GB2413699B - Overvoltage protection device and manufacturing process for the same - Google Patents
Overvoltage protection device and manufacturing process for the sameInfo
- Publication number
- GB2413699B GB2413699B GB0409591A GB0409591A GB2413699B GB 2413699 B GB2413699 B GB 2413699B GB 0409591 A GB0409591 A GB 0409591A GB 0409591 A GB0409591 A GB 0409591A GB 2413699 B GB2413699 B GB 2413699B
- Authority
- GB
- United Kingdom
- Prior art keywords
- same
- manufacturing process
- protection device
- overvoltage protection
- overvoltage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
- H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
- H10D89/711—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
-
- H01L27/0259—
-
- H01L29/0626—
-
- H01L29/0684—
-
- H01L29/87—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/108—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having localised breakdown regions, e.g. built-in avalanching regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/80—PNPN diodes, e.g. Shockley diodes or break-over diodes
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0409591A GB2413699B (en) | 2004-04-29 | 2004-04-29 | Overvoltage protection device and manufacturing process for the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0409591A GB2413699B (en) | 2004-04-29 | 2004-04-29 | Overvoltage protection device and manufacturing process for the same |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0409591D0 GB0409591D0 (en) | 2004-06-02 |
GB2413699A GB2413699A (en) | 2005-11-02 |
GB2413699B true GB2413699B (en) | 2006-02-15 |
Family
ID=32408255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0409591A Expired - Fee Related GB2413699B (en) | 2004-04-29 | 2004-04-29 | Overvoltage protection device and manufacturing process for the same |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2413699B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7755102B2 (en) * | 2006-10-03 | 2010-07-13 | Vishay General Semiconductor Llc | High breakdown voltage diode and method of forming same |
CN111933686B (en) * | 2020-06-29 | 2022-06-24 | 株洲中车时代半导体有限公司 | A power semiconductor device and its manufacturing method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4967256A (en) * | 1988-07-08 | 1990-10-30 | Texas Instruments Incorporated | Overvoltage protector |
US5001537A (en) * | 1987-06-09 | 1991-03-19 | Texas Instruments Incorporated | Semiconductor device for electrical overstress protection |
EP0657933A1 (en) * | 1993-12-13 | 1995-06-14 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe | Integrated structure active clamp for the protection of power semiconductor devices against overvoltages |
US20030168682A1 (en) * | 2000-06-06 | 2003-09-11 | Stephan Mettler | Protection device against electrostatic discharges |
-
2004
- 2004-04-29 GB GB0409591A patent/GB2413699B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5001537A (en) * | 1987-06-09 | 1991-03-19 | Texas Instruments Incorporated | Semiconductor device for electrical overstress protection |
US4967256A (en) * | 1988-07-08 | 1990-10-30 | Texas Instruments Incorporated | Overvoltage protector |
EP0657933A1 (en) * | 1993-12-13 | 1995-06-14 | Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe | Integrated structure active clamp for the protection of power semiconductor devices against overvoltages |
US20030168682A1 (en) * | 2000-06-06 | 2003-09-11 | Stephan Mettler | Protection device against electrostatic discharges |
Also Published As
Publication number | Publication date |
---|---|
GB0409591D0 (en) | 2004-06-02 |
GB2413699A (en) | 2005-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20160429 |