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GB817037A - Improvements in process and compositions for the electroposition of copper - Google Patents

Improvements in process and compositions for the electroposition of copper

Info

Publication number
GB817037A
GB817037A GB6470/57A GB647057A GB817037A GB 817037 A GB817037 A GB 817037A GB 6470/57 A GB6470/57 A GB 6470/57A GB 647057 A GB647057 A GB 647057A GB 817037 A GB817037 A GB 817037A
Authority
GB
United Kingdom
Prior art keywords
cyanide
copper
cuprous selenide
bath
selenide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6470/57A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB817037A publication Critical patent/GB817037A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • C25D3/40Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

817,037. Electroplating with copper. DU PONT DE NEMOURS & CO., E. I. Feb. 26, 1957 [April 30, 1956], No. 6470/57. Drawings to Specification. Class 41. In electrodepositing copper from a selenidecontaining copper cyanide plating bath, the bath composition is maintained by adding thereto a pre-formed aqueous solution prepared from cuprous selenide and an alkali or alkaline earth metal cyanide in proportions to provide by weight 0.9 part of cyanide radical per part of cuprous selenide. Preferably solid mixtures of the cyanide and cuprous selenide are dissolved in water to make the solutions. For bright deposits the bath contains 200-1000 p.p.m. of a brightener methylene-bis (naphthalene sulphonic acid) or its alkali metal salts or polymers thereof and the quantity of cuprous selenide should be sufficient to yield 2-50 p.p.m. of selenium. Periodic reverse plating as described and claimed in Specification 630,165, may be employed to obtain uniform deposits. Specification 801,460 and U.S.A. Specification 2,694,677 also are referred to.
GB6470/57A 1957-06-20 1957-02-26 Improvements in process and compositions for the electroposition of copper Expired GB817037A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US667015A US2861929A (en) 1957-06-20 1957-06-20 Copper plating with addition agents

Publications (1)

Publication Number Publication Date
GB817037A true GB817037A (en) 1959-07-22

Family

ID=24676459

Family Applications (2)

Application Number Title Priority Date Filing Date
GB6470/57A Expired GB817037A (en) 1957-06-20 1957-02-26 Improvements in process and compositions for the electroposition of copper
GB17404/58A Expired GB831929A (en) 1957-06-20 1958-05-30 Improvements in or relating to copper plating

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB17404/58A Expired GB831929A (en) 1957-06-20 1958-05-30 Improvements in or relating to copper plating

Country Status (4)

Country Link
US (2) US2854389A (en)
DE (2) DE1101087B (en)
FR (2) FR1172733A (en)
GB (2) GB817037A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955992A (en) * 1957-08-08 1960-10-11 Macdermid Inc Bright copper plating process
DE1209843B (en) * 1960-04-16 1966-01-27 Hesse & Cie Cyanidic bright copper bath
US3219560A (en) * 1961-10-12 1965-11-23 Allied Res Products Inc Process and bath for electrolytic copper deposition
DE1195321B (en) * 1962-03-16 1965-06-24 Troponwerke Dinklage & Co Process for the preparation of substituted quinazolone (4) derivatives
US3480524A (en) * 1967-09-21 1969-11-25 Kewanee Oil Co Selenium compound and its use as a brightener in a copper plating bath
US3532610A (en) * 1967-10-27 1970-10-06 Kewanee Oil Co Selenium compounds as brighteners in copper plating baths

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2732336A (en) * 1956-01-24 Electroplating composition for copper
US2701234A (en) * 1951-07-11 1955-02-01 Du Pont Addition agent for copper plating
US2770587A (en) * 1956-06-04 1956-11-13 Elechem Corp Bath for plating bright copper

Also Published As

Publication number Publication date
FR1172733A (en) 1959-02-13
GB831929A (en) 1960-04-06
US2861929A (en) 1958-11-25
DE1101087B (en) 1961-03-02
FR73696E (en) 1960-09-05
DE1104282B (en) 1961-04-06
US2854389A (en) 1958-09-30

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