GB8515659D0 - Manufacturing integrated circuits - Google Patents
Manufacturing integrated circuitsInfo
- Publication number
- GB8515659D0 GB8515659D0 GB858515659A GB8515659A GB8515659D0 GB 8515659 D0 GB8515659 D0 GB 8515659D0 GB 858515659 A GB858515659 A GB 858515659A GB 8515659 A GB8515659 A GB 8515659A GB 8515659 D0 GB8515659 D0 GB 8515659D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- integrated circuits
- manufacturing integrated
- manufacturing
- circuits
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
- G01R31/2858—Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08515659A GB2176653B (en) | 1985-06-20 | 1985-06-20 | Method of manufacturing integrated circuits |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08515659A GB2176653B (en) | 1985-06-20 | 1985-06-20 | Method of manufacturing integrated circuits |
PCT/GB1986/000548 WO1988002182A1 (en) | 1986-09-17 | 1986-09-17 | Method of manufacturing integrated circuits |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8515659D0 true GB8515659D0 (en) | 1985-07-24 |
GB2176653A GB2176653A (en) | 1986-12-31 |
GB2176653B GB2176653B (en) | 1988-06-15 |
Family
ID=10581064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08515659A Expired GB2176653B (en) | 1985-06-20 | 1985-06-20 | Method of manufacturing integrated circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2176653B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07302773A (en) * | 1994-05-06 | 1995-11-14 | Texas Instr Japan Ltd | Semiconductor wafer and semiconductor device |
US5514974A (en) * | 1994-10-12 | 1996-05-07 | International Business Machines Corporation | Test device and method for signalling metal failure of semiconductor wafer |
EP1596210A1 (en) | 2004-05-11 | 2005-11-16 | Interuniversitair Micro-Elektronica Centrum (IMEC) | Method for lifetime determination of submicron metal interconnects |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55120164A (en) * | 1979-03-12 | 1980-09-16 | Fujitsu Ltd | Semiconductor device |
-
1985
- 1985-06-20 GB GB08515659A patent/GB2176653B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2176653A (en) | 1986-12-31 |
GB2176653B (en) | 1988-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |