[go: up one dir, main page]

GB942331A - Improvements in or relating to semiconductor devices - Google Patents

Improvements in or relating to semiconductor devices

Info

Publication number
GB942331A
GB942331A GB234/61A GB23461A GB942331A GB 942331 A GB942331 A GB 942331A GB 234/61 A GB234/61 A GB 234/61A GB 23461 A GB23461 A GB 23461A GB 942331 A GB942331 A GB 942331A
Authority
GB
United Kingdom
Prior art keywords
envelope
welding
envelope part
semi
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB234/61A
Inventor
Denis Fishman
Donald Valentine Stevenson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DEST14659A priority Critical patent/DE1098103B/en
Priority to GB766/60A priority patent/GB934185A/en
Priority to FR815577A priority patent/FR1299502A/en
Priority to BE586536A priority patent/BE586536R/en
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB234/61A priority patent/GB942331A/en
Priority to FR883755A priority patent/FR81208E/en
Publication of GB942331A publication Critical patent/GB942331A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

942,331. Welding by pressure. STANDARD TELEPHONES & CABLES Ltd. Dec. 29, 1961 [Jan. 3, 1961], No. 234/61. Heading B3R. [Also in Division H1] In a semi-conductor device having an envelope formed by two flanged envelope parts 1, 9 cold welded together at their flanges 4, 10, envelope part 1 carries at its closed end 2 a semi-conductor element 6 and has a skirt portion 3 which is subjected to inward deformation 13 by the radial inward flow of metal during the welding operation so that the end 2 of envelope part 1 and element 6 are not subjected to strain. Envelope part 1 is of silver or of goldplated copper and the flanged end 4 of envelope part 9 is copper. Welding is carried out in a controlled atmosphere.
GB234/61A 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices Expired GB942331A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
DEST14659A DE1098103B (en) 1959-01-14 1959-01-14 Method for installing an electrical semiconductor element in a housing
GB766/60A GB934185A (en) 1959-01-14 1960-01-08 Method of mounting electrical semiconductor elements on a base plate
FR815577A FR1299502A (en) 1959-01-14 1960-01-13 Fixing of semiconductor elements
BE586536A BE586536R (en) 1959-01-14 1960-01-14 Electric semiconductor device
GB234/61A GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices
FR883755A FR81208E (en) 1959-01-14 1962-01-03 Fixing of semiconductor elements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEST14659A DE1098103B (en) 1959-01-14 1959-01-14 Method for installing an electrical semiconductor element in a housing
GB234/61A GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB942331A true GB942331A (en) 1963-11-20

Family

ID=25993904

Family Applications (2)

Application Number Title Priority Date Filing Date
GB766/60A Expired GB934185A (en) 1959-01-14 1960-01-08 Method of mounting electrical semiconductor elements on a base plate
GB234/61A Expired GB942331A (en) 1959-01-14 1961-01-03 Improvements in or relating to semiconductor devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB766/60A Expired GB934185A (en) 1959-01-14 1960-01-08 Method of mounting electrical semiconductor elements on a base plate

Country Status (4)

Country Link
BE (1) BE586536R (en)
DE (1) DE1098103B (en)
FR (2) FR1299502A (en)
GB (2) GB934185A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467953A (en) * 1981-03-26 1984-08-28 Tokyo Shibaura Denki Kabushiki Kaisha Cold pressing method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1242758B (en) * 1961-04-07 1967-06-22 Siemens Ag Semiconductor arrangement, especially for high performance, in which a thin, disk-shaped semiconductor body is attached to a carrier plate
NL280742A (en) * 1961-08-12
DE1271834B (en) * 1961-09-02 1968-07-04 Siemens Ag Semiconductor device
DE1229647B (en) * 1961-12-22 1966-12-01 Walter Brandt G M B H Method for producing a surface rectifier arrangement
NL286498A (en) * 1961-12-30 1900-01-01
US4579102A (en) * 1983-04-14 1986-04-01 Sukup Eugene G Biomass heat exchanger furnace
JP3426101B2 (en) * 1997-02-25 2003-07-14 三菱電機株式会社 Rectifier
DE10127052A1 (en) * 2001-06-02 2002-12-12 Bosch Gmbh Robert Connection of a semiconductor component with a heat sink, semiconductor component, heat sink and method
DE10141603A1 (en) * 2001-08-24 2003-03-06 Bosch Gmbh Robert Method for attaching an electrical element and assembly with an attached electrical element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO66796A (en) * 1941-09-04
NL93941C (en) * 1955-03-24 1959-11-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4467953A (en) * 1981-03-26 1984-08-28 Tokyo Shibaura Denki Kabushiki Kaisha Cold pressing method

Also Published As

Publication number Publication date
GB934185A (en) 1963-08-14
BE586536R (en) 1960-07-14
DE1098103B (en) 1961-01-26
FR1299502A (en) 1962-07-27
FR81208E (en) 1963-08-16

Similar Documents

Publication Publication Date Title
ES270428A1 (en) Improvements in the superconductive electroimes (Machine-translation by Google Translate, not legally binding)
GB942331A (en) Improvements in or relating to semiconductor devices
GB904292A (en) Composite butt-joint assembly
GB997995A (en) Encapsulating method and the product thereof
GB983840A (en) A gallium arsenide semiconductor device having at least one rectifying contact formed by alloying
GB869934A (en) Improvements in and relating to semi-conductor units and methods of making them
GB1171469A (en) Improvements in or relating to the Manufacture of Semiconductor Devices
ES284112A1 (en) Method and device for welding connection threads to a semiconductor body (Machine-translation by Google Translate, not legally binding)
GB967638A (en) Improvements in or relating to semiconductor devices
GB1305156A (en)
GB957227A (en) Improvements relating to encapsulation of electrical components
GB1017423A (en) Improvements in semiconductor devices
FR2106653A5 (en) High temp melting point metal joining - by brazing with sealed in brazing metal
ES358218A1 (en) Method of sealing semi-conductor assemblies
GB929836A (en) Making a semi-conductor device by a process that includes soldering
GB927487A (en) Improvements relating to the bonding of non-metallic refractory members to metal members
GB1024709A (en) Improvements in or relating to semiconductor devices
GB860395A (en) Improvements in and relating to the assembly of semi-conductor devices
GB983623A (en) Improvements relating to semi-conductor devices
GB570722A (en) Improvements in or relating to metal rectifiers of the selenium type
DUYSEMALIYEV EFFECT OF MISCH METAL ON MECHANICAL PROPERTIES OF SOME INDUSTRIAL COPPER BASED ALLOYS
GB997416A (en) Preformed wire connector
GB861646A (en) An improved electrical resistance alloy
CA622411A (en) Copper-base brazing alloy
Bell et al. PRESSING AND SINTERING CHARACTERISTICS OF CERTAIN COPPER AND TIN POWDER MIXES