top and bottom surfaces 422t, 422b of the body 422. Fig. 5H illustrates a portion of a channel, which is similar to channel 427. Conductor 426 has conductive traces 428t and 428b extending from top 426t and bottom 426b of conductor 426 to vias 427 and 425, respectively. Although shown as separate elements, conductor 426 and traces 428t, 428b may be one integrated conductor that electrically interconnects channels 425, 427. As shown, conductive trace 428b is connected to internal signal layer 406 through plated via 425 and well 413, while trace 428t is connected to internal signal level 404 through via 427 and well 415. The ground planes 402 and 408 are not connected to the Z-directed component 420 and are spaced apart from the mounting holes 410 as previously described with respect to fig. 11 and 13. As shown by the double-arrow dashed line 430, signals on signal layer 406 reach signal layer 404 (or vice versa) via Z-directed components through paths extending from well 413, via 425, trace 428b, conductor 426, trace 428t, via 427, and well 415 to allow signals to remain on the inner layers of PCB400, and ground planes 402 and 408 provide shielding.

Z-direction decoupling capacitor

Capacitors of the type having a Z-directed component body can be constructed in several ways. In fig. 15, a Z-directed capacitor 500 is shown having a body 502 with a conductor 504 extending along its length and two channels 506 and 508, similar to those previously described. Conductor 504 is shown connected to signal 526. The vertically oriented interleaved partial cylindrical sheets 510, 512 forming the plates of the Z-directed capacitor 500 are connected to a reference voltage such as voltage Vcc and ground (or any other signal requiring capacitance) along with an intermediate layer of dielectric material (not shown). A partially cylindrical patch 510 is connected to the plating channel 506, which is shown connected to ground 520. The partially cylindrical patch 512 is connected to a plating channel 508, which is shown connected to a supply voltage Vcc 522. The sheets 510, 512 may be formed of copper, aluminum, or other materials having high electrical conductivity. The material between the partial cylindrical sheets is a material with dielectric properties. Only one partial cylindrical slice is shown connected to each of Vcc 522 and ground 520, but additional partial cylindrical slices may be provided to achieve the desired capacitance/voltage ratings.

Another embodiment of the Z-directed capacitor shown in fig. 16 uses stacked support members connected to voltage Vcc or ground. The Z-directed capacitor 600 is comprised of a center conductor 601 and a body 605, the body 605 including a top member 605t, a bottom member 605b, a plurality of support members 610 (shown as disks) between the top member 605t and the bottom member 605 b.

The center conductor 601 extends through an opening 615 and openings 602t and 602b, the opening 615 being sized to closely receive the center conductor in the assembled Z-directed capacitor 600. The center conductor may be electrically connected to the conductive traces 603t and 603b on the top 605t and bottom 605b, forming a signal path for the signal 626. This connection is achieved by plating or soldering. Conductor 601 is connected to signal 626 by conductive trace 603 t. The bottom end of conductor 601 is connected to a signal trace (not shown) in a similar manner by conductive trace 603 b.

Opposing openings 607t and 608t are provided at the edges on the top 605 t. The bottom portion 607 is similarly configured to the top portion 605 with opposing openings 607b and 608b provided at the edges. Between the top 605 and bottom 609 are a plurality of support members 610 that provide a capacitive feature. Each of the support members 610 has at least one opening 613 at their outer edges and an inner bore 615 that allows the conductor 602 to pass therethrough. As shown, two opposing openings 613 are provided in each support member 610. When assembled, the opposing openings 607t, 607b, 608t, 608b and 613 are aligned to form opposing channels 604 and 608 extending along the side surfaces of the Z-directed capacitor 600. Channel 604 is shown connected to a reference voltage such as ground 620 and channel 606 is shown connected to another reference voltage such as Vcc 622. Support members 610 may be made of a dielectric material and all may have the same or different thicknesses to allow for selection in designing the desired characteristics of Z-directed capacitor 600.

The ring-shaped plating layer 617 is provided on one of the top and bottom surfaces of the support member 610, or may be provided on both surfaces, if necessary. As shown, the annular plating layer is shown on the top surface of each support member, but the location of the annular plating layer may vary from support member to support member. The annular plating layer 617 generally conforms to the shape of the support member and extends from one edge opening toward the other edge opening 613, if an additional opening is provided. The diameter or size or overall size of the annular plate 617 is less than the diameter, size or overall size of the support member 610 to which it is attached. While the plate 617 is depicted as being annular, other shapes may be used as long as the plating layer does not contact the center conductor or extend to the edge of the support member to which it is plated or otherwise attached. The annular plate does contact one of the edge openings 613, but is spaced apart from the other openings if more than one channel is present on the side surface of the body of the Z-capacitor 600. There is also an opening 619 in the annular plate 617, the opening 619 having a diameter larger than the opening 615 in the annular plate 617 through which the conductor 601 passes. The opening 619 has a larger diameter than the conductor 602 so that the annular plate 617 is spaced apart from the conductor 602.

As shown, the support members 610 are substantially identical except that alternate members are rotated 180 degrees relative to the components above or below it when stacked. This may be referred to as a1-1 configuration. In this way, alternate members will be connected to one or the other of the two channels. As shown in fig. 16, the ring plating of the higher of the two support members 610 is connected to the channel 608 and to a voltage Vcc622, while the ring plating of the lower of the two support members 610 is connected to the channel 604 and to ground 620. Other arrangements of support components may also be used, such as having two adjacent members connected to the same channel, with the next support member connected to the opposite channel, which may be referred to as a 2-1 configuration. Other configurations may include 2-2, 3-1 configurations, which are a matter of design choice. The required capacitance or voltage rating determines the number of support members inserted between the top 605 and bottom 609. Although not shown, dielectric members composed of a dielectric material and having a shape similar to that of the support member 610 may be interleaved with the support member 610. Depending on design choice, only a single via may be used, or multiple vias may be provided, with the annular plating being in contact with the center conductor and not in contact with the vias. Again, the Z-directed capacitor embodiment is for illustrative purposes and is not intended to be limiting.

For either design of the Z-directed capacitor, a second conductor may be provided in parallel with the first conductor disposed within the conductive plate to create a differential decoupling capacitor. From fig. 15 or 16, another embodiment of a Z-directed capacitor can be constructed by connecting the center conductor to one of the reference voltages at each support member (also having its annular plating connected to the same reference voltage). This can be achieved by simply connecting the conductors to the annular plating, as schematically shown by jumper 621. In practice, the annular opening 619 in the annular plate 617 is sized such that the annular plate and the conductor 602 will be electrically connected. Such components may be placed directly under power pins or balls of an integrated circuit or other surface mount components for optimal decoupling placement.

Z-direction signal delay line

Fig. 17A-17C and 18 illustrate embodiments of Z-directed signal delay line components. Typically, Z-directed signal delay lines include a body having a signal conductor routed therein, the signal conductor being made of one of a dielectric material and a magnetic material that slows a signal propagating through the delay line. The signal conductor has a length contained within the body and may have a length that is the same as the length of the body or may have a length that is longer than the length of the body. The connection to the signal conductors may be via vias provided on the side surfaces of the Z-directed component or conductive traces provided on the top and bottom surfaces or by a combination of top and/or bottom traces and vias. In fig. 17A, a Z-directed component 700A has a body 702 with conductive traces 703a and 703b on its top surface 702 t. Disposed within the body 702a is a delay line 704 formed from a plurality of conductive legs including vertically oriented segments 704a-704d extending along a portion of the length of the body 702a and connected in series at their respective top and bottom ends (generally approximately W-shaped) by a plurality of short horizontal strips 704e, thereby forming the delay line 704 in an undulating or zig-zag manner. The upper ends of segments 704a and 704d (the beginning and end of the conductors forming the delay line) are shown connected to conductive traces 703a and 703b, respectively, on the top surface 702t of body 702 a. The extra length of the intervening signal path of the conductors forming delay line 704 results in the signal propagating a longer distance before being delayed. The connection to the delay line 704 may also be made using vias disposed on the sides 702s of the body 702a, either in combination with conductive traces on the top or bottom surface, or in place of the top and bottom conductive traces. Additional segments may be added to the delay line 704 to increase the amount of delay.

In fig. 17B, the Z-directed component delay line 700B has a body 702 with conductive traces 703t and 703B on the top and bottom of the body 702B. Within the body 702B is a delay line 705 comprising a plurality of horizontally arranged (as seen in fig. 16B) C-shaped conductors 705a-705d, the conductors 705a-705d being spaced apart from each other and connected in series by a plurality of vertical leg segments 705 e. The C-shaped conductors 705a-705d may also be described as being arranged generally parallel to the top or bottom surface 702t, 702b of the body 702 and the leg segments 705 are arranged generally parallel to the side surfaces of the body. The ends of the leg segments 705e adjacent the top and bottom of the body 702b connect the traces 703c and 703d on the top and bottom surfaces. Again, the extra length of the delay line 705 inserted in the signal path results in a longer signal propagation path, delaying the signal. If there is too much capacitive coupling between adjacent C-shaped conductors, a shielding material (not shown) may be disposed within the body 702 between adjacent C-shaped conductors and grounded. This is expected to remove most of the parasitic effects of this geometry. The connection between adjacent C-shaped conductors is implemented such that the magnetic flux of one C-shaped conductor cancels the magnetic flux of the next C-shaped conductor. This reduces the magnetic coupling between the C-shaped conductors. Additional C-shaped conductors may be added to increase the delay. Alternatively, the delay lines may be arranged in a spiral configuration.

Fig. 17C shows a programmable version of the Z-directed delay line of fig. 17B. The Z-directed delay 700C has a body 702b with top and bottom traces 703t of the body 702 b. The delay line 705, which is disposed within the body 702b, includes a plurality of series-connected C-shaped conductors, as previously described. The shorting mechanism of the C-shaped conductor is disposed within or on the body 702b and may include at least one shorting bar. The amount of delay provided by the Z-directed component delay line 700C may be adjusted or programmed by selectively removing portions of the shorting bars between adjacent C-shaped conductors. As shown, two drillable shorting bars 708, 709 are shown and used to program the delay time of the section. In this embodiment, shorting bars 708, 709 extend along the length of the body 702b and tangentially contact each of the C-shaped conductors. Shorting bars 708 and 709 are diametrically opposed to each other such that drawing a line between them will bisect each C-shaped conductor 705a-705 d. If a minimum delay time is required, the shorting bars 708, 709 are left in place. If a maximum delay time is required, the shorting bars 708, 709 are removed by drilling or etching away the conductive material. Since the portions of the shorting bars 708, 709 between adjacent C-shaped conductors are removed, the time delay will increase by 1/2 turns or a full turn time increment. This can be used in development to easily determine the optimal signal delay for production purposes. And each PCB may be adjusted during functional testing to optimize signal delay to compensate for variations in other parameters in the design.

By placing shorting bars laterally across the vertical conductor segments 704a-704d, one or more shorting bars may be used for the Z-direction delay line 700A, as indicated by line 710. However, for this design, the time delay must be adjusted before inserting the part into the PCB. In yet another embodiment, one or more vias may replace shorting bars to provide a shorting mechanism, and portions of the delay lines 704 or 705 may be shorted together by using selective plating techniques when plating such Z-directed delay lines.

In fig. 18, variable delay line 730 may be created by connecting any number of Z-directed delay lines together by conductive traces on a PCB. These surfaces are shown as transparent to show the connections. Inserted into the PCB 740 are cylinders 750, 760 and 770 which may represent Z-directed delay lines, or conductive plugs or Z-directed signal passing features shown in fig. 17A-17C, and which are connected in series by top and bottom conductive traces 780t, 780b shown on the top and bottom surfaces 740t, 740b of the PCB 740. Cylinders 750, 760, and 770 may also be connected in series by conductive traces (if present) disposed on internal layers of PCB 740, or by a combination of internal or external conductive traces. If cylinders 750, 760 and 770 each represent a Z-directed delay line element, the total delay of the entire delay line 730 can be changed by replacing the Z-directed component delay line element with a Z-directed component signal pass device as described previously, or with another Z-directed component delay line having a larger delay, which does not introduce a larger delay. One advantage of this configuration is that no changes need to be made to the PCB layout design while still allowing the total signal delay to be adjusted.

Z-direction T-type filter/PI filter

Z-direction T-type filters and Z-direction Pi filters are three-port devices having input conductors, output conductors, and ground conductors. A T-type filter generally includes: for a low-pass filter, two series resistors connected between the input and output terminals, a capacitor connected between the resistor and ground, and for a high-pass filter, two series capacitors connected between the input and output terminals, a resistor connected between the capacitor and ground. Illustratively, these filters are similar to the letter T. One component of the Pi filter is connected between the input and the output, a second component is connected between the input and ground, and a third component is connected between the output and ground. The first component may be a resistor and the second and third components may be capacitors, or vice versa. Inductors may also be used. These devices may be mounted within the Z-directed component in a similar manner to the transistors shown in fig. 8 and 9.

Z-direction ferrite bead

FIGS. 19A-19C illustrate cross-sectional views of alternative embodiments of Z-directed ferrite beads. The structure of these devices is similar to that shown and described in fig. 5B-5H. Disposed within a portion of the body 1000 is a cylinder 1001 of magnetic material having an opening through which a conductor 1002 passes, as shown in fig. 19A. Conductor 1002 extends to the top and bottom surfaces of body 1000 where it is electrically connected to the top and bottom traces. The conductors may also be connected as previously described to channels such as on the side surface of the body or to both side channels, etc. By varying the outer diameter of the cylinder 1001, the magnetic properties can be varied to control the properties of the ferrite bead. As shown, the cylinder 1001 is contained within the body 1000, but its outer circumference may also extend to the side surface of the body 1000. This structure creates a single conductor differential Z-direction ferrite bead.

In FIG. 19B, two conductors 1002-1 and 1002-2 pass through two openings provided in the cylinder 1001 of the body 1000 to form a two conductor differential mode Z-directed ferrite bead. Two parallel spaced apart conductors 1002-1 and 1002-2 are surrounded by a cylinder 1001 of magnetic material. By varying the outer diameter of the cylinder 1001, the magnetic properties can be varied, thereby controlling the properties of the ferrite bead. As shown, the cylinder 1001 is contained within the body 1000, but its outer circumference may also extend to the side surface of the body 1000.

Shown in fig. 19C is a two conductor common mode Z-directed ferrite bead that is substantially similar to the two conductor differential mode Z-directed ferrite bead, but with the two conductors 1002-1, 1002-2 within the cylinder 1001a passing through a common opening 1003 in the magnetic material forming the cylinder 1001 a. The volume within opening 1003 is not filled with magnetic material. This volume may be left empty, i.e. filled with air, or another non-magnetic material may be used to fill the portions not filled with conductors 1002-1, 1002-2.

Z-direction switch

The Z-directed component, which functions as a single pole single position or multi-pole multi-position switch, can be used to program different settings into the PCB by rotating it about its insertion axis to different positions. Fig. 20A and 20B show a PCB 1101 having a plurality of interior layers 1102 with one or more conductive traces and a plurality of surface conductive traces 1103 on an exterior surface 1104, three of which are further indicated as a, B, and c. Conductive traces may also be disposed on both outer surfaces of PCB 1101. In fig. 20A, a Z-directed component 1105 is mounted in a mounting hole 1106, shown as a through hole. Channel 1107 of Z-directed component 1105 is shown aligned with circuit trace 1103 a. Channel 1107 extends along side surface 1105 from top surface 1105t to bottom surface 1105 b. However, the length of the channel may be less than the body length of the Z-directed component and may extend only from one of the top and bottom surfaces toward the other, or may be disposed intermediate the top and bottom surfaces, such as, for example, extending only between two interior layers of the PCB. Inserted into the channel 1107 is shown a compressible conductive member such as a stem 1109. Disposed on a top surface 1105t of the Z-directed component 1105 is a rotational structure, such as a slot 1108 for rotating the Z-directed component 1105 into alignment with the desired surface trace 1103. Other configurations, such as a pair of holes or a cross-shaped slot, may also be used in place of the slot 1108.

Referring now to FIG. 20B, which is a cross-sectional view taken along line 20B-20B of FIG. 20A, Z-directed component 1105 is removed, showing a plurality of internal connection points 1110-. The connection between trace 1103a and connection point 1110 is made by the alignment of the compressive conductive component 1109 of the Z-directed component 1105 with the trace 1103a, as shown by the dashed line interconnecting the two points. If the compressive conductive component 1109 of the Z-directed component 1105 is aligned with trace 1103b, then trace 1103b will be connected to connection point 1111 as shown by the dashed line interconnecting the two points. Similarly, if the compressive conductive component 1109 of the Z-directed component 1105 is aligned with trace 1103c, then trace 1103c will be connected to connection points 1112 and 1113 as shown by the dashed line interconnecting these three points.

When the compressive conductive member is a rod, it may have a diameter less than, and preferably equal to or greater than, the diameter of the channel 1107. In fig. 20C and 20D, the compressible conductive post 1109 is shown having a diameter larger than the diameter of the channel 1107. This is done to ensure that the compressible stem 1109 will be compressed when inserted into the channel 1107 to help ensure that the compressible conductive stem 1109 will be retained within the body of the Z-directed member 1105 due to the interference fit between the stem and the channel. Additionally, as shown in fig. 20D, the channel 1107 is positioned at the edge of the Z-directed component 1105 so that the centerline 1109a of the compressive conductive post 1109 will be positioned within or a distance less than the radius R of the Z-directed component 1105 while still allowing the band 1109s of the outer side surface of the compressive conductive post 1109 to extend beyond the side surface 1105s of the Z-directed component 1105 for the desired electrical connection. The band or portion 1109s of the outer circumference is shown exaggerated in fig. 20D. It is anticipated that this will also help keep Z-directed component 1105 inserted into PCB 1101. Additional channels and compressible conductive poles may also be provided in the Z-directed component 1105 and arranged as needed around the circumference of the Z-directed component 1105 to meet the design requirements of the circuit forming the multi-pole switch.

It will be appreciated that if the diameter of the compressive conductive post 1109 is equal to or less than the diameter of the channel 1107 and the centerline of the compressive conductive post is at or beyond the side surface of the body of the Z-directed member 1105, the post will tend to fall out of the channel. The post 1109 remains in the channel 1107 before the Z-directed component 1105 is inserted into the PCB 1104, when some tool would be required for inserting the post into the channel, such as an adhesive on the portion of the compressible conductive post within the channel or on the surface of the channel. Where the compressive post 1109 has a diameter less than the diameter of the channel 1107, shims or other means, such as raised portions inserted in the channel walls between the channel surface and the compressive conductive post, may be used to ensure that the compressive conductive post will have portions extending beyond the side surface 1105s of the Z-directed component 1105.

Generally, the shape of the channel and the shape of the compressible conductive member should correspond to each other such that when the rod is inserted into the channel, it will be retained by the channel while still allowing a portion of the compressible member to extend beyond the sidewall of the Z-directed component. While a cylindrical channel and rod are described, it should be understood that other shapes may be used. For example, as shown in fig. 20D, the channel 1120 is generally triangular or trapezoidal in cross-section with the apex of the opening aligned with the side surface. Inserted into the channel 1120 is a generally rectangular compressive conductive member 1122 having a pinch 1122w caused by the cross-sectional shape of the channel 1120. Member 1122 may also have a triangular cross-section.

Using Z-directed components 1105 in this manner allows PCB 1101 to be configured with identification indicia, such as a serial number, that uses a minimum number of components. By using wells disposed in the Z-directed component 1105, as previously described, connections between surface layers (whether top, bottom, or both) of the PCB 1101 can also be made to the inner layers. In addition, one or more wells and one or more center conductors may also be used to provide multiple connections between and among the inner layer 1102 and the surface layer of the PCB 1101. Although it is contemplated that once the Z-directed component 1105 is positioned and aligned with the desired traces, it will be plated there, the Z-directed component 1105 may also be removably inserted into the mounting hole 1106, which allows it to be realigned similar to a single or multi-axis rotary switch, depending on the number of layers in the PCB 1101. A slot may also be provided in one of the end surfaces of the Z-directed component to allow it to be rotated by a screwdriver or other similar tool. To retain the Z-directed member in the mounting hole while still allowing rotation, a flexible band or other similar tool may be provided on the circumferential surface of the Z-directed component. When the mounting hole is a through hole, the top surface 1105t may have a radial protrusion 1130 or flange that may be used to prevent the Z-component from sliding out of the mounting hole when rotated.

When built on a Z-directed switch, the Z-directed component 1105 may have several different circuit or component values incorporated into its body, as shown by the dashed box 1115 in fig. 20C, and which is used to connect one or more traces on one layer (inner or outer) of the PCB to another of the multiple traces on the same or other surface of the PCB using vias or conductors as previously described. By having multiple paths through the Z-directed component, different circuits can be selected by rotating the part to select which conductors are bridged (with the desired circuit components between two or more connection points). For example, a Z-directed component may have a range of resistance values selected therein by inserting the Z-directed component and aligning it with the desired conductive traces. The concept can be extended to any combination of electronic components and necessary conductive traces that will fit within the bulk volume of the Z-directed component.

Z-internal connector

One of the problems with very high speed signals is that the transition between PCB layers requires vias to transition. Copper vias have a large surface area relative to the signal. This will result in transmission line discontinuities that can affect signal quality. Current high speed PCB designs sometimes require these vias to be backdrilled to reduce the surface area of the vias. One example is when a signal transition is made between two inner layers, then the outer section of the via may need to be removed. The drill bit is used to remove copper between the surfaces of the PCB down to the area where the signal is located in the PCB. FIGS. 21A, 21C and 21D illustrate another configuration of an internal Z-component connector that can be internally connected without the back drilling process. This embodiment also illustrates the use of a test path for the body of the Z-directed component. The internal connector may be used at any time when no plating wells are required on the top or bottom layers of the PCB.

In this embodiment, the Z-directed component 1200 has at least two recessed areas or recesses 1202a, 1202b, 1202c, 1202d on the side surface 1200s that will contain solder paste material (not shown) that will spread or reflow when heated to achieve the desired connection. Conductors 1216a, 1216b, 1216c, 1216d are provided between the top surface 1200t and each of the recesses 1202 a-1210 d, respectively. Portions 1216a1-1216d1 of conductors 1216a-1216d on surface 1200t may be used as test points for test probes as described herein.

Shown in fig. 21B is a cross-sectional view of a four-layer PCB 1210 having two inner layers 1211a, 1211B each having two conductive signal traces 1212a and 1212B, 1212c and 1212d, respectively, disposed at four interior locations of a wall 1214w of a mounting hole 1214. For purposes of illustration only, it is necessary to interconnect trace 1212a to trace 1212c and trace 1212b to trace 1212 d. Other numbers of internal layers and signal traces may also be connected in a similar manner using appropriately designed Z-component internal connectors. In the Z-directed component 1200, four correspondingly located recesses 1202a-1202d are located in the side surface 1200s, such that when the Z-directed component 1200 is inserted into the mounting hole 1214, the recesses will be adjacent to the traces 1212a-1212d on the inner layers 1211a, 1211b, respectively.

The recesses may be interconnected in various ways known in the art. Two examples are shown in fig. 21A and 21C. One is that the channels 1220 cut into the side surface 1200s and interconnecting the recesses 1202b and 1202d may be filled with solder paste or solder paste in the recesses will flow into the PCB when heating thereof occurs. Additional channels interconnecting all of the recesses together may be provided, and the recesses may be selectively interconnected using removable solder dams, represented by dashed lines 1224, disposed in channels 1220. This allows the interconnection to be determined after the Z-connector is manufactured. Where a connection is required between two recesses, solder dams 1224 in the channels interconnecting the recesses will be removed. Another connection may be made through conductor 1222 interconnecting recesses 1202a and 1202c disposed within body 1200 b. With such an arrangement, a predetermined manner of interconnection will be required so that the conductors are positioned between the required interconnection points.

Once the Z-directed component 1200 is soldered in place, the internal connections may be checked by test probes placed at test points 1216a1-1216d 1. For the illustrated connection pairs, only a single test point is required for each pair of interconnected recesses; however, it may be desirable to have one test point for each connected recess, as shown.

Fig. 21C and 21D illustrate a Z-component interconnect 1200 having an optional multi-terminal component 1230 embedded or formed within the body 1200 b. The component 1230, which may be an active or passive component, may also be inserted into the connection path of the internal layers 1211a, 1211b of the PCB 1210. As shown, one terminal of member 1230 is connected to top surface 1200t of Z-directed member 1200 via conductor 1232, a second terminal is shown connected to recess 1202a via conductor 1234 and a third terminal of member 1230 is shown connected to recess 1202d via conductor 1236. Components with more or less terminals may also be housed within Z-directed component 1200, depending on the volume available for internal components and conductors.

Test paths 1216a-1216d may not exist in some designs. However, the test path may be used for any Z-directed portion described herein to improve testability. Additionally, the top and bottom surfaces of the Z-directed component may have a conductive coating that is substantially coextensive with the surface to provide further shielding when the Z-directed component is mounted and plated in the PCB.

In some cases, depending on the desired functionality, the Z-directed component may work best when partially inserted into the PCB. The Z-directed component may have parameters such as resistivity, which may be controlled by the depth of insertion into the PCB. One example is a resistor having a fixed resistance value between the top and bottom surfaces, typically by applying a uniform resistive film on the side surfaces of the body. This is illustrated in fig. 22A and 22B, which show a PCB1300 with Z-directed resistors 1320 inserted into mounting holes 1302 at two different depths (shown by dashed lines). PCB1300 is shown with signal traces 1303, 1305 on an outer surface (top surface 1300t), and signal traces 1307, 1309 on the other outer surface (bottom surface 1300 b). As shown in both figures, Z-directed resistor 1320 interconnects signal trace 1303 to signal trace 1305. Two internal layers are shown for PCB1300, a first voltage reference layer Vcc 1311 and a second voltage reference layer GND 1313. Side surface 1330s of body 1330 has two closed ends or blind channels 1332, 1334 extending from top surface 1330 t. These blind channels may also extend from the bottom surface 1330 b. Platable strips 1340 are shown disposed on side surfaces 1330s of body 1330 between top and bottom surfaces 1330t, 1330 b. Disposed within the body 1330 are conductors 1335, 1336 electrically connected to respective ends of the electroplatable strip 1340. The other ends of the conductors 1335, 1336 are electrically connected to the channels 1332, 1334. Line 1350 represents the position of top surface 1300t relative to body 1330. The Z-directed resistor 1320 is inserted into the mounting hole 1302 to a depth D1 where portion P1 represents the portion of the platable bar 1340 below the top surface 1300t of the PCB1300 and portion P2 represents the portion of the platable bar 1340 above the top surface 1300 t. When the circuit board 1300 is plated, the exposed side surfaces 1300s above the top surface 1300t and the portion P2 of the electroplatable strip 1340 would be plated with copper, shorting the portion P2 and reducing the overall resistance of the Z-directed resistor 1320. The ends of the channels 1332, 1334 are closed to prevent plating material from shorting the two channels together. In fig. 22B, the Z-directed resistor is shown inserted to a greater depth D2. Thus, on the platable strip 1340, the portion P1 increases and the portion P2 decreases. At insertion depth D2 and after plating has occurred, the total resistance value of the Z-resistor 1320 is greater than when the insertion depth is D1.

This concept can be used for any passive component whose value can be adjusted by plating a portion of the surface. One example is a Z-directed inductor, where the winding portions are exposed along the length of the side surfaces. Another example is a Z-directed capacitor having stacked disks similar to those shown in fig. 15, but modified so that the annular plate 617 is not connected to either of the side channels 604, 608. Instead, one or more of the annular plates 617 will be electrically connected to respective conductors disposed within the body 605, the other ends of the conductors being exposed on the side surfaces of the body 605. Another example is a signal delay line, as shown in fig. 17B, where a portion of the C-shaped conductors 705a-705d are exposed on the side surface 702 bs. Another use of this partial insertion technique is in situations where different electronic functions exist in the area between the top and bottom surfaces of the body of the Z-directed component. As shown in fig. 7B, a plurality of devices or circuits may also be provided in the main body 150. The internal connections may be provided into platable pads provided in the side surfaces. The exposed pads will be shorted by the copper plating in a manner similar to the resistor example. As discussed later, the Z-directed components may be adjusted after PCB manufacture. Circuit design may require that Z-directed components provide optional functions or features for the circuit to be partially inserted into the PCB and not be connected at the time of manufacture. Subsequently, if the Z-directed component is required to add its new functionality to the circuitry in the PCB, it will be pushed into place in the field.

In another embodiment, the strip used in the Z-direction variable value feature may also have one or more etchable portions 1360 with conductors connected to each end of the strip (see FIG. 22A). The conductors may be internal to the body of the component, disposed on the outer surface, or a combination of internal and external connections as previously shown and described. The value of the Z-direction variable value feature may be adjusted by selectively etching the etchable portion 1360 of the strip while still maintaining a signal path between the two end conductors. For example, if the strips are comprised of a resistive material, removal of some of this material by etching will reduce the resistance value. Depending on the material in the etchable portion, the value of the feature may increase or decrease after the material is etched away. Depending on the depth to which such components are mounted in the PCB, fewer or more etchable portions will be exposed to etching. Z-directed component mounting into PCB

One way to achieve this placement, given the shape and intended location of the Z-directed component to be mounted to the recess or through hole of the PCB, is through the use of an insertion system 800 that includes an orienting fixture 802 and a plug plate 804, as shown in fig. 23. Located on directional fixture 802 are one or more Z-directed components 806. The orienting fixture 802 orients the Z-directed components 806 for insertion into the PCB 850 using locating surfaces or other indicia provided on the board of the components, the PCB 850 being shown positioned over the orienting fixture 802 and having one or more mounting holes 852 for receiving the Z-directed components 806 therein, as previously described. The PCB 850 is held by a fixture (not shown). As shown, the mounting holes 852 are through holes, and the depth D of the holes corresponds to the length L of the Z-directed component 806. As previously described, the length L may be less than, equal to, or greater than the depth D to allow for recessed mounting, flush mounting, or extended mounting. For a concave Z-directed component, a resist material would be required to ensure that only those portions of the concave surface to be plated are plated to avoid the entire concave surface being plated.

The plug 804 is raised, as indicated by arrow 860, to insert the Z-directed component 806 into a corresponding mounting hole 852 in the PCB 850 and through the bottom surface of the PCB 850. The plug plate may have a cylindrical body that presses each member 806 through the directional fixture 802 into the mounting hole 852 to the correct depth. These cylinders may be operated individually or in any combination at the same time.

To facilitate the use of Z-directed components, an insertion device that orients the parts and inserts them into the PCB would be required. Although not shown, it should be appreciated that pick and place equipment may also be used to insert Z-directed components into the PCB. Such pick and place equipment may insert Z-directed components from the top or bottom surface of the PCB. A plunger device would be required to press the Z-directed component to the desired insertion depth into the PCB.

The Z-directed component may be press-fit or glued into place in the PCB. The interface of the PCB and the Z-directed component may include a corrosion resistant material that inhibits plating or a seed material that helps promote plating. Examples are shown in fig. 24 and 25. In fig. 24, a Z-directed component 900 is shown having a body 902 and two channels 904a and 904b extending along a side surface 902s and a top conductive trace 906 with glue strips 910 or dots 911 on the side surface 902s to allow the Z-directed component 900 to be adhered to the walls of a mounting hole in a PCB prior to plating. In fig. 25, a Z-directed component 920 is shown having a body 922 and two channels 924a and 924b extending along a side surface 920s with a copper seed material 927 (indicated by horizontal lines) over the channels 924a, 924b and a top conductive trace 926 with a resist material 928 (indicated by angled lines) over the remainder of the side surface 902 s. The compliant material may be used to prevent migration of the plating material beyond a desired location. For portions extending beyond the surface of the PCB, seed copper may be employed around the edges of the Z-directed component down along the side surfaces to the surface of the PCB.

Other surface mount components may be mounted above the component and may even have pads or solder balls to which the surface mount components are directly connected. For example, for a ball grid array device, solder balls may be attached directly to the top surface of the Z-directed component. Z-directed components may also be included in the web wrap material. The component may be extracted and partially inserted into the PCB using a pick-and-place vacuum head. A camera may be used to check the orientation of the Z component and adjust its position before the Z component is fully inserted into the PCB.

The foregoing description of several embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. It is intended that the scope of the invention be defined by the claims appended hereto.

Claims

1. A Z-directed component signal delay line for mounting in a PCB having a mounting hole therein having a depth D, the Z-directed component signal delay line comprising:

an insulative body having top, bottom and side surfaces, a cross-sectional shape insertable into the mounting hole of the PCB, and a length L defining a length direction;

a signal conductor contained within the body between the top surface and the bottom surface forming a first electrical path for the Z-directed component through which signals are passed, and the signal conductor having a length greater than the length L, the signal conductor comprising:

a plurality of C-shaped conductors spaced apart from one another; and

a plurality of leg segments arranged along the length direction of the body, the plurality of C-shaped conductors connected in series by the plurality of leg segments,

wherein adjacent C-shaped conductors are aligned relative to each other to provide current flow through adjacent C-shaped conductors in opposite directions such that current flows through a first one of the C-shaped conductors in a clockwise direction and through a second one of the C-shaped conductors adjacent the first C-shaped conductor in a counterclockwise direction.

2. The Z-directed delay line of claim 1 wherein the leg segments are arranged substantially parallel to the length direction of the body and the C-shaped conductor is arranged approximately perpendicular to the length direction of the body.

3. The Z-directed delay line of claim 1 further comprising a pair of conductive traces, each conductive trace of the pair of conductive traces disposed on one of the surfaces of the body and connected to a respective end of the signal conductor.

4. The Z-directed delay line of claim 3, wherein one of the pair of conductive traces is disposed on the top surface of the body and the other of the pair of conductive traces is disposed on the bottom surface of the body.

5. The Z-directed delay line of claim 3, wherein both of the pair of conductive traces are disposed on the top surface of the body or both of the pair of conductive traces are disposed on the bottom surface of the body.