HK1052253B - Mosfet的製造方法 - Google Patents
Mosfet的製造方法Info
- Publication number
- HK1052253B HK1052253B HK03104456.6A HK03104456A HK1052253B HK 1052253 B HK1052253 B HK 1052253B HK 03104456 A HK03104456 A HK 03104456A HK 1052253 B HK1052253 B HK 1052253B
- Authority
- HK
- Hong Kong
- Prior art keywords
- mosfet manufacturing
- mosfet
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0188—Manufacturing their isolation regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0212—Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9903081A SE517452C2 (sv) | 1999-09-01 | 1999-09-01 | Metalloxidhalvledaranordning och förfarande för dess tillverkning |
PCT/SE2000/001607 WO2001017009A1 (en) | 1999-09-01 | 2000-08-23 | Method to fabricate a mosfet |
Publications (2)
Publication Number | Publication Date |
---|---|
HK1052253A1 HK1052253A1 (en) | 2003-09-05 |
HK1052253B true HK1052253B (zh) | 2006-01-27 |
Family
ID=20416816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK03104456.6A HK1052253B (zh) | 1999-09-01 | 2003-06-20 | Mosfet的製造方法 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1214738A1 (zh) |
JP (1) | JP2003508910A (zh) |
KR (1) | KR20020027615A (zh) |
CN (1) | CN1206710C (zh) |
AU (1) | AU6884600A (zh) |
CA (1) | CA2384004A1 (zh) |
HK (1) | HK1052253B (zh) |
SE (1) | SE517452C2 (zh) |
TW (1) | TW447132B (zh) |
WO (1) | WO2001017009A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101456454B1 (ko) | 2008-06-25 | 2014-11-03 | 주성엔지니어링(주) | 반도체 소자 및 이의 제조 방법 |
CN101789401B (zh) * | 2009-01-23 | 2011-10-05 | 中芯国际集成电路制造(上海)有限公司 | Cmos晶体管及其制作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5911114A (en) * | 1997-03-21 | 1999-06-08 | National Semiconductor Corporation | Method of simultaneous formation of salicide and local interconnects in an integrated circuit structure |
US5897348A (en) * | 1998-03-13 | 1999-04-27 | Texas Instruments - Acer Incorporated | Low mask count self-aligned silicided CMOS transistors with a high electrostatic discharge resistance |
-
1999
- 1999-09-01 SE SE9903081A patent/SE517452C2/sv not_active IP Right Cessation
- 1999-09-10 TW TW088115648A patent/TW447132B/zh active
-
2000
- 2000-08-23 EP EP00957193A patent/EP1214738A1/en not_active Withdrawn
- 2000-08-23 CA CA002384004A patent/CA2384004A1/en not_active Abandoned
- 2000-08-23 KR KR1020027002778A patent/KR20020027615A/ko active IP Right Grant
- 2000-08-23 CN CNB008152098A patent/CN1206710C/zh not_active Expired - Fee Related
- 2000-08-23 JP JP2001520458A patent/JP2003508910A/ja not_active Withdrawn
- 2000-08-23 AU AU68846/00A patent/AU6884600A/en not_active Abandoned
- 2000-08-23 WO PCT/SE2000/001607 patent/WO2001017009A1/en active IP Right Grant
-
2003
- 2003-06-20 HK HK03104456.6A patent/HK1052253B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CA2384004A1 (en) | 2001-03-08 |
HK1052253A1 (en) | 2003-09-05 |
AU6884600A (en) | 2001-03-26 |
EP1214738A1 (en) | 2002-06-19 |
CN1387677A (zh) | 2002-12-25 |
CN1206710C (zh) | 2005-06-15 |
JP2003508910A (ja) | 2003-03-04 |
TW447132B (en) | 2001-07-21 |
KR20020027615A (ko) | 2002-04-13 |
SE9903081L (sv) | 2001-03-02 |
SE517452C2 (sv) | 2002-06-04 |
WO2001017009A1 (en) | 2001-03-08 |
SE9903081D0 (sv) | 1999-09-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20090823 |