GB978984A - Method and apparatus for the vapour deposition of patterns upon a carrier surface - Google Patents
Method and apparatus for the vapour deposition of patterns upon a carrier surfaceInfo
- Publication number
- GB978984A GB978984A GB2867963A GB2867963A GB978984A GB 978984 A GB978984 A GB 978984A GB 2867963 A GB2867963 A GB 2867963A GB 2867963 A GB2867963 A GB 2867963A GB 978984 A GB978984 A GB 978984A
- Authority
- GB
- United Kingdom
- Prior art keywords
- mask
- carrier surface
- source
- semi
- slice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008021 deposition Effects 0.000 title 1
- 239000000463 material Substances 0.000 abstract 4
- 239000004065 semiconductor Substances 0.000 abstract 4
- 230000008016 vaporization Effects 0.000 abstract 4
- 239000002184 metal Substances 0.000 abstract 2
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000000919 ceramic Substances 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 239000011364 vaporized material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE1962S0080503 DE1165700C2 (de) | 1962-07-20 | 1962-07-20 | Verfahren zum Herstellen von Bauelementen oder Baugruppen |
Publications (1)
Publication Number | Publication Date |
---|---|
GB978984A true GB978984A (en) | 1965-01-01 |
Family
ID=7508916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2867963A Expired GB978984A (en) | 1962-07-20 | 1963-07-19 | Method and apparatus for the vapour deposition of patterns upon a carrier surface |
Country Status (5)
Country | Link |
---|---|
CH (1) | CH443427A (xx) |
DE (1) | DE1165700C2 (xx) |
FR (1) | FR1378052A (xx) |
GB (1) | GB978984A (xx) |
NL (1) | NL294779A (xx) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4273812A (en) * | 1978-02-01 | 1981-06-16 | Hitachi, Ltd. | Method of producing material patterns by evaporating material through a perforated mask having a reinforcing bridge |
US4301191A (en) * | 1974-10-25 | 1981-11-17 | U.S. Philips Corporation | Method of providing a conductor layer pattern having parts which are present at a small separation in the manufacture of semiconductor devices |
US4469719A (en) * | 1981-12-21 | 1984-09-04 | Applied Magnetics-Magnetic Head Divison Corporation | Method for controlling the edge gradient of a layer of deposition material |
US4536419A (en) * | 1983-03-10 | 1985-08-20 | Hitachi, Ltd. | Method for forming tapered films |
WO2018166953A1 (de) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Vorrichtung zum abscheiden einer strukturierten schicht auf einem substrat sowie verfahren zum einrichten der vorrichtung |
WO2019129364A1 (en) * | 2017-12-29 | 2019-07-04 | Microsoft Technology Licensing, Llc | Fabrication process using vapour deposition through a positioned shadow mask |
US11479851B2 (en) | 2017-03-14 | 2022-10-25 | Aixtron Se | Substrate holder arrangement with mask support |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4100313A (en) * | 1975-10-28 | 1978-07-11 | Rca Corporation | Process for forming an optical waveguide |
EP0118576B1 (en) * | 1983-03-11 | 1987-12-02 | Hitachi, Ltd. | Method for forming thin films |
-
0
- NL NL294779D patent/NL294779A/xx unknown
-
1962
- 1962-07-20 DE DE1962S0080503 patent/DE1165700C2/de not_active Expired
-
1963
- 1963-06-17 CH CH749663A patent/CH443427A/de unknown
- 1963-07-03 FR FR940261A patent/FR1378052A/fr not_active Expired
- 1963-07-19 GB GB2867963A patent/GB978984A/en not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4301191A (en) * | 1974-10-25 | 1981-11-17 | U.S. Philips Corporation | Method of providing a conductor layer pattern having parts which are present at a small separation in the manufacture of semiconductor devices |
US4273812A (en) * | 1978-02-01 | 1981-06-16 | Hitachi, Ltd. | Method of producing material patterns by evaporating material through a perforated mask having a reinforcing bridge |
US4469719A (en) * | 1981-12-21 | 1984-09-04 | Applied Magnetics-Magnetic Head Divison Corporation | Method for controlling the edge gradient of a layer of deposition material |
US4536419A (en) * | 1983-03-10 | 1985-08-20 | Hitachi, Ltd. | Method for forming tapered films |
WO2018166953A1 (de) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Vorrichtung zum abscheiden einer strukturierten schicht auf einem substrat sowie verfahren zum einrichten der vorrichtung |
US11396697B2 (en) | 2017-03-14 | 2022-07-26 | Aixtron Se | Device for separating a structured layer on a substrate, and method for setting up the device |
US11479851B2 (en) | 2017-03-14 | 2022-10-25 | Aixtron Se | Substrate holder arrangement with mask support |
WO2019129364A1 (en) * | 2017-12-29 | 2019-07-04 | Microsoft Technology Licensing, Llc | Fabrication process using vapour deposition through a positioned shadow mask |
CN111479947A (zh) * | 2017-12-29 | 2020-07-31 | 微软技术许可有限责任公司 | 使用通过被定位的阴影掩模进行气相沉积的制造工艺 |
US11629430B2 (en) | 2017-12-29 | 2023-04-18 | Microsoft Technology Licensing, Llc | Fabrication process using vapour deposition through a positioned shadow mask |
Also Published As
Publication number | Publication date |
---|---|
FR1378052A (fr) | 1964-11-13 |
CH443427A (de) | 1967-09-15 |
DE1165700B (de) | 1964-03-19 |
NL294779A (xx) | |
DE1165700C2 (de) | 1964-09-24 |
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