GB733414A - Conductors for printed circuits - Google Patents
Conductors for printed circuitsInfo
- Publication number
- GB733414A GB733414A GB578451A GB578451A GB733414A GB 733414 A GB733414 A GB 733414A GB 578451 A GB578451 A GB 578451A GB 578451 A GB578451 A GB 578451A GB 733414 A GB733414 A GB 733414A
- Authority
- GB
- United Kingdom
- Prior art keywords
- slurry
- particles
- copper
- powder
- exceeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Details Of Resistors (AREA)
- Non-Insulated Conductors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
A non-metallic surface is covered with copper particles having a diameter not exceeding 70m and substantially all greater than 1m by coating with a slurry of the particles in an inert volatile liquid, the copper particles being coated with silver, gold or platinum. Specifications 672,255, [Group XXXVI], 672,260 and 690,486, [both in Group II], are referred to.ALSO:Copper powder of a size not exceeding 70m but substantially all particles exceeding 1m is uniformly coated with a noble metal (i.e. silver, gold or platinum). The coating may be applied by chemical decomposition or electroplating, examples being given. The powder may be applied as a slurry in an inert volatile liquid such as acetone and applied to the surface of an organic electrically insulating material, heat and pressure being applied to the resulting coated surface to form printed circuits (see Specifications 672,255, [Group XXXVI], and 690,486). Resistors may be made as disclosed in Specification 672,260. The slurry may be applied to the surface of an article which does not soften under the influence of heat and pressure by applying the slurry before completely condensing the resin. The powder may be applied with the aid of an adhesive. It is stated that copper powder can be prepared by the reduction of copper oxide with protalbinic acid and an ethanolamine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB578451A GB733414A (en) | 1951-03-09 | 1951-03-09 | Conductors for printed circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB578451A GB733414A (en) | 1951-03-09 | 1951-03-09 | Conductors for printed circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB733414A true GB733414A (en) | 1955-07-13 |
Family
ID=9802550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB578451A Expired GB733414A (en) | 1951-03-09 | 1951-03-09 | Conductors for printed circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB733414A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0222496A1 (en) * | 1985-10-10 | 1987-05-20 | International Business Machines Corporation | Method of producing an electrically conductive pattern on a substrate |
-
1951
- 1951-03-09 GB GB578451A patent/GB733414A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0222496A1 (en) * | 1985-10-10 | 1987-05-20 | International Business Machines Corporation | Method of producing an electrically conductive pattern on a substrate |
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