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GB9802869D0 - Circuit board - Google Patents

Circuit board

Info

Publication number
GB9802869D0
GB9802869D0 GBGB9802869.9A GB9802869A GB9802869D0 GB 9802869 D0 GB9802869 D0 GB 9802869D0 GB 9802869 A GB9802869 A GB 9802869A GB 9802869 D0 GB9802869 D0 GB 9802869D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9802869.9A
Other versions
GB2322974A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB9802869D0 publication Critical patent/GB9802869D0/en
Publication of GB2322974A publication Critical patent/GB2322974A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0723Electroplating, e.g. finish plating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/244Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB9802869A 1997-03-03 1998-02-12 Circuit board having edge vias Withdrawn GB2322974A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9065538A JPH10247766A (en) 1997-03-03 1997-03-03 Circuit board

Publications (2)

Publication Number Publication Date
GB9802869D0 true GB9802869D0 (en) 1998-04-08
GB2322974A GB2322974A (en) 1998-09-09

Family

ID=13289903

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9802869A Withdrawn GB2322974A (en) 1997-03-03 1998-02-12 Circuit board having edge vias

Country Status (6)

Country Link
JP (1) JPH10247766A (en)
KR (1) KR19980079794A (en)
CN (1) CN1091339C (en)
DE (1) DE19808932C2 (en)
FR (1) FR2760313B1 (en)
GB (1) GB2322974A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2346734B (en) 1999-01-28 2003-09-24 Marconi Electronic Syst Ltd Optical interface arrangement
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
US20020140105A1 (en) * 2001-02-16 2002-10-03 Higgins Leo M. High strength vias
DE10224057A1 (en) * 2002-05-31 2004-01-08 Robert Bosch Gmbh Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges
KR100451926B1 (en) * 2002-10-14 2004-10-08 타이코에이엠피 주식회사 The method to form side metalline for division high current of printed circuit board for car junction box and printed circuit board for car junction box manufactured by this method
KR100495211B1 (en) * 2002-11-25 2005-06-14 삼성전기주식회사 Ceramic multilayer board and its manufacture
DE10325550B4 (en) 2003-06-05 2007-02-01 Novar Gmbh Electrical contacting method
CN1324932C (en) * 2003-10-16 2007-07-04 光宝科技股份有限公司 Printed circuit boards with anti-cutting flash
JP4850596B2 (en) * 2006-06-19 2012-01-11 株式会社 日立ディスプレイズ Liquid crystal display
JP6755096B2 (en) * 2016-01-22 2020-09-16 日立オートモティブシステムズ株式会社 Automotive electronic modules, card edge connectors, and connectors
EP3512313A1 (en) * 2018-01-16 2019-07-17 ZKW Group GmbH Printed circuit board assembly
KR20220052011A (en) 2020-10-20 2022-04-27 삼성전자주식회사 Module substrate and semiconductor module including the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1085209B (en) * 1959-12-12 1960-07-14 Dielektra Ag Printed electrical circuit board
US3747210A (en) * 1971-09-13 1973-07-24 Int Standard Electric Corp Method of producing terminal pins of a printed circuit board
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
US5060369A (en) * 1990-01-31 1991-10-29 Ford Motor Company Printed wiring board construction
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
JPH07122831A (en) * 1993-10-25 1995-05-12 Taiyo Yuden Co Ltd Circuit board and manufacture thereof

Also Published As

Publication number Publication date
DE19808932A1 (en) 1998-09-10
JPH10247766A (en) 1998-09-14
DE19808932C2 (en) 2001-02-22
KR19980079794A (en) 1998-11-25
CN1091339C (en) 2002-09-18
FR2760313B1 (en) 2000-09-22
CN1195960A (en) 1998-10-14
GB2322974A (en) 1998-09-09
FR2760313A1 (en) 1998-09-04

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)