GB926963A - Process for making a printed circuit - Google Patents
Process for making a printed circuitInfo
- Publication number
- GB926963A GB926963A GB2904859A GB2904859A GB926963A GB 926963 A GB926963 A GB 926963A GB 2904859 A GB2904859 A GB 2904859A GB 2904859 A GB2904859 A GB 2904859A GB 926963 A GB926963 A GB 926963A
- Authority
- GB
- United Kingdom
- Prior art keywords
- areas
- insulating
- conducting
- layer
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 239000004020 conductor Substances 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 4
- 239000010949 copper Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011889 copper foil Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 229910052703 rhodium Inorganic materials 0.000 abstract 1
- 239000010948 rhodium Substances 0.000 abstract 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
Abstract
926,963. Switch contacts. VACTRIC (CONTROL EQUIPMENT) Ltd. Aug. 16, 1960 [Aug 25, 1959], No. 29048/59. Class 38 (5). [Also in Group XXXVI] A printed circuit, for example a switch plate having the conductors embedded in an insulating base such that the switch plate has flush-bonded conducting and insulating parts, is made by positioning the integrally connected conducting parts against a working surface, the conducting parts being spaced from each other in a predetermined manner, forcing insulating material between the conducting parts into contact with the working surface, and finally removing the conducting material between the conducting parts. In its final form the printed circuit comprises segmental conducting areas 11 spaced from each other by segmental insulating areas 12, the areas 11, 12 being arranged in the form of an annulus 13. Internally and externally of the annulus 13 are insulating areas 14, 15 respectively. A rectangular sheet of copper 10 is covered with a layer of resist material except for the segmental insulating areas 12, the latter areas then being etched away so as to form holes 18 in the copper. The areas 14, 15 are then covered with a layer of resist material before plating the areas 11 with a layer 21 of conducting material, e.g. rhodium, gold or silver, the resist layer subsequently being removed. At this stage one or more conductors may be arranged on the unplated side 22 of the sheet 10 ; these conductors may be constituted by strips of copper foil which are soldered to the unplated side 22 and insulated from the parts of the copper sheet which they cross. The unplated side 22 is coated with an adhesive layer and the printed circuit 24 with this surface uppermost is placed between steel plates 25, 26 covered with a suitable release agent and between which is resin impregnated material 27. This assembly is then placed between the upper and lower heating plates 28, 29, sheets of paper 30 being interposed between the plates 26, 28 and 25, 29 respectively. After a heated press cycle, the printed circuit assumes the form shown in Fig. 7A. As a result of the pressing operation the impregnated material 27 flows into the holes 18 and gaps 21<SP>1</SP> to form the insulating areas 12 and is also formed into an insulating layer 31 on the unplated side 22 of the sheet 10. The copper in the areas 14, 15 is then completely etched away, the annulus 13 being covered by resist layer 32 during this operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2904859A GB926963A (en) | 1959-08-25 | 1959-08-25 | Process for making a printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2904859A GB926963A (en) | 1959-08-25 | 1959-08-25 | Process for making a printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB926963A true GB926963A (en) | 1963-05-22 |
Family
ID=10285374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2904859A Expired GB926963A (en) | 1959-08-25 | 1959-08-25 | Process for making a printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB926963A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2531597A1 (en) * | 1982-08-09 | 1984-02-10 | Dav Ind | Printed circuit for heavy currents. |
| CN113613906A (en) * | 2019-03-26 | 2021-11-05 | 西门子股份公司 | Method and printing device for stencil printing of layers |
-
1959
- 1959-08-25 GB GB2904859A patent/GB926963A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2531597A1 (en) * | 1982-08-09 | 1984-02-10 | Dav Ind | Printed circuit for heavy currents. |
| CN113613906A (en) * | 2019-03-26 | 2021-11-05 | 西门子股份公司 | Method and printing device for stencil printing of layers |
| US12122143B2 (en) | 2019-03-26 | 2024-10-22 | Siemens Aktiengesellschaft | Method for stencil printing a layer and printing device |
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