GB9915954D0 - Solder alloy - Google Patents

Solder alloy

Info

Publication number: GB9915954D0
Authority: GB; United Kingdom
Prior art keywords: solder alloy; solder; alloy
Prior art date: 1999-07-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

GBGB9915954.3A

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Multicore Solders Ltd

Original Assignee

Multicore Solders Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-07-07

Filing date

1999-07-07

Publication date

1999-09-08

1999-07-07 Application filed by Multicore Solders Ltd filed Critical Multicore Solders Ltd

1999-07-07 Priority to GBGB9915954.3A priority Critical patent/GB9915954D0/en

1999-09-08 Publication of GB9915954D0 publication Critical patent/GB9915954D0/en

2000-06-29 Priority to GB0201171A priority patent/GB2367834B/en

2000-06-29 Priority to PCT/GB2000/002502 priority patent/WO2001003878A1/en

2000-06-29 Priority to AU55568/00A priority patent/AU5556800A/en

Status Ceased legal-status Critical Current

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

GBGB9915954.3A 1999-07-07 1999-07-07 Solder alloy Ceased GB9915954D0 (en)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
GBGB9915954.3A GB9915954D0 (en)	1999-07-07	1999-07-07	Solder alloy
GB0201171A GB2367834B (en)	1999-07-07	2000-06-29	Solder alloy
PCT/GB2000/002502 WO2001003878A1 (en)	1999-07-07	2000-06-29	Solder alloy
AU55568/00A AU5556800A (en)	1999-07-07	2000-06-29	Solder alloy

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GBGB9915954.3A GB9915954D0 (en)	1999-07-07	1999-07-07	Solder alloy

Publications (1)

Publication Number	Publication Date
GB9915954D0 true GB9915954D0 (en)	1999-09-08

Family

ID=10856849

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
GBGB9915954.3A Ceased GB9915954D0 (en)	1999-07-07	1999-07-07	Solder alloy
GB0201171A Expired - Fee Related GB2367834B (en)	1999-07-07	2000-06-29	Solder alloy

Family Applications After (1)

Application Number	Title	Priority Date	Filing Date
GB0201171A Expired - Fee Related GB2367834B (en)	1999-07-07	2000-06-29	Solder alloy

Country Status (3)

Country	Link
AU (1)	AU5556800A (en)
GB (2)	GB9915954D0 (en)
WO (1)	WO2001003878A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TW592872B (en)	2001-06-28	2004-06-21	Senju Metal Industry Co	Lead-free solder alloy
CN100464930C (en)	2002-01-10	2009-03-04	千住金属工业株式会社	Lead-Free Solder Alloys for Supplementary Solder Baths
DE10319888A1 (en)	2003-04-25	2004-11-25	Siemens Ag	Solder material based on SnAgCu
ATE555871T1 (en)	2003-10-07	2012-05-15	Senju Metal Industry Co	LEAD-FREE SOLDER BALL
CZ297596B6 (en) *	2005-10-19	2007-01-10	JenĂk@Jan	Lead-free solder
JP6011709B1 (en) *	2015-11-30	2016-10-19	千住金属工業株式会社	Solder alloy

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS6186091A (en) *	1984-10-03	1986-05-01	Furukawa Electric Co Ltd:The	Sn-sb alloy solder
DE3730764C1 (en) *	1987-09-12	1988-07-14	Demetron	Use of tin and / or lead alloys as soft solders to apply semiconductors to metallic substrates
GB8807730D0 (en) *	1988-03-31	1988-05-05	Cookson Group Plc	Low toxicity soldering compositions
JP3693762B2 (en) *	1996-07-26	2005-09-07	株式会社ニホンゲンマ	Lead-free solder
KR19980068127A (en) *	1997-02-15	1998-10-15	김광호	Lead-Free Alloys for Soldering
US6179935B1 (en) *	1997-04-16	2001-01-30	Fuji Electric Co., Ltd.	Solder alloys

1999
- 1999-07-07 GB GBGB9915954.3A patent/GB9915954D0/en not_active Ceased
2000
- 2000-06-29 GB GB0201171A patent/GB2367834B/en not_active Expired - Fee Related
- 2000-06-29 AU AU55568/00A patent/AU5556800A/en not_active Abandoned
- 2000-06-29 WO PCT/GB2000/002502 patent/WO2001003878A1/en active Application Filing

Also Published As

Publication number	Publication date
GB2367834B (en)	2003-07-23
GB0201171D0 (en)	2002-03-06
AU5556800A (en)	2001-01-30
GB2367834A (en)	2002-04-17
WO2001003878A1 (en)	2001-01-18

Publication	Publication Date	Title
EP1080824A4 (en)	2004-08-04	Leadless solder
KR20010012869A (en)	2001-02-26	Lead-free Solder Alloy
GB2319039B (en)	2000-04-12	Solder alloy
EP1165849A4 (en)	2005-09-07	Alloy materials
HK1021651A1 (en)	2000-06-23	Iron-cobalt alloy
AU4247100A (en)	2000-11-02	Soldering alloy
SG111021A1 (en)	2005-05-30	Pb-free soldering alloy
PL353734A1 (en)	2003-12-01	Copper alloy
EP1332831A4 (en)	2004-07-28	Alloy for solder and solder joint
HK1040066A1 (en)	2002-05-24	Cobalt-chromium-palladium-base brazing alloys
SG98429A1 (en)	2003-09-19	Lead-free solders
GB9911743D0 (en)	1999-07-21	Robo-nurse/solder
HK1045718A1 (en)	2002-12-06	Iron-nickel alloy
GB2367834B (en)	2003-07-23	Solder alloy
GB9926675D0 (en)	2000-01-12	Aluminium alloy
HUP0104903A3 (en)	2002-05-28	Lead-free solder alloy
GB9914192D0 (en)	1999-08-18	Soldering flux
GB9923965D0 (en)	1999-12-15	Metal casting
GB0017057D0 (en)	2000-08-30	High-temperature alloy
GB2351503B (en)	2004-02-25	Alloy plating
PL333444A1 (en)	2000-12-04	Novel copper alloy
SG87016A1 (en)	2002-03-19	Metal casting
GB9826627D0 (en)	1999-01-27	Alloy
PL333446A1 (en)	2000-12-04	Novel cu-sb alloy
SG53105A1 (en)	1998-09-28	Solder alloy

Legal Events

Date	Code	Title	Description
2000-10-04	AT	Applications terminated before publication under section 16(1)