[go: up one dir, main page]

GB8515659D0 - Manufacturing integrated circuits - Google Patents

Manufacturing integrated circuits

Info

Publication number
GB8515659D0
GB8515659D0 GB858515659A GB8515659A GB8515659D0 GB 8515659 D0 GB8515659 D0 GB 8515659D0 GB 858515659 A GB858515659 A GB 858515659A GB 8515659 A GB8515659 A GB 8515659A GB 8515659 D0 GB8515659 D0 GB 8515659D0
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
manufacturing integrated
manufacturing
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB858515659A
Other versions
GB2176653A (en
GB2176653B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB08515659A priority Critical patent/GB2176653B/en
Publication of GB8515659D0 publication Critical patent/GB8515659D0/en
Priority claimed from PCT/GB1986/000548 external-priority patent/WO1988002182A1/en
Publication of GB2176653A publication Critical patent/GB2176653A/en
Application granted granted Critical
Publication of GB2176653B publication Critical patent/GB2176653B/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2856Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
    • G01R31/2858Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2884Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/34Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
GB08515659A 1985-06-20 1985-06-20 Method of manufacturing integrated circuits Expired GB2176653B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08515659A GB2176653B (en) 1985-06-20 1985-06-20 Method of manufacturing integrated circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08515659A GB2176653B (en) 1985-06-20 1985-06-20 Method of manufacturing integrated circuits
PCT/GB1986/000548 WO1988002182A1 (en) 1986-09-17 1986-09-17 Method of manufacturing integrated circuits

Publications (3)

Publication Number Publication Date
GB8515659D0 true GB8515659D0 (en) 1985-07-24
GB2176653A GB2176653A (en) 1986-12-31
GB2176653B GB2176653B (en) 1988-06-15

Family

ID=10581064

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08515659A Expired GB2176653B (en) 1985-06-20 1985-06-20 Method of manufacturing integrated circuits

Country Status (1)

Country Link
GB (1) GB2176653B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302773A (en) * 1994-05-06 1995-11-14 Texas Instr Japan Ltd Semiconductor wafer and semiconductor device
US5514974A (en) * 1994-10-12 1996-05-07 International Business Machines Corporation Test device and method for signalling metal failure of semiconductor wafer
EP1596210A1 (en) 2004-05-11 2005-11-16 Interuniversitair Micro-Elektronica Centrum (IMEC) Method for lifetime determination of submicron metal interconnects

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120164A (en) * 1979-03-12 1980-09-16 Fujitsu Ltd Semiconductor device

Also Published As

Publication number Publication date
GB2176653A (en) 1986-12-31
GB2176653B (en) 1988-06-15

Similar Documents

Publication Publication Date Title
EP0223526A3 (en) Optimized integrated circuits
EP0190027A3 (en) Semiconductor integrated circuit
GB8714910D0 (en) Semiconductor integrated circuit
GB8615908D0 (en) Integrated circuits
EP0196171A3 (en) Digital integrated circuits
GB8521397D0 (en) Integrated circuit
GB8432458D0 (en) Integrated circuits
EP0192456A3 (en) Semiconductor integrated circuit
HK50995A (en) Semiconductor integrated circuit
GB8715499D0 (en) Manufacturing di-electrically isolated circuits
GB8518859D0 (en) Digital integrated circuits
GB8509720D0 (en) Integrated circuit
GB8723539D0 (en) Integrated circuits
GB8511256D0 (en) Integrated circuits
GB8604286D0 (en) Integrated circuits
GB8603837D0 (en) Integrated circuits
GB8607593D0 (en) Integrated circuits
EP0210741A3 (en) Digital integrated circuits
GB2158640B (en) Integrated circuit
EP0225720A3 (en) Integrated circuit devices
GB8507600D0 (en) Integrated circuits
GB8515659D0 (en) Manufacturing integrated circuits
GB2184269B (en) Integrated circuits
GB8622249D0 (en) Integrated circuits
GB8618210D0 (en) Integrated circuits

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee