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GB2413699B - Overvoltage protection device and manufacturing process for the same - Google Patents

Overvoltage protection device and manufacturing process for the same

Info

Publication number
GB2413699B
GB2413699B GB0409591A GB0409591A GB2413699B GB 2413699 B GB2413699 B GB 2413699B GB 0409591 A GB0409591 A GB 0409591A GB 0409591 A GB0409591 A GB 0409591A GB 2413699 B GB2413699 B GB 2413699B
Authority
GB
United Kingdom
Prior art keywords
same
manufacturing process
protection device
overvoltage protection
overvoltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0409591A
Other versions
GB0409591D0 (en
GB2413699A (en
Inventor
Ching Chiu Tseng
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Semiconductor Corp
Original Assignee
Lite On Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lite On Semiconductor Corp filed Critical Lite On Semiconductor Corp
Priority to GB0409591A priority Critical patent/GB2413699B/en
Publication of GB0409591D0 publication Critical patent/GB0409591D0/en
Publication of GB2413699A publication Critical patent/GB2413699A/en
Application granted granted Critical
Publication of GB2413699B publication Critical patent/GB2413699B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/711Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using bipolar transistors as protective elements
    • H01L27/0259
    • H01L29/0626
    • H01L29/0684
    • H01L29/87
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/108Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having localised breakdown regions, e.g. built-in avalanching regions 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/80PNPN diodes, e.g. Shockley diodes or break-over diodes
GB0409591A 2004-04-29 2004-04-29 Overvoltage protection device and manufacturing process for the same Expired - Fee Related GB2413699B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0409591A GB2413699B (en) 2004-04-29 2004-04-29 Overvoltage protection device and manufacturing process for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0409591A GB2413699B (en) 2004-04-29 2004-04-29 Overvoltage protection device and manufacturing process for the same

Publications (3)

Publication Number Publication Date
GB0409591D0 GB0409591D0 (en) 2004-06-02
GB2413699A GB2413699A (en) 2005-11-02
GB2413699B true GB2413699B (en) 2006-02-15

Family

ID=32408255

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0409591A Expired - Fee Related GB2413699B (en) 2004-04-29 2004-04-29 Overvoltage protection device and manufacturing process for the same

Country Status (1)

Country Link
GB (1) GB2413699B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7755102B2 (en) * 2006-10-03 2010-07-13 Vishay General Semiconductor Llc High breakdown voltage diode and method of forming same
CN111933686B (en) * 2020-06-29 2022-06-24 株洲中车时代半导体有限公司 A power semiconductor device and its manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4967256A (en) * 1988-07-08 1990-10-30 Texas Instruments Incorporated Overvoltage protector
US5001537A (en) * 1987-06-09 1991-03-19 Texas Instruments Incorporated Semiconductor device for electrical overstress protection
EP0657933A1 (en) * 1993-12-13 1995-06-14 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe Integrated structure active clamp for the protection of power semiconductor devices against overvoltages
US20030168682A1 (en) * 2000-06-06 2003-09-11 Stephan Mettler Protection device against electrostatic discharges

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001537A (en) * 1987-06-09 1991-03-19 Texas Instruments Incorporated Semiconductor device for electrical overstress protection
US4967256A (en) * 1988-07-08 1990-10-30 Texas Instruments Incorporated Overvoltage protector
EP0657933A1 (en) * 1993-12-13 1995-06-14 Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno - CoRiMMe Integrated structure active clamp for the protection of power semiconductor devices against overvoltages
US20030168682A1 (en) * 2000-06-06 2003-09-11 Stephan Mettler Protection device against electrostatic discharges

Also Published As

Publication number Publication date
GB0409591D0 (en) 2004-06-02
GB2413699A (en) 2005-11-02

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160429