GB893479A - Improvements in or relating to printed circuit boards - Google Patents
Improvements in or relating to printed circuit boardsInfo
- Publication number
- GB893479A GB893479A GB2477357A GB2477357A GB893479A GB 893479 A GB893479 A GB 893479A GB 2477357 A GB2477357 A GB 2477357A GB 2477357 A GB2477357 A GB 2477357A GB 893479 A GB893479 A GB 893479A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- relating
- circuit boards
- board
- pye
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
893,479. Printed circuits. PYE Ltd. July 28, 1958 [Aug. 6, 1957], No. 24773/57. Class 37. A method of manufacturing a printed circuit board consists of forming the conductors on one side of the board, and applying a layer of insulating material, e.g. an epoxy resin, over the whole surface of the board by a silk screen technique, except in those places to which it is required to solder components to the circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2477357A GB893479A (en) | 1957-08-06 | 1957-08-06 | Improvements in or relating to printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2477357A GB893479A (en) | 1957-08-06 | 1957-08-06 | Improvements in or relating to printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
GB893479A true GB893479A (en) | 1962-04-11 |
Family
ID=10217035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2477357A Expired GB893479A (en) | 1957-08-06 | 1957-08-06 | Improvements in or relating to printed circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB893479A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4084022A (en) * | 1975-09-30 | 1978-04-11 | Siemens Aktiengesellschaft | Method for tin plating printed boards |
-
1957
- 1957-08-06 GB GB2477357A patent/GB893479A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4084022A (en) * | 1975-09-30 | 1978-04-11 | Siemens Aktiengesellschaft | Method for tin plating printed boards |
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