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HK1210873A1 - Substrate with metal layer and method of manufacturing same - Google Patents

Substrate with metal layer and method of manufacturing same

Info

Publication number
HK1210873A1
HK1210873A1 HK15111490.5A HK15111490A HK1210873A1 HK 1210873 A1 HK1210873 A1 HK 1210873A1 HK 15111490 A HK15111490 A HK 15111490A HK 1210873 A1 HK1210873 A1 HK 1210873A1
Authority
HK
Hong Kong
Prior art keywords
substrate
metal layer
manufacturing same
manufacturing
same
Prior art date
Application number
HK15111490.5A
Other languages
Chinese (zh)
Inventor
陳衛華張欣
Original Assignee
深圳市峻澤科技有限公司 廣東省深圳市寶安區
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市峻澤科技有限公司 廣東省深圳市寶安區 filed Critical 深圳市峻澤科技有限公司 廣東省深圳市寶安區
Publication of HK1210873A1 publication Critical patent/HK1210873A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
HK15111490.5A 2015-06-26 2015-11-20 Substrate with metal layer and method of manufacturing same HK1210873A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510366929.0A CN104953011B (en) 2015-06-26 2015-06-26 A substrate with a metal layer and its manufacturing method

Publications (1)

Publication Number Publication Date
HK1210873A1 true HK1210873A1 (en) 2016-05-06

Family

ID=54167536

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15111490.5A HK1210873A1 (en) 2015-06-26 2015-11-20 Substrate with metal layer and method of manufacturing same

Country Status (2)

Country Link
CN (1) CN104953011B (en)
HK (1) HK1210873A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107072044B (en) * 2017-06-05 2024-04-12 广东顺德施瑞科技有限公司 Double-sided flexible circuit board
CN109538999A (en) * 2018-11-29 2019-03-29 深圳市利和腾鑫科技有限公司 The production technology of lamp bar compliant conductive connector
CN110402013A (en) * 2019-07-17 2019-11-01 佛山市新鹿电子科技有限公司 LED lamp area circuit board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7943859B2 (en) * 2004-03-31 2011-05-17 Mitsubishi Cable Industries, Ltd. Circuit board, its manufacturing method, and joint box using circuit board
CN201797655U (en) * 2010-08-24 2011-04-13 张�林 Double-side circuit board made of parallel flat leads
CN103167744B (en) * 2011-12-08 2016-03-02 王定锋 LED wiring board with element and preparation method thereof
CN102711368A (en) * 2012-05-21 2012-10-03 王定锋 Light-emitting diode (LED) module with single-sided hybrid circuit and manufacturing method for LED module
CN204005452U (en) * 2014-07-28 2014-12-10 深圳市零奔洋科技有限公司 Flexible light band
CN204377247U (en) * 2014-11-02 2015-06-03 王定锋 The LED lamp bar wiring board that a kind of cross cutting metal forming makes

Also Published As

Publication number Publication date
CN104953011B (en) 2016-05-11
CN104953011A (en) 2015-09-30

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20200625