HK1201664B - Ultrasound transducer and manufacturing methods thereof - Google Patents
Ultrasound transducer and manufacturing methods thereof Download PDFInfo
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- HK1201664B HK1201664B HK15102071.1A HK15102071A HK1201664B HK 1201664 B HK1201664 B HK 1201664B HK 15102071 A HK15102071 A HK 15102071A HK 1201664 B HK1201664 B HK 1201664B
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Description
This application relates to ultrasonic transducers. The application further relates to ultrasonic transducers used for medical imaging.
A trade-off in medical ultrasound imaging is depth of penetration and spatial resolution. Higher ultrasound imaging frequencies enable higher spatial resolution at the expense of depth of penetration. Lower ultrasound imaging frequencies enable deeper penetration at the expense of spatial resolution. It would be useful if a single ultrasound imaging device was able to image across a broad range of frequencies in order to operate at a higher frequency for better spatial resolution and at a lower frequency for deeper penetration.
Broad bandwidth ultrasound imaging devices may include use of high sensitivity materials (e.g., single crystal piezoelectric composites), use of multiple matching layers, use of multiple transducers, and use of multiple devices. These approaches can be expensive and be difficult to implement from a manufacturing perspective, particularly for small, single-use, high-frequency ultrasound devices that are used in relatively high volumes (e.g., intravascular ultrasound catheters).
It would be advantageous to have an ultrasound transducer structure and corresponding manufacturing process that enables broadband imaging performance for small, single-use, high-frequency ultrasound devices. It would be further advantageous if the transducer is cost effective and easy to manufacture.
An ultrasonic transducer according to the present invention includes a backing element, an active element overlying the backing element, and a matching element overlying the active element. The matching element having an inner surface that contacts the active element and an outer surface with a non-homogenous texture.
The matching element comprises a single matching layer where the outer surface has a first region with a first texture and a first material composition and a second region with a second texture and a second material composition. The first texture differs from the second texture. The first material composition may differ from the second material composition.
The first and second textures of the matching layer may be coarse or rough. The first and second regions have a reduced thickness in the matching layer. The first and second textures may be formed by ablation. The first and second textures may be formed by abrasion.
The matching element may include a plurality of matching regions having different thicknesses. The matching regions may be arranged side-by-side on the active element. At least two of the matching regions may be overlapping.
Furthermore, the matching layer may include a plurality of discrete matching regions of a first material over the active element. The matching element may further include a fill-in matching region of a second material with a different composition from the first material deposited between the discrete matching regions over the active element. The discrete matching regions of the first material and the discrete matching regions of the second material may be of the same thickness thereby forming a matching layer formed from two materials with different compositions.
In a further embodiment, a method of making an ultrasonic transducer includes the steps of providing a backing element, providing an active element overlying the backing layer, and forming a matching element over the active element, the matching element having an inner surface that contacts the active element and an outer surface with a non-homogeneous texture.
The matching element comprises a single matching layer and the forming step may include providing the outer surface with a first region having a first texture and a first material composition and a second region having a second texture and a second material composition. The first texture differs from the second texture. The first material composition may differ from the second material composition.
The matching layer has a thickness, and the step of providing the outers surface with first and second regions includes a step of reducing the thickness of the matching layer. The reducing step may include ablation. The reducing step may include abrasion.
The forming step may include providing the matching layer with a plurality of matching regions. The step of providing the matching layer with a plurality of matching regions may include arranging the matching regions side-by-side on the active element. The step of providing the matching layer with a plurality of matching regions may include overlapping at least two of the matching regions.
The forming step may include depositing a plurality of discrete matching regions of a first material on the active element. The forming step may further include forming a fill-in matching region of a second element between the discrete matching regions of the first material deposited on the active element. The method may further include the further step of causing the discrete matching regions of the first material and the discrete matching regions of the second material to have the same thickness.
The drawings are not to scale (unless so stated) and are intended for use in conjunction with the explanations in the following detailed description. Some embodiments will hereinafter be described in conjunction with the appended drawings, wherein like numerals denote like elements.
- FIG. 1 is a perspective view of a prior art transducer stack in accordance with an embodiment.
- FIG. 2 is a section view of a transducer stack with a matching element having two matching regions in accordance with an embodiment.
- FIG. 3 is a section view of a transducer stack with a matching element having more than two matching regions in accordance with an embodiment.
- FIG. 4 illustrates laser ablation of a matching element of a transducer stack in accordance with an embodiment.
- FIG. 5 is a perspective view of a transducer stack with a laser-ablated matching element in accordance with an embodiment.
- FIG. 5A is a section view of the transducer stack shown in FIG. 5.
- FIG. 6 illustrates micro-abrasive blasting of a matching element of a transducer stack in accordance with an embodiment.
- FIG. 7 is a perspective view of a transducer stack with a laser-ablated and micro-abrasive blasted matching element in accordance with an embodiment.
- FIG. 7A is a section view of the transducer stack shown in FIG. 7.
- FIG. 8 illustrates a time-domain response of an ultrasonic transducer stack before ablation in accordance with an embodiment.
- FIG. 9 illustrates a frequency-domain response of a transducer stack before ablation in accordance with an embodiment.
- FIG. 10 illustrates a time-domain response of a transducer stack after ablation in accordance with an embodiment.
- FIG. 11 illustrates a frequency-domain response of a transducer stack after ablation in accordance with an embodiment.
- FIG. 12 illustrates a time-domain response of a transducer stack after ablation that is excited at a first frequency in accordance with an embodiment.
- FIG. 13 illustrates a frequency-domain response of a transducer stack after ablation that is excited at a first frequency in accordance with an embodiment.
- FIG. 14 illustrates a time-domain response of a transducer stack after ablation that is excited at a second frequency in accordance with an embodiment.
- FIG. 15 illustrates a frequency-domain response of a transducer stack after ablation that is excited at a second frequency in accordance with an embodiment.
- FIG. 16 is a top view of a matching element stencil in accordance with an embodiment.
- FIG. 17 is a section view of a transducer stack having matching regions formed from a first material based on the stencil shown in FIG. 16.
- FIG. 18 is a section view of a transducer stack having a second material formed over matching regions formed from a first material based on the stencil shown in FIG. 16.
- FIG. 19 is a section view of a transducer stack having matching regions formed from a first material and a matching region formed from a second material based on the stencil shown in FIG. 16.
The following description provides some practical illustrations for implementing some embodiments of the present invention. Examples of constructions, materials, dimensions, and manufacturing processes are provided for selected elements, and all other elements employ that which is known to those of ordinary skill in the field of the invention. Those skilled in the art will recognize that many of the noted examples have a variety of suitable alternatives.
For example, this application provide certain examples of a transducer stack appropriate for use in an intravascular ultrasound (IVUS) catheter having an ultrasound transducer disposed within the catheter sheath. These examples are given for illustrative purposes only and do not limit the application of the invention to only IVUS catheters.
Backing layer 104 may be composed of an electrically conductive epoxy, such as a tungsten-loaded epoxy. In the example of a transducer stack for use in an IVUS catheter, the thickness of backing layer 104 may be 200 µm or greater. In other examples, the appropriate thickness of backing layer 104 should be sufficiently thick to attenuate ultrasonic vibrations from active element 101 in the backwards direction (toward backing layer).
This application discloses a transducer stack having a matching layer that is matched at more than one ultrasound frequency to improve the transmit and receive efficiency of the transducer stack for a broader range of ultrasound frequencies. There are a number of techniques that may be used to form a matching element that is matched at more than one ultrasound frequency. Subtractive techniques like machining, grinding or etching may be used to modify the thickness profile of a matching layer in a matching element. Other subtractive techniques such as laser ablation or micro-abrasive blasting modify the thickness of the matching element and may also modify the composition profile of the matching element. For example, when a matching layer formed from silver-loaded epoxy is laser ablated or abrasively blasted, more of the softer epoxy may be removed compared to the silver. This would change the mass density of the ablated/blasted regions which may have an effect on the ultrasonic properties of the matching element. Generally, subtractive techniques will also increase the effective surface area of the matching element which can impact on the ultrasonic properties of the matching element.
These subtractive techniques may be used individually, or in combination to form a matching element with a coarse or roughened surface. The coarse or roughened surface of the matching element creates a varying and non-uniform thickness allowing the matching element to match to more than one ultrasound frequency. Furthermore, the coarse or roughened surface of the matching element results in an increased effective surface area of the matching element, can impact the ultrasonic properties of the matching element. Precise control of the matching element modification process will provide further improvements. An ultrasound transducer stack having a matching element with finely controlled, coarseness or roughness enables balancing the amount of transducer area matched to different ultrasound frequencies.
One example of a subtractive technique that may be used to form a matching element able to match at more than one ultrasound frequency is laser ablation. FIG. 4 illustrates a laser system 200 ablating a surface of matching element 105 of transducer stack 300. Laser system 200 includes a light source (not shown) that may operate in the near-infrared spectrum wherein the optical wavelength can vary between 800 nm and 2500 nm. Exemplary laser sources that operate in the near-infrared spectrum include neodymium-doped yttrium aluminum garnet (or ND:YAG) lasers, laser diodes, and fiber lasers. The light source generates laser beam 202 that may be directed through lens 204. Focused laser beam 206 ablates a surface of matching element 105 to form an ablated region (see FIG. 5 ). Laser system 200 may be repeatedly translated to ablate multiple regions of a surface of matching element 105. Alternatively, transducer stack 300 may be translated relative to the laser system 200. The ablated region size and depth for a given laser system may be controlled by the laser system pulse energy, pulse duration and laser beam diameter.
Another example of a subtractive technique that may be used to form a matching element able to match at more than one ultrasound frequency is micro-abrasive blasting. FIG. 6 illustrates micro-abrasive blasting system 400 that is ablating matching element 305. Micro-abrasive blasting system 400 includes abrasive nozzle 401. Micro-abrasive blasting system 400 delivers a stream of abrasive particles 403 to matching element 305 of transducer stack 500 typically using a pressurized gas such as nitrogen or dry air. In the example of a transducer stack for use in an IVUS catheter, the size of the abrasive particles may range from 10 µm to 200 µm and include soft abrasives such as wheat starch or sodium bicarbonate; the depths of the ablated regions generally range between 0.1 µm and 10 µm; the pressure of the pressurized gas may range between 40 PSI and 140 PSI; and the area of the abrasive-blasted region is generally the entire surface area of the matching element. In other examples, the appropriate size and hardness of the abrasive particles, depth of ablated regions, pressure of the pressurized gas, and area of abrasive blasting may vary depending on the specific application of the transducer stack.
Subtractive techniques may be used in combination to further increase the transmit and receive efficiency of a transducer stack over a broader range of frequencies. FIG. 7 illustrates transducer stack 500 having an abrasive-blasted and a laser-ablated matching element 505. The surface of matching element 505 is shown to have laser-ablated regions 510-518. FIG. 7A shows a section view of transducer stack 500 that includes ablated regions 510, 512 that have been laser-ablated and abrasive-blasted.
The increased bandwidth further enables imaging at more than one frequency. FIGs. 12 to 15 show the pulse-echo time-domain and frequency-domain responses of transducer stack 500 having an ablated matching element 506, as illustrated in FIG. 7 . FIGs. 12 and 13 respectively show a pulse-echo time-domain response 422 and a pulse-echo (frequency-domain) power spectrum 424 of a short-time electrical excitation having a first frequency. FIGs. 14 and 15 respectively show a pulse-echo time-domain response 432 and a pulse-echo (frequency-domain) power spectrum 434 of a short-time electrical excitation having a second frequency, wherein the second frequency is lower than the first frequency. The pulse-echo time-domain response 422 of the transducer to the first-frequency, short-time, electrical excitation is shorter than the pulse-echo time-domain response 432 of the transducer to the second-frequency, short-time, electrical excitation. The pulse-echo power spectrum 424 of the transducer to the first-frequency, short-time, electrical excitation has a higher center frequency than that of the pulse-echo power spectrum 434 of the transducer to the second-frequency, short-time, electrical excitation. A transducer operating with a shorter time-domain pulse and higher center frequency will generally enable imaging with better spatial resolution and a smaller depth of penetration. Conversely, a transducer operating with a longer time-domain pulse and lower center frequency will generally enable imaging with a larger depth of penetration and lower spatial resolution.
Deposition techniques may also be used to increase the transmit and receive efficiency of a transducer stack over a broader range of frequencies. In one technique, one or more stencils may be used to form a matching layer of a matching element, the matching layer having multiple matching regions formed from materials with different compositions. Stencils can be developed from metals, such as stainless steel. Stencil patterns can be fabricated using known processes, such as photochemical machining. A stencil includes at least one cut-out hole that may be of a variety of shapes, including circle, rectangle, or triangle. In the example of a transducer stack for use in an IVUS catheter having a width of approximately 0.5 mm and a length of approximately 0.75 mm, the thickness of the stencil may range from 0.05 mm to 1 mm, and the cut-out holes may vary in size from approximately 0.025 mm to 0.5mm. In other examples, the dimensions of the stencil and the size and shape of the cut-out-holes may vary depending on the specific application of the transducer stack.
This application discloses a number of subtractive and deposition techniques, each method may be used individually to increase the transmit and receive efficiency of a transducer stack over a broad range of frequencies. It can be appreciated, that any of these methods may also be used in combination with each other to further increase the efficiency of a transducer stack. For example, as noted above, FIG. 7 shows a transducer stack 500 having a matching element having been both laser-ablated and abrasive-blasted. In another example, the transducer stack 700, as shown in FIG. 19 , may have its matching element 705 coarsened or roughened using either laser ablation, abrasive blasting, or both. In yet another example, these techniques may be performed on transducer stack 120 and 130 as shown in FIGs. 2 and 3 , respectively.
Furthermore, the subtractive and deposition techniques disclosed in this application may be used individually or in combination on varying transducer stacks. For example, these techniques may be performed on transducer stack 100 shown in FIG. 1 which includes backing layer 104, active element 101 having a single active layer 102, and matching element 105 having a single matching layer 106. In another example, these techniques may be performed on a transducer stack including a backing layer, an active element having one or more active layers, and a matching element having one or more matching layers. In yet another example, using FIG. 19 as a reference, these techniques may be applied to a transducer stack 700 having an active element 101 with more than one active layer, and a matching element 705 with more than one matching layer, where one of those layers is similar to matching layer 706.
In the present invention, an ultrasonic transducer is provided. The transducer includes an active element having a first side and a second side. The transducer includes a backing element attached to the first side of the active element. The transducer includes a matching element attached to the second side of the active element. The matching element has a surface that is coarse or roughened causing the matching element to have a non-uniform thickness.
Such an ultrasonic transducer includes a variety of characteristics. The coarse or roughened surface of the matching element includes a plurality of concavities. The concavities may be ablated regions. In some embodiments, the ablated regions may have diameters ranging between 50 µm and 500 µm. In some embodiments, by use of micro-abrasive blasting, the ablated regions may cover up to the entire surface of the transducer. In some embodiments, the matching element may include at least two matching layers. In some embodiments, the active element may further comprise two active layers.
In the present invention, an ultrasonic transducer is provided. The transducer can include an active element having a first side and a second side. The transducer can include a backing element attached to the first side of the active element. The transducer further includes a matching element attached to the second side of the active element. The matching element includes at least one matching layer. At least one of the matching layers includes at least a first matching region formed from a first material and a second matching region formed from a second material. The first and the second materials can be formed from materials having different compositions.
Such an ultrasonic transducer can include a variety of characteristics. In the embodiments, a surface of the matching element may be coarse or roughened. The matching element has a non-uniform thickness. The coarse or rough surface includes a plurality of concavities. In such embodiments, the concavities may be ablated regions. In some embodiments, the ablated regions may have diameters ranging between 50 µm and 500 µm. In some embodiments, by use of micro-abrasive blasting, the ablated regions may cover up to the entire surface of the transducer. In some embodiments, the matching element may include at least two matching layers. In some embodiments, the active layer may include at least two active layers.
Some embodiments provide a method of manufacturing an ultrasonic transducer. These embodiments involve providing an active element having a first side and a second side. These embodiments involve providing a backing element on the first side of the active element. These embodiments involve forming a matching element on the second side of the active element. These embodiments include forming a surface of the matching element such that the surface is coarse or roughened. In such embodiments, the matching element has a non-uniform thickness.
Such a method to form an ultrasonic transducer includes a variety of steps. In some embodiments, at least one subtractive technique may be used to form the matching element. In some embodiments, the at least one subtractive technique may include laser ablation. In some embodiments, the at least one subtractive technique may include micro-abrasive blasting. In some embodiments, the at least one subtractive technique may include both laser ablation and micro-abrasive blasting. In some embodiments, the at least one subtractive technique may include machining, grinding, or etching. In some embodiments, forming the active element may include forming at least two active layers. In some embodiments, forming the matching element may include forming at least two matching layers.
In some embodiments, a method of manufacturing an ultrasonic transducer is provided. The embodiments involve providing an active element having a first side and a second side. The embodiments involve providing a backing element on the first side of the active element. The embodiments involve forming a matching element on the second side of the active element. In such embodiments, the matching element includes a first matching layer. In such embodiments, the first matching layer may include a first matching region formed from a first material, and a second matching region formed from a second material having a different composition than the first material.
Such a method to form an ultrasonic transducer can include a variety of steps. In some embodiments, a first deposition technique may be used in forming the first matching layer. In such embodiments, the first deposition technique may include aligning a first stencil adjacent to the second side of the active element. In such embodiments, the stencil may have at least one cut-out-hole. In some embodiments, a first material may be applied to the first stencil. In some embodiments, the first stencil is removed and the first material is allowed to cure. In such embodiments, the cured first material forms the first matching region. In some embodiments, the first deposition technique may be repeated for a second stencil. In some embodiments, a second deposition technique may be used in forming the first matching layer. In such embodiments, the second deposition technique may include applying a second material to a surface of the matching element and allowing the second material to cure. In such embodiments, the cured second material forms the second matching region. In some embodiments, a first subtractive technique is used in forming the first matching layer. In such embodiments, the first subtractive technique may include reducing the thickness of the first matching layer until the thickness of the first and second matching regions are equal. In some embodiments, the first subtractive technique may include machining, grinding, or etching. In some embodiments, a second subtractive technique is used to form the matching element. In such embodiments, the matching element may have a surface that is coarse or rough. In such embodiments, the matching element may have a non-uniform thickness. In some embodiments, the second subtractive technique may include laser ablation. In some embodiments, the second subtractive technique may include micro-abrasive blasting. In some embodiments, the second subtractive technique may include both laser ablation and micro-abrasive blasting.
Thus, embodiments of the invention are disclosed.
Claims (11)
- An ultrasonic transducer comprising:a backing layer (104);an active element (101) overlying the backing layer (104); anda matching element (505) overlying the active element (101), the matching element (505) having an inner surface that contacts the active element (101) and an outer surface with a non-homogeneous texture wherein the matching element (505) comprises a single matching layer, the outer surface having (a) a first region (510) with a first texture and a first material composition, and (b) a second region (512) with a second texture and a second material composition, wherein the first texture differs from the second texture andcharacterised in that the first and second regions (510, 512) have a reduced thickness in the matching layer.
- The transducer of claim 1, wherein the first material composition differs from the second material composition.
- The transducer of claim 1, wherein the matching element (505) includes a plurality of matching regions having different thicknesses.
- The transducer of claim 3, wherein the matching regions are arranged side-by-side on the active element (101).
- The transducer of claim 2, wherein the matching element (505) further includes a plurality of discrete matching regions of the first material composition over the active element (101).
- The transducer of claim 5, wherein the matching element (505) further includes a fill-in matching region of the second material composition deposited between the discrete matching regions of the first material over the active element (101).
- A method of making an ultrasonic transducer comprising:providing a backing layer (104);providing an active element (101) overlying the backing layer (104); andforming a matching element (505) over the active element (101), the matching element (505) having an inner surface that contacts the active element (101) and an outer surface opposite the inner surface, the outer surface having a non-homogeneous texture wherein the matching element (505) comprises a single matching layer, the outer surface having (a) a first region (510) with a first texture and a first material composition and (b) a second region (512) with a second texture and a second material composition, wherein the first texture differs from the second texture andcharacterised in that the first and second regions (510, 512) have a reduced thickness in the matching layer.
- The method of claim 7, wherein the first material composition differs from the second material composition.
- The method of claim 7, wherein the step of providing the outer surface with first and second regions (510, 512) includes a step of reducing a thickness of the matching layer.
- The method of claim 9, wherein the reducing step includes ablation.
- The method of claim 9, wherein the reducing step includes abrasion.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2012/065706 WO2014077836A1 (en) | 2012-11-16 | 2012-11-16 | Ultrasound transducer and processing methods thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1201664A1 HK1201664A1 (en) | 2015-09-04 |
| HK1201664B true HK1201664B (en) | 2018-11-02 |
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