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GB921493A - Transistor construction - Google Patents

Transistor construction

Info

Publication number
GB921493A
GB921493A GB1880860A GB1880860A GB921493A GB 921493 A GB921493 A GB 921493A GB 1880860 A GB1880860 A GB 1880860A GB 1880860 A GB1880860 A GB 1880860A GB 921493 A GB921493 A GB 921493A
Authority
GB
United Kingdom
Prior art keywords
base
transistor
wafer
emitter
collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1880860A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Publication of GB921493A publication Critical patent/GB921493A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

921,493. Transistors. COMPAGNIE FRANCAISE THOMSON-HOUSTON. May 27, 1960 [May 28, 1959], No. 18808/60. Class 37. To enhance cooling in a transistor comprising a wafer 1 of germanium having on opposite sides emitter and collector electrodes 2, 3, the wafer is mounted on a flat copper frame 4 which is fixed to a copper base 5, as by setting or crimping in a groove in the base. Collector and emitter leads 7, 8 pass through insulated passages 6 in the base, to which a cover (not shown) is welded to envelope the transistor.
GB1880860A 1959-05-28 1960-05-27 Transistor construction Expired GB921493A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR795850A FR1235494A (en) 1959-05-28 1959-05-28 Power transistor manufacturing process and structure manufactured according to this process

Publications (1)

Publication Number Publication Date
GB921493A true GB921493A (en) 1963-03-20

Family

ID=8715298

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1880860A Expired GB921493A (en) 1959-05-28 1960-05-27 Transistor construction

Country Status (2)

Country Link
FR (1) FR1235494A (en)
GB (1) GB921493A (en)

Also Published As

Publication number Publication date
FR1235494A (en) 1960-07-08

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