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GB2410372B - Semiconductor memory devices and methods for manufacturing the same using sidewall spacers - Google Patents

Semiconductor memory devices and methods for manufacturing the same using sidewall spacers

Info

Publication number
GB2410372B
GB2410372B GB0500290A GB0500290A GB2410372B GB 2410372 B GB2410372 B GB 2410372B GB 0500290 A GB0500290 A GB 0500290A GB 0500290 A GB0500290 A GB 0500290A GB 2410372 B GB2410372 B GB 2410372B
Authority
GB
United Kingdom
Prior art keywords
manufacturing
methods
same
semiconductor memory
memory devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0500290A
Other versions
GB2410372A (en
GB0500290D0 (en
Inventor
Byung-Jun Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2002-0036414A external-priority patent/KR100434506B1/en
Priority claimed from KR10-2002-0037059A external-priority patent/KR100480602B1/en
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority claimed from GB0314707A external-priority patent/GB2392311B/en
Publication of GB0500290D0 publication Critical patent/GB0500290D0/en
Publication of GB2410372A publication Critical patent/GB2410372A/en
Application granted granted Critical
Publication of GB2410372B publication Critical patent/GB2410372B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/31DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells having a storage electrode stacked over the transistor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10Integrated device layouts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/01Manufacture or treatment
    • H10D1/041Manufacture or treatment of capacitors having no potential barriers
    • H10D1/042Manufacture or treatment of capacitors having no potential barriers using deposition processes to form electrode extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/711Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Memories (AREA)
GB0500290A 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers Expired - Fee Related GB2410372B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2002-0036414A KR100434506B1 (en) 2002-06-27 2002-06-27 Semiconductor memory device and method for manufacturing the same
KR10-2002-0037059A KR100480602B1 (en) 2002-06-28 2002-06-28 Semiconductor memory device and method for manufacturing the same
GB0314707A GB2392311B (en) 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers

Publications (3)

Publication Number Publication Date
GB0500290D0 GB0500290D0 (en) 2005-02-16
GB2410372A GB2410372A (en) 2005-07-27
GB2410372B true GB2410372B (en) 2005-11-30

Family

ID=34743278

Family Applications (5)

Application Number Title Priority Date Filing Date
GB0500290A Expired - Fee Related GB2410372B (en) 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers
GB0500295A Expired - Fee Related GB2410376B (en) 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers
GB0500293A Expired - Fee Related GB2410374B (en) 2002-06-27 2003-06-24 Methods for manufacturing semiconductor memory using sidewall spacers
GB0500291A Expired - Fee Related GB2410373B (en) 2002-06-27 2003-06-24 Semi conductor memory devices and methods for manufacturing the same using sidewall spacers
GB0500294A Expired - Fee Related GB2410375B (en) 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers

Family Applications After (4)

Application Number Title Priority Date Filing Date
GB0500295A Expired - Fee Related GB2410376B (en) 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers
GB0500293A Expired - Fee Related GB2410374B (en) 2002-06-27 2003-06-24 Methods for manufacturing semiconductor memory using sidewall spacers
GB0500291A Expired - Fee Related GB2410373B (en) 2002-06-27 2003-06-24 Semi conductor memory devices and methods for manufacturing the same using sidewall spacers
GB0500294A Expired - Fee Related GB2410375B (en) 2002-06-27 2003-06-24 Semiconductor memory devices and methods for manufacturing the same using sidewall spacers

Country Status (1)

Country Link
GB (5) GB2410372B (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025624A (en) * 1998-06-19 2000-02-15 Micron Technology, Inc. Shared length cell for improved capacitance

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5550076A (en) * 1995-09-11 1996-08-27 Vanguard International Semiconductor Corp. Method of manufacture of coaxial capacitor for dram memory cell and cell manufactured thereby
US5856220A (en) * 1996-02-08 1999-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method for fabricating a double wall tub shaped capacitor
US5721154A (en) * 1996-06-18 1998-02-24 Vanguard International Semiconductor Method for fabricating a four fin capacitor structure
GB2321771A (en) * 1996-08-16 1998-08-05 United Microelectronics Corp Stacked capacitor
US6063656A (en) * 1997-04-18 2000-05-16 Micron Technology, Inc. Cell capacitors, memory cells, memory arrays, and method of fabrication
US5854105A (en) * 1997-11-05 1998-12-29 Vanguard International Semiconductor Corporation Method for making dynamic random access memory cells having double-crown stacked capacitors with center posts
US5913119A (en) * 1998-06-26 1999-06-15 Vanguard Int Semiconduct Corp Method of selective growth of a hemispherical grain silicon layer on the outer sides of a crown shaped DRAM capacitor structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6025624A (en) * 1998-06-19 2000-02-15 Micron Technology, Inc. Shared length cell for improved capacitance

Also Published As

Publication number Publication date
GB0500291D0 (en) 2005-02-16
GB0500293D0 (en) 2005-02-16
GB2410373A (en) 2005-07-27
GB2410376B (en) 2005-11-30
GB2410372A (en) 2005-07-27
GB2410375A (en) 2005-07-27
GB0500295D0 (en) 2005-02-16
GB0500294D0 (en) 2005-02-16
GB2410373B (en) 2006-03-22
GB2410375B (en) 2005-11-30
GB2410376A (en) 2005-07-27
GB2410374B (en) 2005-11-30
GB2410374A (en) 2005-07-27
GB0500290D0 (en) 2005-02-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090624