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HK1052253B - Mosfet的製造方法 - Google Patents

Mosfet的製造方法

Info

Publication number
HK1052253B
HK1052253B HK03104456.6A HK03104456A HK1052253B HK 1052253 B HK1052253 B HK 1052253B HK 03104456 A HK03104456 A HK 03104456A HK 1052253 B HK1052253 B HK 1052253B
Authority
HK
Hong Kong
Prior art keywords
mosfet manufacturing
mosfet
manufacturing
Prior art date
Application number
HK03104456.6A
Other languages
English (en)
Other versions
HK1052253A1 (en
Inventor
Johansson Ted
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of HK1052253A1 publication Critical patent/HK1052253A1/xx
Publication of HK1052253B publication Critical patent/HK1052253B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/0123Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0188Manufacturing their isolation regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0212Manufacture or treatment of FETs having insulated gates [IGFET] using self-aligned silicidation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01Manufacture or treatment
    • H10D84/02Manufacture or treatment characterised by using material-based technologies
    • H10D84/03Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
HK03104456.6A 1999-09-01 2003-06-20 Mosfet的製造方法 HK1052253B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9903081A SE517452C2 (sv) 1999-09-01 1999-09-01 Metalloxidhalvledaranordning och förfarande för dess tillverkning
PCT/SE2000/001607 WO2001017009A1 (en) 1999-09-01 2000-08-23 Method to fabricate a mosfet

Publications (2)

Publication Number Publication Date
HK1052253A1 HK1052253A1 (en) 2003-09-05
HK1052253B true HK1052253B (zh) 2006-01-27

Family

ID=20416816

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03104456.6A HK1052253B (zh) 1999-09-01 2003-06-20 Mosfet的製造方法

Country Status (10)

Country Link
EP (1) EP1214738A1 (zh)
JP (1) JP2003508910A (zh)
KR (1) KR20020027615A (zh)
CN (1) CN1206710C (zh)
AU (1) AU6884600A (zh)
CA (1) CA2384004A1 (zh)
HK (1) HK1052253B (zh)
SE (1) SE517452C2 (zh)
TW (1) TW447132B (zh)
WO (1) WO2001017009A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101456454B1 (ko) 2008-06-25 2014-11-03 주성엔지니어링(주) 반도체 소자 및 이의 제조 방법
CN101789401B (zh) * 2009-01-23 2011-10-05 中芯国际集成电路制造(上海)有限公司 Cmos晶体管及其制作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911114A (en) * 1997-03-21 1999-06-08 National Semiconductor Corporation Method of simultaneous formation of salicide and local interconnects in an integrated circuit structure
US5897348A (en) * 1998-03-13 1999-04-27 Texas Instruments - Acer Incorporated Low mask count self-aligned silicided CMOS transistors with a high electrostatic discharge resistance

Also Published As

Publication number Publication date
CA2384004A1 (en) 2001-03-08
HK1052253A1 (en) 2003-09-05
AU6884600A (en) 2001-03-26
EP1214738A1 (en) 2002-06-19
CN1387677A (zh) 2002-12-25
CN1206710C (zh) 2005-06-15
JP2003508910A (ja) 2003-03-04
TW447132B (en) 2001-07-21
KR20020027615A (ko) 2002-04-13
SE9903081L (sv) 2001-03-02
SE517452C2 (sv) 2002-06-04
WO2001017009A1 (en) 2001-03-08
SE9903081D0 (sv) 1999-09-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20090823