GB2384119B - A printed circuit board - Google Patents

A printed circuit board

Info

Publication number: GB2384119B
Authority: GB; United Kingdom
Prior art keywords: circuit board; printed circuit; printed; board; circuit
Prior art date: 2002-01-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

GB0200509A

Other versions

GB0200509D0 (en

GB2384119A (en

Inventor

Anthony Banks

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

NEC Technologies UK Ltd

Original Assignee

NEC Technologies UK Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-01-10

Filing date

2002-01-10

Publication date

2006-03-01

2002-01-10 Application filed by NEC Technologies UK Ltd filed Critical NEC Technologies UK Ltd

2002-01-10 Priority to GB0200509A priority Critical patent/GB2384119B/en

2002-02-27 Publication of GB0200509D0 publication Critical patent/GB0200509D0/en

2003-07-16 Publication of GB2384119A publication Critical patent/GB2384119A/en

2006-03-01 Application granted granted Critical

2006-03-01 Publication of GB2384119B publication Critical patent/GB2384119B/en

2022-01-10 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electric Connection Of Electric Components To Printed Circuits (AREA)

GB0200509A 2002-01-10 2002-01-10 A printed circuit board Expired - Fee Related GB2384119B (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
GB0200509A GB2384119B (en)	2002-01-10	2002-01-10	A printed circuit board

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB0200509A GB2384119B (en)	2002-01-10	2002-01-10	A printed circuit board

Publications (3)

Publication Number	Publication Date
GB0200509D0 GB0200509D0 (en)	2002-02-27
GB2384119A GB2384119A (en)	2003-07-16
GB2384119B true GB2384119B (en)	2006-03-01

Family

ID=9928870

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB0200509A Expired - Fee Related GB2384119B (en)	2002-01-10	2002-01-10	A printed circuit board

Country Status (1)

Country	Link
GB (1)	GB2384119B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN108419378B (en) *	2018-05-09	2019-12-20	深圳市百柔新材料技术有限公司	Method for manufacturing protective layer of printed circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09331154A (en) *	1996-06-11	1997-12-22	Nec Corp	Photo viahole and forming method thereof
JP2000151111A (en) *	1998-08-31	2000-05-30	Toppan Printing Co Ltd	Substrate for semiconductor device
EP1026928A2 (en) *	1999-02-08	2000-08-09	Ford Motor Company	Bond pads for fine-pitch applications on air bridge circuit boards
US6218630B1 (en) *	1997-06-30	2001-04-17	Fuji Photo Film Co., Ltd.	Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
JP2002064274A (en) *	2000-08-21	2002-02-28	Toppan Printing Co Ltd	Via hole structure, forming method therefor and multilayer wiring board using the same

2002
- 2002-01-10 GB GB0200509A patent/GB2384119B/en not_active Expired - Fee Related

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH09331154A (en) *	1996-06-11	1997-12-22	Nec Corp	Photo viahole and forming method thereof
US6218630B1 (en) *	1997-06-30	2001-04-17	Fuji Photo Film Co., Ltd.	Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch
JP2000151111A (en) *	1998-08-31	2000-05-30	Toppan Printing Co Ltd	Substrate for semiconductor device
EP1026928A2 (en) *	1999-02-08	2000-08-09	Ford Motor Company	Bond pads for fine-pitch applications on air bridge circuit boards
JP2002064274A (en) *	2000-08-21	2002-02-28	Toppan Printing Co Ltd	Via hole structure, forming method therefor and multilayer wiring board using the same

Also Published As

Publication number	Publication date
GB0200509D0 (en)	2002-02-27
GB2384119A (en)	2003-07-16

Publication	Publication Date	Title
HK1054462A1 (en)	2003-11-28	Flexible printed circuit board
HK1083000A1 (en)	2006-06-23	Screening device for electronic subsassemblies on a printed circuit board
HK1058741A1 (en)	2004-05-28	Flexible printed wiring board
GB2363257B (en)	2002-05-22	Printed circuit board
GB0403017D0 (en)	2004-03-17	HF multilayer printed circuit board
AU2003272831A8 (en)	2004-05-04	Circuit board threadplate
IL151278A0 (en)	2003-04-10	Printed circuit board assembly
AU2003275432A8 (en)	2004-05-04	Circuit board standoff
GB2404089B (en)	2007-05-02	Printed circuit board assembly
AU2003256978A8 (en)	2004-02-16	Printed circuit board assembly having a bga connection
TW545847U (en)	2003-08-01	Separated circuit board
GB2404788B (en)	2006-08-23	Printed circuit board for a mobile device
EP1641329A4 (en)	2010-01-20	Printed wiring board
AU2003249888A1 (en)	2004-01-23	Component for assembling a printed circuit board
IL148041A0 (en)	2002-09-12	Printed circuit board arrangement
GB2394365B (en)	2005-08-17	Circuit board constructions
GB0010730D0 (en)	2000-06-28	Printed circuit boards
AU2003210179A1 (en)	2003-09-02	Printed circuit board comprising a component
GB2384119B (en)	2006-03-01	A printed circuit board
FR2840503B3 (en)	2004-04-30	PRINTED CIRCUIT BOARD
GB0225666D0 (en)	2002-12-11	Printed circuit board
GB0014635D0 (en)	2000-08-09	Printed circuit board
TW572379U (en)	2004-01-11	Four-band printed circuit board antenna
GB9900548D0 (en)	1999-03-03	A printed circuit board
GB2397179B (en)	2004-10-27	Stator structure having a printed board

Legal Events

Date	Code	Title	Description
2005-09-28	732E	Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
2008-09-24	PCNP	Patent ceased through non-payment of renewal fee	Effective date: 20080110