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HK1157501A1 - 製造半導體組件和結構的方法 - Google Patents

製造半導體組件和結構的方法

Info

Publication number
HK1157501A1
HK1157501A1 HK11111591.7A HK11111591A HK1157501A1 HK 1157501 A1 HK1157501 A1 HK 1157501A1 HK 11111591 A HK11111591 A HK 11111591A HK 1157501 A1 HK1157501 A1 HK 1157501A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
semiconductor component
semiconductor
component
Prior art date
Application number
HK11111591.7A
Other languages
English (en)
Inventor
．塞登
．卡尼
Original Assignee
半導體元件工業有限責任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 半導體元件工業有限責任公司 filed Critical 半導體元件工業有限責任公司
Publication of HK1157501A1 publication Critical patent/HK1157501A1/zh

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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
HK11111591.7A 2009-09-29 2011-10-27 製造半導體組件和結構的方法 HK1157501A1 (zh)

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TWI576869B (zh) 2014-01-24 2017-04-01 精材科技股份有限公司 被動元件結構及其製作方法
KR102410018B1 (ko) * 2015-09-18 2022-06-16 삼성전자주식회사 반도체 패키지
US20190206822A1 (en) * 2017-12-30 2019-07-04 Intel Corporation Missing bump prevention from galvanic corrosion by copper bump sidewall protection
KR20220072234A (ko) * 2020-11-25 2022-06-02 삼성전자주식회사 Ubm 패드를 포함하는 반도체 패키지
CN113380650A (zh) * 2021-08-12 2021-09-10 颀中科技（苏州）有限公司 一种金属凸块的制造方法及金属凸块结构
US20240379603A1 (en) * 2023-05-08 2024-11-14 Semiconductor Components Industries, Llc Structure and method for power metal lines

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US9263390B2 (en) 2016-02-16
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US20130244418A1 (en) 2013-09-19
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US8445375B2 (en) 2013-05-21
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CN102034741A (zh) 2011-04-27
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