GB2428885B - Method of identifying the presence and severity of defects In a semiconductor material - Google Patents
Method of identifying the presence and severity of defects In a semiconductor materialInfo
- Publication number
- GB2428885B GB2428885B GB0614880A GB0614880A GB2428885B GB 2428885 B GB2428885 B GB 2428885B GB 0614880 A GB0614880 A GB 0614880A GB 0614880 A GB0614880 A GB 0614880A GB 2428885 B GB2428885 B GB 2428885B
- Authority
- GB
- United Kingdom
- Prior art keywords
- severity
- defects
- identifying
- semiconductor material
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007547 defect Effects 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/91—Investigating the presence of flaws or contamination using penetration of dyes, e.g. fluorescent ink
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0515480.2A GB0515480D0 (en) | 2005-07-28 | 2005-07-28 | Product |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0614880D0 GB0614880D0 (en) | 2006-09-06 |
GB2428885A GB2428885A (en) | 2007-02-07 |
GB2428885B true GB2428885B (en) | 2010-07-28 |
Family
ID=34976739
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0515480.2A Ceased GB0515480D0 (en) | 2005-07-28 | 2005-07-28 | Product |
GBGB0614202.0A Ceased GB0614202D0 (en) | 2005-07-28 | 2006-07-18 | Method of identifying the presence and severity of defects in a semiconductor material |
GB0614880A Active GB2428885B (en) | 2005-07-28 | 2006-07-27 | Method of identifying the presence and severity of defects In a semiconductor material |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GBGB0515480.2A Ceased GB0515480D0 (en) | 2005-07-28 | 2005-07-28 | Product |
GBGB0614202.0A Ceased GB0614202D0 (en) | 2005-07-28 | 2006-07-18 | Method of identifying the presence and severity of defects in a semiconductor material |
Country Status (1)
Country | Link |
---|---|
GB (3) | GB0515480D0 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2226374B1 (en) * | 2009-03-06 | 2012-05-16 | S.O.I. TEC Silicon | Etching composition, in particular for silicon materials, method for characterizing defects of such materials and process of treating such surfaces with etching composition |
WO2015150156A1 (en) * | 2014-04-01 | 2015-10-08 | Atotech Deutschland Gmbh | Composition and process for metallizing nonconductive plastic surfaces |
CA3082211A1 (en) * | 2020-06-02 | 2021-12-02 | Techinsights Inc. | Contrast-enhancing staining system and method and imaging methods and systems related thereto |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0281115A2 (en) * | 1987-03-04 | 1988-09-07 | Kabushiki Kaisha Toshiba | Etching solution for evaluating crystal faults |
KR960013499B1 (en) * | 1988-04-30 | 1996-10-05 | 엘지반도체 주식회사 | Corrosion method for observing vertical structure of semiconductor device |
-
2005
- 2005-07-28 GB GBGB0515480.2A patent/GB0515480D0/en not_active Ceased
-
2006
- 2006-07-18 GB GBGB0614202.0A patent/GB0614202D0/en not_active Ceased
- 2006-07-27 GB GB0614880A patent/GB2428885B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0281115A2 (en) * | 1987-03-04 | 1988-09-07 | Kabushiki Kaisha Toshiba | Etching solution for evaluating crystal faults |
KR960013499B1 (en) * | 1988-04-30 | 1996-10-05 | 엘지반도체 주식회사 | Corrosion method for observing vertical structure of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
GB2428885A (en) | 2007-02-07 |
GB0614202D0 (en) | 2006-08-23 |
GB0614880D0 (en) | 2006-09-06 |
GB0515480D0 (en) | 2005-08-31 |
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