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GB2602663B - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
GB2602663B
GB2602663B GB2100336.3A GB202100336A GB2602663B GB 2602663 B GB2602663 B GB 2602663B GB 202100336 A GB202100336 A GB 202100336A GB 2602663 B GB2602663 B GB 2602663B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2100336.3A
Other versions
GB202100336D0 (en
GB2602663A (en
Inventor
Rahimo Munaf
Iulian Nistor Dr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MQSemi AG
Original Assignee
MQSemi AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MQSemi AG filed Critical MQSemi AG
Priority to GB2100336.3A priority Critical patent/GB2602663B/en
Publication of GB202100336D0 publication Critical patent/GB202100336D0/en
Publication of GB2602663A publication Critical patent/GB2602663A/en
Application granted granted Critical
Publication of GB2602663B publication Critical patent/GB2602663B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411Insulated-gate bipolar transistors [IGBT]
    • H10D12/441Vertical IGBTs
    • H10D12/461Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions
    • H10D62/127Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393Body regions of DMOS transistors or IGBTs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/141Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
    • H10D62/142Anode regions of thyristors or collector regions of gated bipolar-mode devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
GB2100336.3A 2021-01-11 2021-01-11 Semiconductor device Active GB2602663B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB2100336.3A GB2602663B (en) 2021-01-11 2021-01-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2100336.3A GB2602663B (en) 2021-01-11 2021-01-11 Semiconductor device

Publications (3)

Publication Number Publication Date
GB202100336D0 GB202100336D0 (en) 2021-02-24
GB2602663A GB2602663A (en) 2022-07-13
GB2602663B true GB2602663B (en) 2024-09-04

Family

ID=74667714

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2100336.3A Active GB2602663B (en) 2021-01-11 2021-01-11 Semiconductor device

Country Status (1)

Country Link
GB (1) GB2602663B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854518A1 (en) * 1997-01-21 1998-07-22 Plessey Semiconductors Limited Trench insulated gate bipolar transistor
JP2010272741A (en) * 2009-05-22 2010-12-02 Fuji Electric Systems Co Ltd Manufacturing method of semiconductor device
WO2011117285A1 (en) * 2010-03-23 2011-09-29 Abb Technology Ag Power semiconductor device
WO2011118512A1 (en) * 2010-03-24 2011-09-29 オンセミコンダクター・トレーディング・リミテッド Insulated gate bipolar transistor
WO2013004829A1 (en) * 2011-07-07 2013-01-10 Abb Technology Ag Insulated gate bipolar transistor
US20160359029A1 (en) * 2014-02-04 2016-12-08 Maxpower Semiconductor, Inc. Power mosfet having planar channel, vertical current path, and top drain electrode
WO2019157818A1 (en) * 2018-02-13 2019-08-22 株洲中车时代电气股份有限公司 Igbt chip having composite gate structure comprising dummy gate
GB2602637A (en) * 2021-01-06 2022-07-13 Mqsemi Ag Semiconductor device and method for designing thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854518A1 (en) * 1997-01-21 1998-07-22 Plessey Semiconductors Limited Trench insulated gate bipolar transistor
JP2010272741A (en) * 2009-05-22 2010-12-02 Fuji Electric Systems Co Ltd Manufacturing method of semiconductor device
WO2011117285A1 (en) * 2010-03-23 2011-09-29 Abb Technology Ag Power semiconductor device
WO2011118512A1 (en) * 2010-03-24 2011-09-29 オンセミコンダクター・トレーディング・リミテッド Insulated gate bipolar transistor
WO2013004829A1 (en) * 2011-07-07 2013-01-10 Abb Technology Ag Insulated gate bipolar transistor
US20160359029A1 (en) * 2014-02-04 2016-12-08 Maxpower Semiconductor, Inc. Power mosfet having planar channel, vertical current path, and top drain electrode
WO2019157818A1 (en) * 2018-02-13 2019-08-22 株洲中车时代电气股份有限公司 Igbt chip having composite gate structure comprising dummy gate
GB2602637A (en) * 2021-01-06 2022-07-13 Mqsemi Ag Semiconductor device and method for designing thereof

Also Published As

Publication number Publication date
GB202100336D0 (en) 2021-02-24
GB2602663A (en) 2022-07-13

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