HK1018160A1

HK1018160A1 - Electric power conversion means and heat conduction tubes for electric power conversion means

Info

Publication number: HK1018160A1
Application number: HK99103095A
Authority: HK
Inventors: 高桥伸广
Original assignee: 东芝株式会社
Priority date: 1997-10-27
Filing date: 1999-07-19
Publication date: 1999-12-10
Also published as: CN100387106C; TW390111B; BR9804506B1; KR19990037381A; CN100550357C; CN1215974A; KR100443446B1; CN101150099A; CN100550358C; BR9804506A; JPH11132678A; JP3642548B2; CN101150100A

Abstract

The present invention relates to a power conversion device and a heat-pipe cooler for the power conversion device. The power conversion device comprises a plurality of electrical semiconductor elements, a heat-pipe cooler for cooling devices, and other electrical equipment including a conductor. A stack 6 with a semiconductor element 8 and a heat-pipe cooler 5 for cooling it is arranged vertically. A movable part 3 that can move along a guide rail 2 that is provided at a frame 1B accommodating the stack 6 is provided at the heat-pipe cooler 5. Electrical equipment 7 including a conductor for making connection to outside is arranged at the lower portion of the stack 6. This sort of arrangement makes it difficult to be affected by the arrangement of the heat-pipe cooler, thus saving the space of the equipment.

Description

Power conversion device and heat conduction pipe for power conversion device

Technical Field

The present invention relates to a power converter including a plurality of power semiconductor elements, a heat pipe cooler and a conductor for cooling the elements, and other electric components, and a heat pipe cooler for the power converter.

Background

In recent years, a problem has arisen that heat generation loss increases as the capacity and speed of an electric power semiconductor element increase. Therefore, it is an important technical problem to improve the cooling efficiency of the cooling device for electric power semiconductor elements to solve the problem of an increase in heat generation loss and to avoid an increase in size of the device.

Fig. 1 shows a schematic configuration of a self-cooling power conversion device using a heat pipe cooler, and as shown in the figure, the main components of the power conversion device are a heat pipe cooler 101 as a cooler, an electric power semiconductor element 102, an electric component 103 such as a conductor, a frame 104, and the like.

As shown in fig. 1, the heat pipe cooler 101 is mainly composed of a heat receiving unit 105 that is in contact with the electric power semiconductor element 102, a heat pipe 106, and a heat sink 107. The fins 107 are arranged perpendicularly to the heat conductive pipes 106. In the case of a self-cooling power conversion device that cools by natural convection without providing a forced cooling system such as a fan for shape reasons, if the fins 107 of heat transfer pipe cooler 101 are arranged in a horizontal state, that is, if the heat transfer pipe 106 is arranged in a vertical state, air stagnates between the fins and cooling efficiency is reduced. On the other hand, if the heat transfer pipe 106 is disposed horizontally in order to dispose the fins 107 vertically, the coolant cannot be collected. Therefore, in consideration of recovery of the coolant, heat transfer pipe cooler 101 is generally disposed laterally at a certain angle as shown in fig. 1.

The power conversion device having the above-described structure is used in many applications such as a transformer and a rectifier, and is an indispensable device in the power industry field.

However, in the self-cooling type power conversion apparatus using the conventional heat pipe cooler described above, as described above, the arrangement is limited due to the characteristics of the heat radiation fins 107 of the heat pipe cooler 101, and as shown in fig. 1, the heat radiation fins 107 are arranged in a vertical state as much as possible, so the shape and size of the apparatus largely depend on the shape and size of the heat pipe cooler 101.

In addition, when a structure in which stacks (stacks) constituting the main circuit are stacked upward is adopted in consideration of the structure and the size reduction of the main circuit, the temperature rise of each layer is different when the apparatus is operated, and thus a structure in which the cooling capacity of each layer is made uniform is adopted, which increases the height of the apparatus. In order to meet the requirement of large capacity, the heat-transfer tube cooler and the electric power semiconductor element are alternately connected in parallel to form a main circuit, which further inevitably increases the size of the apparatus. For the above reasons, the method of arranging the heat transfer tube cooler and the size of the heat transfer tube cooler become a major problem in order to reduce the size of the entire apparatus.

In addition, in the power conversion device, the heat pipe cooler and other components such as electric components are generally fixed to a frame, and in order to prevent damage to components such as semiconductor elements due to vibration during transportation, earthquake, or the like, a complicated vibration isolation system is required to be formed in the entire device during design, which makes the operation very difficult.

Disclosure of Invention

In order to solve the above problems, an object of the present invention is to provide a power converter and a heat conduction pipe cooler for a power converter, in which a heat conduction pipe cooler for cooling by natural convection is disposed in a vertical direction and sufficient cooling efficiency can be obtained, and the shape of the device main body is not easily affected by the disposition of the heat conduction pipe cooler, and the device is significantly miniaturized; and the number of the first and second groups,

a power converter is provided in which a semiconductor element, a heat pipe cooler, and other components constituting a main circuit are not directly fixed to a frame, and a spring damper system is provided between the main circuit and the converter body to suppress vibration of the main circuit member and sufficiently withstand vibration during transportation and earthquake.

In order to achieve the above object, the present invention provides a power converter and a heat conduction pipe cooler for the power converter having the following configurations. That is to say that the first and second electrodes,

the invention provides a power conversion device, wherein a stack frame having an electric power semiconductor element and a heat pipe cooler for cooling the electric power semiconductor element is arranged in a vertical direction, and an electric component including a conductor for external connection is arranged below the stack frame.

With this configuration, the shape of the device in the depth direction does not depend on the shape of the heat transfer pipe cooler, and the upward stacking structure is not required, so that the entire device can be downsized and simplified. Further, since the structure of stacking upward is not employed, a good cooling efficiency can be obtained. Further, since the electrical components such as the conductor for external connection and the capacitor are disposed below the stack, the entire device can be downsized and simplified in structure, and a cooling efficiency can be prevented from being lowered due to a stagnation phenomenon between the heat dissipating fins, thereby obtaining a good cooling efficiency.

In order to achieve the above object, the present invention also provides a power converter and a heat conduction pipe cooler for a power converter having the following configurations. That is to say that the first and second electrodes,

the invention provides a power converter, wherein a stack frame having an electric power semiconductor element and a heat pipe cooler for cooling the electric power semiconductor element is disposed in a vertical direction, a movable portion movable along a rail provided on a frame for accommodating the stack frame is provided on the heat pipe cooler, and an electric component including a conductor for external connection is disposed below the stack frame, and a heat radiation fin of the heat pipe cooler is disposed in an inclined manner with respect to the heat pipe.

By providing a movable portion for moving the heat pipe cooler, the work of forming the stack frame by the electric power semiconductor element and the heat pipe cooler can be simplified, and the cooling efficiency can be prevented from being lowered by the stagnation between the heat radiating fins, thereby obtaining a good cooling efficiency.

Here, at least the electric components including the conductor for external connection may be contained in a sealed container sealed with an insulating gas.

By using the insulating gas, the electric field strength can be suppressed, and the pressure resistance can be improved, so that the electric parts can be miniaturized and the entire device can be miniaturized.

In addition, a side wall for limiting the air flow direction may be provided on the side of the heat sink of the heat conductive pipe cooler.

With this structure, the structural strength of the stack can be improved by supporting the heat radiating fins by the side walls. In addition, when a plurality of stacks are arranged side by side, the direction of air inflow and outflow is limited for each stack due to the side wall, and cooling efficiency can be improved.

In the heat transfer pipe cooler, the heat transfer pipe may be formed by a plurality of pipes without fins.

By adopting the structure, no radiating fin is arranged, so that the problem of influence of configuration on cooling efficiency is solved, and the structure can adapt to any configuration requirement.

The heat transfer tube cooler may have a structure having a plurality of pin-shaped fins.

By adopting the structure, the cooling fins are acicular, so that the problem of influence of configuration on cooling efficiency is solved, and the cooling device can meet any configuration requirement.

The heat pipe cooler may have a structure in which the heat sink and the heat pipe are arranged in the same direction.

With this structure, it is possible to prevent the cooling efficiency from being lowered due to the stagnation phenomenon between the fins, and to obtain a good cooling efficiency.

As the heat pipe type cooler, an insulated heat pipe type cooler in which the heat receiving portion and the heat radiating portion are electrically insulated and a coolant having higher electrical insulating performance than water is used may be used.

With this configuration, it is not necessary to interpose an insulating part between the movable part and the heat transfer pipe cooler.

Further, the heat conductive pipe cooler may be provided with a spring damper.

With this configuration, since the vibration system of the stack frame and the vibration system of the apparatus main body can be considered separately, the vibration-proof design is easy, and a reliable vibration-proof effect is provided for the vibration-proof object.

In addition, elastic materials can be used on the guide rails.

With this structure, it is possible to suppress the vibration transmitted from the frame to the stack.

Drawings

The following is a brief description of the drawings.

Fig. 1 is a schematic front view of a conventional power conversion apparatus.

Fig. 2 is a schematic front view and side view of a power conversion device according to embodiment 1 of the present invention.

Fig. 3 is a schematic front view and side view of a heat conductive tubular cooler according to embodiment 3 of the invention.

Fig. 4 is a schematic front view and side view of a heat conductive tubular cooler according to embodiment 4 of the invention.

Fig. 5 is a schematic front view and side view of a heat conductive tubular cooler according to embodiment 5 of the invention.

Fig. 6 is a schematic plan view and front view of a heat conductive tubular cooler according to embodiment 6 of the invention.

Fig. 7 is a schematic front view and side view of a heat conductive tubular cooler according to embodiment 7 of the invention.

Fig. 8 is a schematic perspective view of an example of the heat transfer pipe cooler according to embodiment 8 of the present invention.

Fig. 9 is a schematic plan view and front view of another example of the heat conductive tubular cooler according to embodiment 8 of the present invention.

Fig. 10 is a schematic front view of a heat conductive tubular cooler and an electric power conversion device according to embodiment 10 of the present invention.

In the drawings, the same symbols represent the same parts or corresponding parts.

Detailed Description

(embodiment 1)

A power conversion device according to embodiment 1 of the present invention will be described below with reference to fig. 2.

Fig. 1 is a schematic front view of the embodiment (a) and a side view thereof (b).

In the power converter 10 of the present embodiment, the movable portions 3 such as pulleys are brought into contact with the guide rails 2 provided on the auxiliary frame 1B for disposing the heat pipe cooler 5, so that the heat pipe cooler 5 provided with the movable portions 3 such as pulleys via the insulating portions 4 is disposed in a vertically suspended manner, and a plurality of electric power semiconductor elements 8 are connected to the heat pipe coolers 5 to form the stack 6. The lower portion of the stack 6 and the conductor and other electric components 7 are disposed in the main body frame 1A below the sub-frame 1B.

Since heat transfer pipe cooler 5 is disposed vertically in this way, the shape of the device in the depth direction does not depend on the shape of heat transfer pipe cooler 5, and moreover, it is not necessary to adopt a structure in which the heat transfer pipe cooler is stacked upward, so that the size of the entire device and the structure can be reduced. Further, since the structure of stacking upward is not employed, a device excellent in thermal design can be realized with good cooling efficiency.

Further, since the electrical components 7 such as conductors and capacitors for external connection can be disposed below the stack 6 in a set, the entire device can be made compact and simplified in structure.

Further, since the movable portion 3 such as a pulley provided on the heat pipe cooler 5 via the insulating portion 4 can move freely on the guide rail 2 provided on the auxiliary frame 1B, the work of constructing the stack 6 can be simplified. Further, since the heat-transfer pipe coolers 5 are suspended, the respective heat-transfer pipe coolers 5 can be disposed in the vertical direction by their own weights. Therefore, when a plurality of electric power semiconductor elements 8 are connected and pressure-bonded by a jig or the like to form the stack 6, the work of aligning the centers of the respective elements by uniformly performing surface pressure-bonding can be simplified, and therefore, the labor can be saved. In addition, the shape and material of the movable portion 3 and the shape and material of the guide rail 2 are not limited.

(embodiment 2)

The following describes a power conversion device according to embodiment 2 of the present invention.

The general structure of this embodiment may be the same as that shown in FIG. 2, but the lower part (mainly the part composed of the heat receiving part of the heat pipe cooler 5 and the electric power semiconductor element 8) of the stack 6 and the main body frame 1A of the electric component 7 are housed in a sealed container, and SF is filled in the sealed container₆And the like insulating gas. It is not necessary for auxiliary frame 1B in which heat pipe cooler 5 is disposed to be a sealed structure, and heat pipe cooler 5 may be disposed inside and guide rail 2 may be laid on the upper portion.

When the material of the main body frame 1A is metal, the heat transfer pipe of the heat transfer pipe cooler 5 is insulated from the upper wall surface of the main body frame 1A at a portion where the heat transfer pipe penetrates the upper wall surface of the main body frame 1A.

In the present embodiment, each component is sealed and filled with SF in the main body frame 1A for accommodating the electric components 7 and the like₆And the like, in a sealed distribution board (sealed container) which is insulated from the gas. Since the use of the insulating gas can suppress the electric field intensity and improve the pressure resistance, the electric component 7 can be miniaturized and the entire device can be miniaturized. Further, the kind of the insulating gas is not limited to SF₆。

The following describes embodiments 3 to 9 of the present invention, which relate to a heat conductive tubular cooler for an electric power conversion device.

(embodiment 3)

A heat conductive tubular cooler for a power conversion device according to embodiment 3 of the present invention will be described below with reference to fig. 3.

Fig. (a) is a schematic front view of the heat-conductive tube cooler, and fig. (b) is a side view thereof. The heat pipe cooler of the present embodiment includes a movable unit 3, an insulating unit 4, a heat receiving unit 11, a heat pipe 12, and a heat sink 13.

This embodiment has, as shown in fig. 3(b), a guide portion 14, i.e., a portion where the front portion of the conventional heat conductive tubular cooler fin is inclined downward and the rear portion thereof is inclined upward. Therefore, as shown by the arrows in fig. 3(b), the air flows from below, and absorbs the heat of the heat sink 13 having the guide portion 14 to cool the air, so that the heat transfer tube cooler can be disposed in the vertical direction. In order to prevent heat from accumulating in the heat radiating portion, the shape of the heat radiating fin 13 including the guide portion 14 is preferably a size in which the horizontal portion is as small as possible. Thus, the heat conductive pipes 12 are formed into a thin plate shape, not a cylindrical shape, so that the horizontal portions can be reduced.

The guide portion 14 is inclined from the horizontal direction at a smaller angle, which is more space-efficient, but at a smaller angle, the resistance to the air flow increases. A stagnation phenomenon or the like occurs between the fins 13 to lower the cooling efficiency. Therefore, in consideration of space efficiency, the angle at which the guide portion 14 is inclined from the horizontal direction is preferably in the range of 20 ° to 35 °, but the angle is not limited.

(embodiment 4)

A heat pipe cooler for power conversion according to embodiment 4 of the present invention will be described below with reference to fig. 4.

Fig. (a) is a schematic front view of the heat transfer tube cooler, and fig. (b) is a side view thereof.

The heat pipe cooler of the present embodiment includes the movable portion 3, the insulating portion 4, the heat receiving portion 11, the heat pipe 12, and the fins 13, and as shown in fig. (b), the fins 13 of the heat pipe cooler are formed in an inclined shape. Therefore, as shown by the arrow in fig. (b), air flows from below, and absorbs the heat of the heat sink 13 to cool it.

The smaller the angle at which the fins 13 are inclined from the horizontal direction, the better the space efficiency, but the smaller the angle, the greater the resistance to the airflow. A stagnation phenomenon or the like occurs between the fins to lower the cooling efficiency. Therefore, in view of space efficiency, the angle at which the fins 13 are inclined from the horizontal direction is preferably in the range of 20 ° to 35 °, but the angle is not limited.

(embodiment 5)

A heat conductive tubular cooler for a power conversion device according to embodiment 5 of the present invention will be described below with reference to fig. 5.

In this embodiment, a side wall 14 is provided in the heat conductive tubular cooler of embodiment 3 or 4 shown in fig. 3 or 4. Since the power converter is structured such that the stack frame composed of the heat pipe cooler, the electric power semiconductor element, and the like is suspended from the frame, the structural load acting on the heat pipe cooler is large, but the structural strength of the stack frame can be improved since the heat radiation fins are supported by the side walls 14.

In addition, when a plurality of stacks are arranged side by side, the side walls 14 restrict the direction of air inflow and outflow for each stack, and cooling efficiency can be improved.

(embodiment 6)

A heat conductive tubular cooler for a power conversion device according to embodiment 6 of the present invention will be described below with reference to fig. 6.

Fig. (a) is a schematic plan view of the heat transfer tube cooler, and fig. (b) is a front view thereof.

The heat transfer tube cooler of the present embodiment is a heat transfer tube cooler including a heat receiving unit 11 and a plurality of heat transfer tubes 12 without fins. The heat conduction pipe cooler is not provided with radiating fins, so that the problem of influence of configuration on cooling efficiency is solved, and the heat conduction pipe cooler can meet any configuration requirement. In addition, the cross-sectional shape of the heat transfer pipe 12 is made into a star shape or the like to secure a heat dissipation area, which is remarkable in effect. However, the number of the heat transfer pipes 12 and the cross-sectional shape of the heat transfer pipes 12 are not limited. In fig. 6, a plurality of heat transfer pipes 12 are arranged in 1 row, and a plurality of rows are provided, but only 1 row may be provided.

Although not shown in the drawings, in the structure of the power conversion device, the heat transfer pipe cooler of the present invention may be configured such that the movable portion 3 and the insulating portion 4 are provided in the upper portion thereof, and may be disposed in the vertical direction as shown in fig. 3, 4, and 5.

(7 th embodiment)

A heat conductive tubular cooler for a power conversion device according to embodiment 7 of the present invention will be described below with reference to fig. 7.

The heat conduction tube cooler of the present embodiment is a heat conduction tube cooler having a plurality of pin-shaped projecting fins 13. Because the plurality of pin-shaped radiating fins 13 are formed, the problem of influence of arrangement on cooling efficiency is solved, and the pin-shaped radiating fins can meet any arrangement requirement.

Further, when the heat conductive pipe cooler is disposed vertically (i.e., the pin fins are disposed horizontally), the cooling effect is more excellent if the cross-sectional shape of the pins is formed into an oblong shape in the vertical direction, taking into account the loss due to air resistance. However, the number and the cross-sectional shape of the pin fins 13 are not limited.

(8 th embodiment)

A heat conductive tubular cooler for a power conversion device according to embodiment 8 of the present invention will be described below with reference to fig. 8 and 9.

Fig. 8 is a schematic perspective view of an example of the heat transfer pipe cooler according to embodiment 8.

Fig. 9(a) is a schematic plan view and fig. b is a front view of another example of the heat conductive tubular cooler according to embodiment 8.

The heat pipe cooler of the present embodiment is a heat pipe cooler having fins 13 arranged in the same direction as the heat pipe.

For example, as shown in fig. 8, since the fins 13 are arranged vertically in the same direction as the heat pipe cooler, when the fins are arranged vertically, the cooling efficiency is not lowered by the stagnation phenomenon occurring between the fins 13, and a good cooling efficiency can be obtained.

In addition, if the lateral fins 13b are provided between the longitudinal fins 13a to increase the heat radiation area as shown in fig. 9, the cooling efficiency can be further improved.

Although the configuration of the heat sink is not limited to the above.

In addition, although not shown in the drawings, in the configuration of the power conversion device, the heat transfer pipe cooler of the present invention may be configured such that the movable portion 3 and the insulating portion 4 are provided in the upper portion thereof, and may be disposed in the vertical direction as shown in fig. 3, 4, and 5.

(9 th embodiment)

The following describes example 9 of the present invention.

In this embodiment, an insulation type heat conduction pipe cooler not shown is used as a heat conduction pipe cooler which is a cooling device of the power conversion device shown in fig. 2 and 3.

The insulating heat transfer tube cooler electrically insulates a heat receiving portion and a heat radiating portion of the heat transfer tube cooler, and uses a coolant having an electrical insulating property higher than that of water.

Specifically, for example, an insulator through which a coolant can pass is used to connect a heat receiving portion and a heat radiating portion of a heat conductive tubular cooler, and a fluorocarbon is used as the coolant.

The insulating portion 4 can be reduced by using an insulating heat transfer tube cooler. And the dimensional error of the device caused by assembly and the like can be reduced.

(10 th embodiment)

A power conversion device according to embodiment 10 of the present invention will be described below with reference to fig. 10.

Fig. (a) is a schematic front view of the heat conduction pipe cooler, and fig. (b) is a schematic side view of an electric power conversion device using the heat conduction pipe cooler.

In this embodiment, as shown in fig. 10, a spring damper 15 is provided in the heat pipe cooler 5, and the connection between the stack frame composed of the heat pipe cooler 5 and the electric power semiconductor element and the conductor (the conductor for external connection) is not directly fixed to the frame 1 by using a flat-woven conductor 16.

With this structure, the vibration system of the stack containing the semiconductor elements most likely to be damaged during transportation and earthquake can be considered separately from the vibration system of the apparatus main body. In the conventional structure, when the vibration-proof design is performed on the whole device, the design must be performed in consideration of a complex vibration system composed of all the structural elements, and if the structure is adopted, the vibration-proof design is a relatively simple vibration system, so the vibration-proof design is easy, and the vibration-proof design has reliable effect on the vibration-proof object.

Further, by using an elastic material such as vibration-proof rubber as the material of the movable portion 3 and the guide rail 2, or by attaching an elastic material to the movable portion 3 and the guide rail 2, vibration transmitted from the frame 1 to the stack can be suppressed.

However, the material and shape of the spring damper member are not limited.

The present invention can provide a power conversion device that can cool by natural convection, in which a heat transfer pipe cooler is disposed in a vertical direction, and electrical components such as conductors can be disposed in a kit, the structure of the device body can be simplified, and the device size can be reduced.

Further, since the stack frame constituting the main circuit such as the semiconductor element and the heat pipe cooler is not directly fixed to the frame and the spring damper system is provided between the stack frame and the apparatus main body to suppress vibration of the main circuit component, the power converter can sufficiently withstand vibration during transportation and earthquake.

Obviously, many modifications and variations of the present invention are possible in light of the above teachings. In addition to the embodiments described above, other embodiments of the invention are possible within the scope of the claims.

Claims

1. A power conversion device is characterized by being provided with:

a stack frame having an electric power semiconductor element and a heat-conductive pipe cooler arranged in a vertical direction for cooling the electric power semiconductor element; and

an electric component disposed below the stack frame and including a conductor for external connection,

the heat pipe cooler is provided with a heat sink having a portion in which the inflow direction of air is inclined toward the stack side and the outflow direction is inclined away from the stack side.

2. The power conversion apparatus according to claim 1, wherein at least the electric component including a conductor for external connection is housed in a sealed container sealed with an insulating gas.

3. The power conversion apparatus according to claim 1, wherein a side wall that defines an air flow direction is provided on a side of the heat dissipation fins of the heat conductive tubular cooler.

4. The power conversion device according to claim 1, wherein the heat pipe cooler is a heat pipe formed by a plurality of pipes without fins.

5. The power conversion device according to claim 1, wherein the heat pipe cooler has a plurality of pin-shaped fins.

6. The power conversion device according to claim 1, wherein the heat-radiating fins of the heat-pipe cooler are arranged in a vertical direction.

7. The power conversion apparatus according to claim 1, wherein the heat-pipe-type cooler is an insulated heat-pipe-type cooler in which a heat receiving portion and a heat radiating portion are electrically insulated and a coolant having higher electrical insulation than water is used.

8. The power conversion apparatus according to claim 1, wherein a spring damper member is provided on the heat conductive tubular cooler.