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GB821830A - Improvements in and relating to semi-conductor devices - Google Patents

Improvements in and relating to semi-conductor devices

Info

Publication number
GB821830A
GB821830A GB24726/55A GB2472655A GB821830A GB 821830 A GB821830 A GB 821830A GB 24726/55 A GB24726/55 A GB 24726/55A GB 2472655 A GB2472655 A GB 2472655A GB 821830 A GB821830 A GB 821830A
Authority
GB
United Kingdom
Prior art keywords
semi
housing
conductor
chassis
casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB24726/55A
Inventor
George Alfred Gilbert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mullard Radio Valve Co Ltd
Original Assignee
Mullard Radio Valve Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE550629D priority Critical patent/BE550629A/xx
Application filed by Mullard Radio Valve Co Ltd filed Critical Mullard Radio Valve Co Ltd
Priority to GB24726/55A priority patent/GB821830A/en
Priority to US583770A priority patent/US2914362A/en
Priority to DEN12647A priority patent/DE1044284B/en
Priority to FR721038A priority patent/FR1224011A/en
Priority to CH344787D priority patent/CH344787A/en
Publication of GB821830A publication Critical patent/GB821830A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
    • B23Q1/25—Movable or adjustable work or tool supports
    • B23Q1/26—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members
    • B23Q1/262—Movable or adjustable work or tool supports characterised by constructional features relating to the co-operation of relatively movable members; Means for preventing relative movement of such members with means to adjust the distance between the relatively slidable members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2322/00—Apparatus used in shaping articles
    • F16C2322/39—General buildup of machine tools, e.g. spindles, slides, actuators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)

Abstract

821,830. Semi-conductor devices. MULLARD RADIO VALVE CO. Ltd. Aug. 29, 1955, No. 24726/55. Class 37. A PN junction semi-conductor device comprises a semi-conductor body enclosed in a casing and secured to a thermally conductive member having an elongated part projecting through the casing and provided with heat radiating fins. In the embodiment a junction transistor comprising an N-type germanium body in contact through indium collector electrode 3 and molybdenum layer 5 with the head of a copper bolt 6 is sealed within a metal housing 10 through which the threaded stem 7 of the bolt extends. The housing is fixed to a chassis 12 by means of a nut 10 comprising heat dissipating fins 16, insulation from the chassis being provided by washers 13 and tube 14. Connections 9 to the emitter 2 and ring base electrode are carried through glass beads 11 in the housing lid while the collector connection is to the housing itself.
GB24726/55A 1955-06-14 1955-08-29 Improvements in and relating to semi-conductor devices Expired GB821830A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
BE550629D BE550629A (en) 1955-06-14
GB24726/55A GB821830A (en) 1955-08-29 1955-08-29 Improvements in and relating to semi-conductor devices
US583770A US2914362A (en) 1955-06-14 1956-05-09 Guide system for reciprocating machine parts
DEN12647A DE1044284B (en) 1955-06-14 1956-08-25 Semiconducting electrode system, e.g. B. crystal diode or transistor
FR721038A FR1224011A (en) 1955-06-14 1956-08-27 Electrode systems comprising a semiconductor body
CH344787D CH344787A (en) 1955-06-14 1956-08-27 Semiconductor arrangement with coolants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB24726/55A GB821830A (en) 1955-08-29 1955-08-29 Improvements in and relating to semi-conductor devices

Publications (1)

Publication Number Publication Date
GB821830A true GB821830A (en) 1959-10-14

Family

ID=10216286

Family Applications (1)

Application Number Title Priority Date Filing Date
GB24726/55A Expired GB821830A (en) 1955-06-14 1955-08-29 Improvements in and relating to semi-conductor devices

Country Status (1)

Country Link
GB (1) GB821830A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509096A (en) * 1983-02-22 1985-04-02 Smiths Industries Public Limited Company Chip-carrier substrates
GB2345576A (en) * 1999-01-05 2000-07-12 Ericsson Telefon Ab L M Heat-sink of ICs and method of mounting to PCBs

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509096A (en) * 1983-02-22 1985-04-02 Smiths Industries Public Limited Company Chip-carrier substrates
GB2345576A (en) * 1999-01-05 2000-07-12 Ericsson Telefon Ab L M Heat-sink of ICs and method of mounting to PCBs

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