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GB9212648D0 - Etched foil pcb - Google Patents

Etched foil pcb

Info

Publication number
GB9212648D0
GB9212648D0 GB929212648A GB9212648A GB9212648D0 GB 9212648 D0 GB9212648 D0 GB 9212648D0 GB 929212648 A GB929212648 A GB 929212648A GB 9212648 A GB9212648 A GB 9212648A GB 9212648 D0 GB9212648 D0 GB 9212648D0
Authority
GB
United Kingdom
Prior art keywords
etched foil
foil pcb
pcb
etched
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB929212648A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dyconex Patente AG
Original Assignee
Dyconex Patente AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dyconex Patente AG filed Critical Dyconex Patente AG
Priority to GB929212648A priority Critical patent/GB9212648D0/en
Publication of GB9212648D0 publication Critical patent/GB9212648D0/en
Priority to AT93810414T priority patent/ATE135521T1/en
Priority to AU40585/93A priority patent/AU4058593A/en
Priority to DE59301849T priority patent/DE59301849D1/en
Priority to PCT/CH1993/000145 priority patent/WO1993026143A1/en
Priority to JP6500995A priority patent/JPH07500951A/en
Priority to EP93810414A priority patent/EP0575292B1/en
Priority to AT93909754T priority patent/ATE180137T1/en
Priority to US08/193,191 priority patent/US5436062A/en
Priority to DE59309575T priority patent/DE59309575D1/en
Priority to EP93909754A priority patent/EP0600051B1/en
Priority to CA002114954A priority patent/CA2114954A1/en
Priority to AU40586/93A priority patent/AU4058693A/en
Priority to PCT/CH1993/000147 priority patent/WO1993026144A1/en
Priority to JP6500997A priority patent/JPH07505015A/en
Priority to AT93909756T priority patent/ATE137079T1/en
Priority to EP93909756A priority patent/EP0600052B1/en
Priority to CA002114792A priority patent/CA2114792A1/en
Priority to PCT/CH1993/000148 priority patent/WO1993026146A1/en
Priority to DE59302260T priority patent/DE59302260D1/en
Priority to AU40587/93A priority patent/AU4058793A/en
Priority to JP5169675A priority patent/JPH0661612A/en
Priority to CA002098411A priority patent/CA2098411A1/en
Priority to US08/077,298 priority patent/US5378314A/en
Pending legal-status Critical Current

Links

GB929212648A 1992-06-15 1992-06-15 Etched foil pcb Pending GB9212648D0 (en)

Priority Applications (24)

Application Number Priority Date Filing Date Title
GB929212648A GB9212648D0 (en) 1992-06-15 1992-06-15 Etched foil pcb
CA002114954A CA2114954A1 (en) 1992-06-15 1993-06-09 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
EP93909754A EP0600051B1 (en) 1992-06-15 1993-06-09 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
AU40585/93A AU4058593A (en) 1992-06-15 1993-06-09 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
DE59301849T DE59301849D1 (en) 1992-06-15 1993-06-09 Process for the production of substrates with bushings
PCT/CH1993/000145 WO1993026143A1 (en) 1992-06-15 1993-06-09 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
JP6500995A JPH07500951A (en) 1992-06-15 1993-06-09 Method for manufacturing printed wiring circuit boards using metal clad laminates with ultra-high density wiring for signal guidance
EP93810414A EP0575292B1 (en) 1992-06-15 1993-06-09 Process for manufacturing substrates with through-holes
AT93909754T ATE180137T1 (en) 1992-06-15 1993-06-09 METHOD FOR PRODUCING CIRCUIT BOARDS USING A SEMI-FINISHED PRODUCT WITH EXTREMELY TIGHT WIRING FOR SIGNAL CARRYING
US08/193,191 US5436062A (en) 1992-06-15 1993-06-09 Process for the production of printed circuit boards with extremely dense wiring using a metal-clad laminate
DE59309575T DE59309575D1 (en) 1992-06-15 1993-06-09 METHOD FOR PRODUCING CIRCUIT BOARDS USING A SEMI-FINISHED PRODUCT WITH EXTREMELY TIGHT WIRING FOR THE SIGNALING
AT93810414T ATE135521T1 (en) 1992-06-15 1993-06-09 METHOD FOR PRODUCING SUBSTRATES WITH THROUGH THROUGH
AU40587/93A AU4058793A (en) 1992-06-15 1993-06-10 Thermal layout of thermoconductors
AU40586/93A AU4058693A (en) 1992-06-15 1993-06-10 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
PCT/CH1993/000147 WO1993026144A1 (en) 1992-06-15 1993-06-10 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
JP6500997A JPH07505015A (en) 1992-06-15 1993-06-10 Method of forming a configurable connection piece on a circuit board and circuit board having a configurable connection piece
AT93909756T ATE137079T1 (en) 1992-06-15 1993-06-10 METHOD FOR PRODUCING SUBSEQUENTLY CONDITIONABLE CONTACT POINTS ON CIRCUIT MOUNTS AND CIRCUIT MOUNTS WITH SUCH CONTACT POINTS
EP93909756A EP0600052B1 (en) 1992-06-15 1993-06-10 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
CA002114792A CA2114792A1 (en) 1992-06-15 1993-06-10 Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
PCT/CH1993/000148 WO1993026146A1 (en) 1992-06-15 1993-06-10 Thermal layout of thermoconductors
DE59302260T DE59302260D1 (en) 1992-06-15 1993-06-10 METHOD FOR THE PRODUCTION OF RE-CONDITIONABLE CONTACT POINTS ON CIRCUIT BOARDS AND CIRCUIT BOARDS WITH SUCH CONTACT POINTS
JP5169675A JPH0661612A (en) 1992-06-15 1993-06-15 Manufacture of board provided with passage and circuit board manufactured by it
CA002098411A CA2098411A1 (en) 1992-06-15 1993-06-15 Method for producing substrates with passages
US08/077,298 US5378314A (en) 1992-06-15 1993-06-15 Method for producing substrates with passages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB929212648A GB9212648D0 (en) 1992-06-15 1992-06-15 Etched foil pcb

Publications (1)

Publication Number Publication Date
GB9212648D0 true GB9212648D0 (en) 1992-07-29

Family

ID=10717099

Family Applications (1)

Application Number Title Priority Date Filing Date
GB929212648A Pending GB9212648D0 (en) 1992-06-15 1992-06-15 Etched foil pcb

Country Status (1)

Country Link
GB (1) GB9212648D0 (en)

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