[go: up one dir, main page]

GB791491A - Improvements relating to semi-conductor rectifiers - Google Patents

Improvements relating to semi-conductor rectifiers

Info

Publication number
GB791491A
GB791491A GB21049/56A GB2104956A GB791491A GB 791491 A GB791491 A GB 791491A GB 21049/56 A GB21049/56 A GB 21049/56A GB 2104956 A GB2104956 A GB 2104956A GB 791491 A GB791491 A GB 791491A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor rectifiers
july
contact
masses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21049/56A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Publication of GB791491A publication Critical patent/GB791491A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

791,491. Cooling devices for semi-conductor rectifiers. COMPAGNIE FRANCAISE THOMSON-HOUSTON. July 6, 1956 [July 6, 1955], No. 21049/56. Class 37. Electrodes of semi conductor rectifiers comprise heat - conducting masses 5 in contact with a vaporizable liquid in chambers 6 open to the interior of hollow cooling fins 8. The heating of the rectifier boils the liquid which then condenses in the upper part of the fin. The surface area of contact of the masses 5 may be increased by milling the edge or by cutting or drilling holes, grooves or slots or in any other wellknown manner. Terminal tags 9 may be attached to the fins.
GB21049/56A 1955-07-06 1956-07-06 Improvements relating to semi-conductor rectifiers Expired GB791491A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1188729X 1955-07-06

Publications (1)

Publication Number Publication Date
GB791491A true GB791491A (en) 1958-03-05

Family

ID=9665441

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21049/56A Expired GB791491A (en) 1955-07-06 1956-07-06 Improvements relating to semi-conductor rectifiers

Country Status (5)

Country Link
BE (1) BE549283A (en)
DE (1) DE1188729B (en)
FR (1) FR1137395A (en)
GB (1) GB791491A (en)
NL (2) NL208738A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1106423B (en) * 1959-06-23 1961-05-10 Licentia Gmbh Heat sink for semiconductor rectifier
DE1277446B (en) * 1966-08-26 1968-09-12 Siemens Ag Method for manufacturing semiconductor components with completely encapsulated semiconductor elements
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3942586A (en) * 1973-08-14 1976-03-09 Siemens Aktiengesellschaft Cooling arrangement for flat semiconductor components
US3989099A (en) * 1974-03-16 1976-11-02 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4020399A (en) * 1974-03-15 1977-04-26 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for dissipating heat of semiconductor elements
US4023616A (en) * 1974-04-08 1977-05-17 Siemens Aktiengesellschaft Thyristor cooling arrangement
US4044396A (en) * 1975-08-14 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe cooling of airborne phased array radar

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE382282B (en) * 1971-02-13 1976-01-19 Bbc Brown Boveri & Cie FOR AT LEAST ONE SEMI-LEADER DISC CELL PROVIDE PRESSURE MOUNTING WITH COOLING DEVICE, INCLUDING VERMEROR WITH INTERNAL CAPITAL STRUCTURE.
DE3040869A1 (en) * 1980-10-30 1982-06-16 Robert Bosch Gmbh, 7000 Stuttgart Motor vehicle headlamp with condensation protection - has heat conducting tube, fitted to headlamp reflector

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE891425C (en) * 1938-09-28 1953-09-28 Aeg Device for the operation of dry rectifiers
NL180221B (en) * 1952-07-29 Charbonnages Ste Chimique PROCESS FOR PREPARING A POLYAMINOAMIDE HARDENING AGENT FOR EPOXY RESINS; PROCESS FOR PREPARING A WATER DIVIDED HARDENING AGENT; PROCESS FOR PREPARING AN EPOXY RESIN COMPOSITION CONTAINING SUCH HARDENING AGENT AND AN OBJECT FACING A COATING LAYER OBTAINED FROM SUCH EPOXY RESIN COMPOSITION.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1106423B (en) * 1959-06-23 1961-05-10 Licentia Gmbh Heat sink for semiconductor rectifier
DE1277446B (en) * 1966-08-26 1968-09-12 Siemens Ag Method for manufacturing semiconductor components with completely encapsulated semiconductor elements
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3942586A (en) * 1973-08-14 1976-03-09 Siemens Aktiengesellschaft Cooling arrangement for flat semiconductor components
US4020399A (en) * 1974-03-15 1977-04-26 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for dissipating heat of semiconductor elements
US3989099A (en) * 1974-03-16 1976-11-02 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4023616A (en) * 1974-04-08 1977-05-17 Siemens Aktiengesellschaft Thyristor cooling arrangement
US4044396A (en) * 1975-08-14 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe cooling of airborne phased array radar

Also Published As

Publication number Publication date
NL96632C (en)
FR1137395A (en) 1957-05-28
NL208738A (en)
BE549283A (en)
DE1188729B (en) 1965-03-11

Similar Documents

Publication Publication Date Title
GB791491A (en) Improvements relating to semi-conductor rectifiers
GB804297A (en) Improvements in or relating to cooling means for semi-conductor elements
GB529957A (en) Improvements in and relating to dry rectifiers
GB1207216A (en) Heat exchange structure
TAKIZAWA On the Carcinogenic Action of Certain Quinones Preliminary Report
GB855382A (en) Method of producing a p-n junction in a crystalline semiconductor
GB817746A (en) Improvements in or relating to coolers for semi-conductor cells
JPS5438771A (en) Cooling fin
JPS53109475A (en) Manufacture for semiconductor device
GB831295A (en) Improvements in or relating to semiconductor devices
GB531871A (en) Improvements in or relating to magneto-striction oscillators
SU452744A2 (en) Radiator for cooling semiconductor devices
JPS5211493A (en) Cutting tool
GB1107685A (en) Improvements in or relating to gunn effect apparatus
GB975990A (en) Improvements relating to silicon controlled rectifiers
TATUNO 85. Über die Chromosomen der Lebermoose von Japan
GB836401A (en) Improvements relating to the assembly of electric rectifiers
JPS5373654A (en) Heat radiating panel
FR60418E (en) Direct heated cathodes, for special high power electronic tubes
GB969483A (en) Improvements in or relating to semiconductor assemblies and methods of forming such assemblies
GB1229474A (en)
JPS538581A (en) Semiconductor memory unit
JPS53126275A (en) Semiconductor device
GB714199A (en) Improvements relating to crystal valves
JPS5552260A (en) Photoignition type semiconductor controlling rectifier